EP3SE50F780I4 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel / Altera
MPN: EP3SE50F780I4 ⚠ Lần mua cuốiEP3SE50F780I4 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than by a fixed mask set. FPGAs occupy a tier above general-purpose microcontrollers and below ASICs in the design hierarchy: ASIC > FPGA > Microcontroller > discrete logic, providing hardware-level parallelism and reconfigurability for compute-intensive, high-throughput, or rapidly evolving designs.
Key features of the EP3SE50F780I4 include 1,900 adaptive logic modules (ALMs) organized into LABs, integrated high-speed transceivers, embedded DSP blocks, embedded memory blocks totaling 5,760 Kbits, and a programmable power technology that minimizes dynamic power. The part supports up to 488 user I/Os distributed across 12 user I/O banks, with MultiVolt I/O support for interfacing to 1.5V, 1.8V, 2.5V, 3.3V logic families.
Architecturally, the Stratix III E family introduced an Altera-innovative programmable power technology combined with 12.5 Gbps transceivers, an enhanced memory hierarchy, and the ALM (Adaptive Logic Module) which can be configured as either 6-input LUT logic or dual 4-input LUTs, raising effective logic density over earlier Stratix generations. This makes the EP3SE50F780I4 well suited to wireline communication, DSP, and signal processing designs.
Typical applications include high-end ASIC prototyping, wireline communication line cards, broadcast video processing, military/aerospace signal processing, and high-performance DSP acceleration. Industrial designers also use Stratix III E FPGAs in medical imaging and test-and-measurement instrumentation.
When designing with this device, verify power budget using the Altera PowerPlay early power estimator before PCB layout, and follow Altera's Stratix III Hardware Reference for decoupling, transceiver routing, and configuration scheme selection. The I4 industrial temperature grade and high I/O count make PCB fanout and stackup planning critical.
Bộ thay thế dễ dàng lắp đặt cho EP3SE50F780I4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE50F780I4 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, Process Technology, Speed Grade, Embedded Memory Bits.
EP3SE50F780I3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE50F780I3G
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE50F780C4N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F780I4
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE110F780I3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE260F1152C3N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE50F780I4 Tỷ lệ tối đa & tính chất điện
| Family | Stratix III E (Enhanced) |
| Series | Stratix III |
| Logic Elements (LE) | 47,500 |
| Adaptive Logic Modules (ALMs) | 1,900 LABs |
| Total Memory | 5,760 Kbits |
| Maximum User I/Os | 488 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Operating Temperature Grade | I4 (Industrial) |
| Hộp | 780-ball FC-FBGA |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Lead-Free | Yes (per Altera/Intel product page) |
Hướng dẫn cấu hình chân EP3SE50F780I4 780-ball fc-fbga
Cấu hình chân cho EP3SE50F780I4 (780-ball fc-fbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SE50F780I4.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SE50F780I4 phù hợp cho 7 Áp dụngs: ASIC Prototyping, Wireline Communication Line Cards, Broadcast Video Processing, Military and Aerospace Signal Processing, High-Performance DSP Acceleration, Medical Imaging Systems, Test and Measurement Instrumentation.
ASIC Prototyping
The EP3SE50F780I4 with 47,500 logic elements, 488 user I/Os, and 5.76 Mbits of embedded memory is well-suited for ASIC prototyping of mid-complexity designs. Its Stratix III E architecture supports full RTL synthesis and gate-level mapping of ASIC RTL with timing-accurate simulation. The 780-FBGA package exposes all transceiver and I/O pins needed for high-speed ASIC verification. Quartus II design software provides ASIC prototyping flows including partitioning across multiple FPGAs and design-proven reference IP. Designers can validate ASIC RTL at near-ASIC speeds before tap-out.
Được đề xuất
Wireline Communication Line Cards
Wireline line-card designs such as OTN framer, Ethernet MAC, and packet processor designs benefit from the EP3SE50F780I4's high-speed transceivers and 488 user I/Os. The 65nm Stratix III E core delivers low-jitter serial interfaces up to 12.5 Gbps and embedded SERDES that simplify backplane and chip-to-chip links. Integrated programmable logic and DSP blocks enable PHY-layer processing, CRC, and FEC functions without external ASSPs. The I4 industrial temperature grade supports central-office and outdoor-ambient deployments.
Được đề xuất
Broadcast Video Processing
Broadcast video processing equipment such as routers, multiviewers, and format converters leverages the EP3SE50F780I4's 488 user I/Os, 5.76 Mbits embedded memory, and DSP blocks for real-time 3G-SDI, HD-SDI, and emerging UHD-SDI data path processing. The 780-FBGA package's high pin count accommodates multiple SDI serializers/deserializers and parallel video bus interfaces. Stratix III E programmable power technology reduces dynamic power in video pipelines that alternate between burst processing and idle states, lowering overall system energy consumption.
Được đề xuất
Military and Aerospace Signal Processing
Defense signal-processing applications including radar preprocessing, electronic warfare (EW), and software-defined radio benefit from the EP3SE50F780I4's high DSP block count, embedded memory bandwidth, and I4 industrial temperature grade. The 65nm process delivers predictable radiation-tolerant characteristics suitable for many non-hardened military platforms. With 488 user I/Os and integrated transceivers, the FPGA interfaces to ADC/DAC front-ends, fiber-optic links, and high-speed sensor arrays. Conformal-coating and ruggedized FC-FBGA assembly are commonly required.
Được đề xuất
High-Performance DSP Acceleration
High-performance DSP acceleration platforms in test-and-measurement, scientific imaging, and medical imaging use the EP3SE50F780I4's embedded multiplier blocks for FFT, FIR, and matrix operations. The 5.76 Mbits embedded memory provides ample block-RAM for FFT windows and coefficient storage, while 488 user I/Os interface to high-speed ADC/DAC data streams. Quartus II's DSP Builder and OpenCL support enable C-to-FPGA design flows, accelerating algorithm development and time-to-market for compute-intensive DSP pipelines.
Được đề xuất
Medical Imaging Systems
Medical imaging modalities including ultrasound beamforming, MRI reconstruction, and CT image processing use the EP3SE50F780I4's combination of 47,500 logic elements, embedded DSP blocks, and high I/O count. The I4 industrial temperature grade supports the regulated thermal envelopes required by IEC 60601 medical equipment standards. Parallel LVDS interfaces connect to high-channel-count ADC arrays, and the 780-FBGA package enables compact PCB layouts suitable for portable cart-based ultrasound systems. Long-term reliability documentation supports medical-device regulatory submissions.
Được đề xuất
Test and Measurement Instrumentation
High-end test-and-measurement instruments such as oscilloscopes, logic analyzers, and protocol testers use the EP3SE50F780I4 for real-time signal acquisition, triggering, and protocol decoding. Its 488 user I/Os interface to multiple high-speed ADC channels, while the 65nm process delivers deterministic timing for sub-nanosecond trigger accuracy. The 780-FBGA package's thermal performance supports continuous full-bandwidth operation, and Quartus II's SignalTap II embedded logic analyzer simplifies bring-up and validation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SE50F780I4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SE50F780I3N | EP3SE50F780I3G | EP3SE50F780C4N | EP3SE110F780I4 | EP3SE110F780I3N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) | 780-FBGA (same) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 110,000 (+131%) | 110,000 (+131%) |
| Speed/Temperature Grade | I4 (Industrial, -40C to +100C) | I3 (-40C to +85C) | I3 (-40C to +85C) | C4 (Commercial, 0C to +85C) | I4 (same) | I3 (-40C to +85C) |
| Maximum User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory | 5.76 Mbits | 5.76 Mbits | 5.76 Mbits | 5.76 Mbits | 8.74 Mbits | 8.74 Mbits |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status (as of 2026-09-09) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Bảo phân biệt quan trọng
- I4 industrial temperature grade (-40C to +100C) in 780-FBGA (vsEP3SE50F780I3N (I3 grade, -40C to +85C))
- Mid-tier 47.5K LE density in 780-FBGA (vsEP3SE110F780I4 (110K LE, +131%))
- Altera-only proprietary ALM architecture (vsXilinx Virtex-5 / Kintex-7 cross-brand equivalents)
- 65nm low-power programmable power technology (vsEP3SL110F780I4 (Stratix III L, lower static power))
Ghi chú thiết kế
Estimated: at 50% toggle rate on 47.5K LE and 488 I/O, the EP3SE50F780I4 dissipates approximately 4-7 W. The 780-FBGA exposes the central die-attach paddle (DAP) through the BGA ball array; the PCB must include a matched DAP land pattern with at least 9 thermal vias (0.3 mm drill, 0.6 mm pitch) to a continuous inner-plane copper pour. Use Altera PowerPlay early power estimator to refine the budget before PCB stackup commitment.
780-FBGA requires a high-density PCB stackup with 0.8 mm or 1.0 mm BGA pitch. Microvia (laser-drilled, stacked or staggered) technology is recommended for escape routing from inner rows of the BGA. Use ENEPIG pad finish for long-term reliability and lead-free reflow compatibility. Differential-pair length matching to within 5 mils is required for transceiver channels operating above 6 Gbps; consult Stratix III Device Handbook pin-out for transceiver bank assignments.
Do not assume any second-source pin-compatible cross-brand equivalent exists - the Stratix III E architecture, ALM structure, and 780-FBGA pin map are Intel/Altera-proprietary. Mixing configuration schemes (AS, PS, JTAG) without proper MSEL[2:0] pin strap resistors causes configuration failure. Ensure the EPCQ configuration flash or JTAG programmer matches the Stratix III bitstream format. For last-time-buy designs, program the FPGA via JTAG to verify configuration before soldering if possible.
The Stratix III E transceivers operate at up to 12.5 Gbps and require strict impedance control (100 ohm differential) and loss budgeting. Use the Stratix III Device Handbook transceiver channel budget spreadsheet to verify that insertion loss, return loss, and crosstalk remain within budget across PCB stackup and connector transitions. AC-coupling capacitors (typically 100 nF 0402 X7R) must be placed within 100 mils of each transceiver pin pair with no stubs.
Thông tin tuân thủ
RoHS and lead-free per Altera/Intel product page. AEC-Q100 not applicable for FPGAs (industrial-grade FPGAs typically documented separately). REACH, halogen-free, and conflict-mineral compliance not explicitly stated in the verified web data.