EPF6024ABI256-2 - FLEX 6000 FPGA 24K Gates 256-BGA | Altera
MPN: EPF6024ABI256-2 ✗ Cuối đờiEPF6024ABI256-2 Tóm tắt
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor IC composed of configurable logic blocks (LBs), programmable interconnect, and programmable I/O cells. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at volume) and CPLDs (smaller, non-volatile) in the programmable-logic hierarchy. Within that hierarchy, the FLEX 6000 family is Altera's register-rich, look-up-table (LUT) based, SRAM-volatile low-cost family: each logic element combines a 4-input LUT with a register, and configuration data is loaded from an external EPROM or microcontroller at every power-up.
Key features include a register-rich LUT-based architecture with 1,960 logic elements arranged in 196 LABs, integrated OptiFLEX interconnect, multiVolt I/O supporting 5.0V, 3.3V and 2.5V interfaces, and in-system programmability through the IEEE 1149.1 (JTAG) boundary-scan interface. The part is offered in a -2 speed grade with a typical internal operating frequency of 166.67 MHz.
Typical applications include glue-logic replacement, interface bridging (5V-to-3.3V level translation, parallel-to-serial conversion), industrial control boards, telecom line cards, and prototyping platforms where design changes must be made quickly without respinning a mask set.
When designing with the EPF6024ABI256-2, allocate one dedicated configuration device (EPC2 or compatible) on the board because the SRAM cells lose configuration on power-down. Place 0.1 uF decoupling capacitors within 5 mm of every VCC/VCCIO pin, and follow Altera's AN 74 guidelines for multiVolt I/O bank placement to avoid contention between 5V and 3.3V peripherals.
Bộ thay thế dễ dàng lắp đặt cho EPF6024ABI256-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF6024ABI256-2 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Mounting Type, Internal Frequency (max).
EPF6024ABC256-3
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Xem tài liệu →EPF6024ABC256-2N
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Xem tài liệu →EPF6024ABC256-1
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Xem tài liệu →EPF6024ABI256-2 Tỷ lệ tối đa & tính chất điện
| Family | FLEX 6000 |
| Logic Elements / Cells | 1,960 |
| Number of LABs / CLBs | 196 |
| Total Gates | 24,000 |
| Number of User I/O | 218 |
| Number of Logic Array Blocks | 196 LABs |
| Number of Registers (typical) | 1,960 |
| Operating Frequency (max) | 166.67 MHz |
| Process Technology | 0.42 um CMOS, SRAM-based |
| Core Supply Voltage | 3.3 V |
| I/O Supply Voltage (multiVolt) | 5.0 V / 3.3 V / 2.5 V |
| Package Type | 256-ball BGA (27 x 27 mm) |
| Kiểu lắp đặt | Surface Mount (SMT) |
| Khoảng nhiệt độ hoạt động | -40 C to +100 C (TJ) |
| Configuration Method | SRAM (external EPC2/EPCx serial PROM, JTAG) |
| Speed Grade | -2 |
| Status | Obsolete (EOL) |
Hướng dẫn cấu hình chân EPF6024ABI256-2 256-ball bga (27 x 27 mm)
Cấu hình chân cho EPF6024ABI256-2 (256-ball bga (27 x 27 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EPF6024ABI256-2.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EPF6024ABI256-2 phù hợp cho 7 Áp dụngs: 5 V to 3.3 V Level Translation / Interface Bridging, Industrial Control Glue Logic, Telecom Line Card Interface Logic, Rapid Prototyping Platform / Design Iteration, Legacy Medical Equipment Repair, Aerospace Avionics Databus Interface, Test and Measurement Front-End.
5 V to 3.3 V Level Translation / Interface Bridging
The EPF6024ABI256-2's multiVolt I/O bank architecture makes it ideal for bridging 5 V legacy peripherals (e.g. parallel ADCs, optocouplers, industrial bus drivers) to 3.3 V processors on the same board. With 218 user I/Os grouped into independently-powered VCCIO banks, the designer can dedicate one bank to 5 V inputs and another to 3.3 V outputs without external level shifters. Its 24K-gate capacity is enough for a full 16-bit parallel bus with handshaking glue-logic. The 166.67 MHz internal frequency easily meets typical 33 MHz PCI or 50 MHz local-bus rates. Pin-compatible drop-in to the EPF6024ABC256-3 also lets a designer upgrade Fmax without re-spinning the PCB.
Được đề xuất
Industrial Control Glue Logic
In industrial PLC and motor-control boards the EPF6024ABI256-2 replaces dozens of 74-series TTL gates with a single programmable device that can be re-engineered via JTAG during commissioning. The 196 LABs and 1,960 logic elements comfortably absorb state machines for PWM generation, encoder quadrature decoding, and Modbus RTU framing. Industrial temperature rating (-40 C to +100 C TJ) and 5 V tolerance on the I/O bank allow direct interfacing with legacy opto-isolated I/O. The 256-BGA package provides enough I/O for multi-axis control while keeping the PCB footprint compact. Verified Web Data confirms the part is still sourced through authorized EOL distributors for industrial lifecycle extension.
Được đề xuất
Telecom Line Card Interface Logic
The EPF6024ABI256-2 is well suited to telecom line-card glue logic where it implements bus arbitration, framing, and alarm-handling between T1/E1 framers and the backplane. Its 218 I/Os support the typical 32-channel HDLC concentration plus LED status, while the 24K-gate fabric holds the timing-recovery glue and BIST logic. multiVolt I/O banks simplify connection to 5 V framer ICs and 3.3 V backplane transceivers on the same die. The 0.42 um CMOS process is mature and well characterized for the long-lifecycle telecom market. The EPF10K30EFC256-3 is a popular migration path when more gates are needed in the same 256-BGA footprint.
Được đề xuất
Rapid Prototyping Platform / Design Iteration
Because the EPF6024ABI256-2 is reprogrammable in-circuit via JTAG, it is ideal for university labs and prototype development where design changes are daily events. Engineers can iterate HDL designs in minutes using Altera Quartus II and download the bitstream through a USB-Blaster cable. The 256-BGA development board exposes all 218 I/Os on 0.1 inch headers for breadboard-friendly evaluation. 24K gates is large enough to host a soft 8051 core plus peripheral logic for embedded prototypes. The EPF6016AQC208-3N offers a smaller-footprint option when the prototype migrates to a PQFP-208 PCB.
Được đề xuất
Legacy Medical Equipment Repair
The EPF6024ABI256-2 was widely designed into ultrasound and patient-monitoring systems in the late 1990s and is still required for board-level repair of those long-life-cycle medical devices. Its pin-compatible drop-in to the EPF6024ABC256-3 lets service depots upgrade speed without firmware changes. Authorized distributors (Rochester Electronics) carry long-term factory-sealed stock specifically for medical and aerospace EOL support. The 5 V tolerance is critical because many medical front-ends still use 5 V analog signal chains. The EPF6010ATC144-3 is a smaller-density option for sub-system repair where the full 24K-gate device is not needed.
Được đề xuất
Aerospace Avionics Databus Interface
The EPF6024ABI256-2 is used in older avionics boxes for ARINC 429 and MIL-STD-1553 databus interface logic, where its register-rich architecture handles the bit-timing and protocol stack efficiently. The 256-BGA package withstands the vibration profile of avionics environments better than fine-pitch QFPs. Industrial temperature grade covers the -40 C to +85 C cockpit range. Its obsolete / EOL status is mitigated by Rochester Electronics' long-term support program for aerospace customers. The EPF10K50VFC484-3 is a higher-density migration path when additional protocol channels are needed on the same board.
Được đề xuất
Test and Measurement Front-End
In bench-top oscilloscopes and logic analyzers the EPF6024ABI256-2 acts as a programmable trigger and pattern-generator engine. Its 218 I/Os accept probe pods directly, while 1,960 logic elements hold the trigger sequencer, pattern comparator, and display multiplexer. multiVolt I/O allows connection to both 5 V and 3.3 V probe channels on the same device, eliminating external level shifters. The -2 speed grade easily handles 200 MHz trigger rates. Its SRAM-based configuration lets the factory upgrade trigger firmware over JTAG without opening the instrument case.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPF6024ABI256-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPF6024ABC256-3 | EPF6024ABC256-2N | EPF6024ABC256-1 |
|---|---|---|---|---|
| Package | 256-BGA (27x27 mm) | 256-BGA (27x27 mm) - same | 256-BGA (27x27 mm) - same | 256-BGA (27x27 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1,960 | 1,960 (same) | 1,960 (same) | 1,960 (same) |
| Total Gates | 24,000 | 24,000 | 24,000 | 24,000 |
| User I/O | 218 | 218 | 218 | 218 |
| Speed Grade | -2 (166.67 MHz) | -3 (~180 MHz) | -2 (166.67 MHz) | -1 (~150 MHz) |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS | 0.42 um CMOS |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Bảo phân biệt quan trọng
- Same-die upgrade to faster speed grade (vsEPF6024ABC256-3)
- Identical silicon in lead-free reflow option (vsEPF6024ABC256-2N)
- Lower-cost alternative for non-critical timing paths (vsEPF6024ABC256-1)
Ghi chú thiết kế
The EPF6024ABI256-2 requires two supplies: 3.3 V on VCCINT (core) and a per-bank VCCIO that can be 5.0 V, 3.3 V, or 2.5 V depending on the I/O bank. Decouple every VCC/VCCIO pin with a 0.1 uF X7R ceramic placed within 5 mm of the BGA ball, plus a single 10 uF tantalum bulk capacitor near the device. According to Altera AN 74, all VCC pins must be connected even if a particular bank is unused, to maintain I/O buffer performance and prevent latch-up.
The 256-BGA at 27 x 27 mm uses 1.27 mm ball pitch; the PCB must use laser-drilled micro-via stack-ups (e.g. 4-layer 1+2+1 or 6-layer 2+2+2) for fan-out. Match the BGA pad diameter to the manufacturer's recommendation (typically 0.6 mm solder mask defined). Place configuration-promom signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) on the same PCB layer with no via stubs to avoid JTAG programming failures.
The FLEX 6000 SRAM cells lose configuration at every power-down - a common pitfall is forgetting the external EPC2 or EPC4 configuration PROM. The 'NCONFIG' pin must be held low during power-up ramp and then released; otherwise the device may enter an undefined state. Also note that the JTAG chain order matters: TDO of the FPGA should feed the next device in the chain to allow in-system programming of the configuration PROM through the same JTAG header.
For high-speed (>100 MHz) I/O, route signals on the top PCB layer over a continuous ground plane and use 50 ohm controlled impedance traces. The multiVolt I/O banks can drive 5 V TTL inputs directly, but 5 V outputs above VCCIO + 0.4 V require an external resistor divider - exceeding this can permanently damage the I/O cell. Refer to Altera's Configuration Handbook for the multiVolt I/O interface guidelines.
Thông tin tuân thủ
The EPF6024ABI256-2 was originally released before RoHS took effect; compliance varies by lot and date code. Verify RoHS and lead-free status with the distributor at the time of purchase. AEC-Q100 is not applicable because this is an industrial/commercial FPGA, not an automotive-grade part.
