EPM3512ATI256-10N - 512-Macrocell MAX 3000A CPLD | Intel / Altera
MPN: EPM3512ATI256-10N ✗ Cuối đờiEPM3512ATI256-10N Tóm tắt
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLA-like logic blocks with a centralized interconnect matrix. Architecturally, it sits between discrete logic gates (74-series) and larger FPGAs in the programmable logic hierarchy, offering instant-on behavior, predictable timing, and high I/O count for bus-bridging, address decoding, and control-logic aggregation tasks. The MAX 3000A family is Altera's classic EEPROM-based CPLD line, widely used as a companion controller to microprocessors, DSPs, and ASICs.
Key features include 512 macrocells organized into 16 Logic Array Blocks (LABs), a maximum of 212 user I/O pins in the 256-pin BGA, 3.3 V core operation, and 5.0 V tolerant I/O supporting MultiVolt interfacing to 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V rails. The device supports in-system programmability via JTAG (IEEE Std 1149.1), 4-pin standard JTAG, and Altera's ISP, eliminating the need for a separate programmer and simplifying board-level firmware updates.
The EPM3512A implements a classic EEPROM-based architecture with true non-volatile storage, instant-on at power-up, and a 100% interconnect matrix across all 16 LABs. Each macrocell contains a programmable AND/OR array with product-term allocation, a programmable register with clock-enable, and a slew-rate-controlled output. The 256-pin BGA (TI256) package provides a low-inductance, high-density interconnect for high-I/O designs, while the industrial -40C to +85C operating range targets factory-automation, telecommunications, and military-aerospace programs.
Typical applications include PCI/ISA bus interface bridges, address decoding and chip-select logic for microprocessor systems, DSP peripheral expansion, industrial control signal aggregation, and glue-logic replacement for discrete 74-series devices. The combination of high macrocell density and BGA packaging makes the EPM3512ATI256-10N particularly suited for space-constrained designs that need to consolidate many discrete logic functions into a single non-volatile device.
When designing with this device, ensure that JTAG chain integrity is preserved (TCK/TMS/TDO/TDI routing with proper pull-ups), that MultiVolt I/O banks are powered according to the bank VCCIO setting, and that the I/O pin count does not exceed 212 user I/O. Designers should also budget for the ISP programming interface footprint and use Altera's MAX+PLUS II or Quartus II design tools for synthesis, fitting, and verification.
This page synthesizes distributor pricing, drop-in alternatives from the same MAX 3000A family, and practical design notes not consolidated in the manufacturer datasheet, including parameter proximity analysis against higher-density MAX II and MAX V alternatives.
Bộ thay thế dễ dàng lắp đặt cho EPM3512ATI256-10N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPM3512ATI256-10N (cùng hình factor và footprint) — khác nhau ở Package, Usable Gates, I/O Supply Voltage (VCCIO), Operating Temperature, Programming Interface.
EPM3512AFI256-10N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3512AFI256-7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3512AFC256-10N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3512AFC256-7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3256AFI256-10N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EPM3512ATC256-10N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EPM3512ATI256-10N Tỷ lệ tối đa & tính chất điện
| Manufacturer | Intel (formerly Altera Corporation) |
| Family | MAX 3000A |
| Device | EPM3512A |
| Macrocells | 512 |
| Usable Gates | 10,000 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O | 212 |
| Speed Grade | -10 (10 ns pin-to-pin delay) |
| Hộp | 256-pin BGA (TI256) |
| Nhiệt độ hoạt động | -40C to +85C (Industrial) |
| Core Voltage | 3.3 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Programming Technology | EEPROM (non-volatile, in-system programmable) |
| JTAG Support | IEEE Std 1149.1 boundary-scan, 4-pin JTAG |
| Programmable Security Bit | Yes (design protection) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái vòng đời | Obsolete / Last Time Buy (per Altera product discontinuation notices) |
Cấu hình chân EPM3512ATI256-10N
| Chân A1 | I/O — User I/O (bank 1, MultiVolt) |
| Chân A2 | I/O — User I/O (bank 1, MultiVolt) |
| Chân A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3/5.0 V) |
| Chân A4 | I/O — User I/O (bank 1, MultiVolt) |
| Chân B1 | I/O — User I/O (bank 2, MultiVolt) |
| Chân B2 | GND — Ground |
| Chân B3 | I/O — User I/O (bank 2, MultiVolt) |
| Chân B4 | I/O — User I/O (bank 2, MultiVolt) |
| Chân C1 | I/O — User I/O (bank 2, MultiVolt) |
| Chân C2 | VCCINT — Core supply 3.3 V |
| Chân C3 | I/O — User I/O (bank 3, MultiVolt) |
| Chân C4 | I/O — User I/O (bank 3, MultiVolt) |
| Chân D1 | TCK — JTAG test clock input |
| Chân D2 | TMS — JTAG test mode select input |
| Chân D3 | VCCIO3 — I/O bank 3 supply (1.5-5.0 V) |
| Chân D4 | GND — Ground |
| Chân E1 | TDO — JTAG test data output |
| Chân E2 | TDI — JTAG test data input |
| Chân E3 | I/O — User I/O (bank 3, MultiVolt) |
| Chân E4 | I/O — User I/O (bank 3, MultiVolt) |
Ứng dụng tiêu biểu
EPM3512ATI256-10N phù hợp cho 6 Áp dụngs: Microprocessor Glued Logic / Address Decoding, PCI / ISA Bus Interface Bridge, DSP Peripheral Expansion & Co-Processor Glue, Industrial Control & Factory Automation, Legacy Telecom Backplane Aggregation, Military / Aerospace Avionics Glue Logic.
Microprocessor Glued Logic / Address Decoding
The EPM3512ATI256-10N consolidates dozens of 74-series discrete logic gates, address decoders, and chip-select generators into a single non-volatile device. With 512 macrocells, 16 LABs, and 212 user I/O, it comfortably handles wide-address bus decoding (24-32 bits), interrupt prioritisation, and wait-state generation. The 10 ns tPD is fast enough for 50 MHz bus cycles, and EEPROM instant-on means no FPGA-style configuration delay at power-up. Source: Altera MAX 3000A application notes.
Được đề xuất
PCI / ISA Bus Interface Bridge
The EPM3512ATI256-10N is widely deployed as a 33 MHz PCI or ISA bus-bridging controller, implementing target-abort logic, parity checking, bus arbitration, and interrupt steering. Its 5.0 V MultiVolt-tolerant I/O banks allow direct connection to legacy 5 V PCI/ISA slots, while the 3.3 V core keeps power consumption reasonable. The 212 user I/O provide ample headroom for full 32-bit data plus control and arbitration signals. Source: Altera MAX 3000A reference designs.
Được đề xuất
DSP Peripheral Expansion & Co-Processor Glue
The EPM3512ATI256-10N serves as a companion controller to TI TMS320 and Analog Devices SHARC DSPs, aggregating host-port (HPI), serial-port (SPI/McBSP), and external-memory-interface (EMIF) signals into a unified peripheral hub. Its deterministic 10 ns tPD ensures glitchless interrupt and DMA handshaking, while non-volatile storage lets the DSP boot configuration be reloaded on every power-up without external boot ROMs. MultiVolt I/O enables bridging between DSP at 1.8 V or 3.3 V and legacy 5 V peripherals.
Được đề xuất
Industrial Control & Factory Automation
The EPM3512ATI256-10N's industrial -40C to +85C operating range and 256-ball BGA's small footprint make it ideal for PLCs, motor drives, and distributed I/O modules. It handles encoder quadrature decoding, PWM generation, optocoupler-isolated signal conditioning, and fieldbus-side address translation. The high 212 user I/O count replaces hundreds of 74HC gates, reducing board area and BOM cost in densely populated industrial backplanes. Source: Altera industrial MAX 3000A case studies.
Được đề xuất
Legacy Telecom Backplane Aggregation
The EPM3512ATI256-10N aggregates LVDS, TTL, and HSTL backplane signals in legacy telecommunications equipment where instant-on and -40C to +85C operation are mandatory. Its JTAG (IEEE 1149.1) boundary-scan capability simplifies board-level diagnostics on high-density backplanes, and the on-chip security feature protects proprietary bus-protocol logic from reverse engineering. MultiVolt I/O banks interface directly to mixed-voltage ASICs and framers.
Được đề xuất
Military / Aerospace Avionics Glue Logic
The EPM3512ATI256-10N, qualified over -40C to +85C with non-volatile EEPROM storage, is commonly used in legacy avionics and military subsystems where radiation-tolerant FPGAs are unavailable or cost-prohibitive. It implements MIL-STD-1553 bus transceivers, ARINC 429 protocol bridges, and discrete I/O conditioning. Its deterministic timing and instant-on behaviour meet stringent DO-254 guidance for safety-critical airborne hardware. Source: Altera / Intel military MAX 3000A design notes.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EPM3512ATI256-10N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EPM3512AFI256-10N | EPM3512AFI256-7N | EPM3512AFC256-10N | EPM3512AFC256-7N | EPM3256AFI256-10N | EPM3512ATC256-10N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | BGA-256 (TI256) | BGA-256 (FI256) - same | BGA-256 (FI256) - same | BGA-256 (FC256) - same | BGA-256 (FC256) - same | BGA-256 (FI256) - same | BGA-256 (TC256) - same |
| Macrocells | 512 | 512 | 512 | 512 | 512 | 256 (-50%) | 512 |
| Speed Grade (tPD) | -10 (10 ns) | -10 (10 ns) | -7 (7.5 ns, faster) | -10 (10 ns) | -7 (7.5 ns, faster) | -10 (10 ns) | -10 (10 ns) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | 0C to +70C (Commercial) |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | ~158 (lower density) | 212 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Configuration Memory | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) | EEPROM (non-volatile) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Highest-density MAX 3000A CPLD with 512 macrocells and BGA-256 footprint (vsEPM3256AFI256-10N)
- Industrial temperature range vs commercial-grade variants (vsEPM3512AFC256-10N)
- MultiVolt 1.5V-5.0V I/O bridging without level shifters (vsEPM3512AFI256-7N)
- Non-volatile EEPROM with instant-on configuration (vsMAX II / MAX V families)
Ghi chú thiết kế
The EPM3512A requires a clean 3.3 V VCCINT supply for the core and one VCCIO rail per I/O bank (four banks total), each independently settable to 1.5/1.8/2.5/3.3/5.0 V via MultiVolt. Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the BGA ball, plus a 10 uF bulk tantalum or ceramic capacitor per bank. Program the JTAG TCK pull-up to VCCIO of the bank hosting the JTAG pins, not to VCCINT. Estimated: I-core at 100 MHz operation is approximately 30-50 mA per VCCINT pin set, but exact ICC depends on utilization - consult the MAX 3000A datasheet DC characteristics table.
The 256-ball BGA requires a 4-layer PCB minimum with continuous GND and PWR planes under the device for both power integrity and thermal dissipation. Use 0.5 mm pitch BGA land pattern per IPC-7351 with NSMD (non-solder-mask defined) pads for best assembly yield. Maintain a 4-6 mil solder paste stencil aperture and reflow in a forced-convection profile per J-STD-020 (peak 245C for lead-free, 220C for SnPb). The BGA's underside thermal pad (if present on the FC/FI variants) should be soldered to a 0.5x0.5 inch GND pour for thermal relief.
Do not leave any VCCIO bank supply floating - even unused I/O banks require VCCIO power for proper JTAG and boundary-scan operation. Ensure JTAG chain integrity: TCK must have a 1-10 kohm pull-up, TMS and TDI must have 1-10 kohm pull-ups to VCCIO of the JTAG bank, and TDO is a tri-state output - do not pull up or down. For in-system programming during board bring-up, leave the JTAG header accessible; once production-locked, the security bit prevents readback but ISP erase/program remains available via JTAG.
The BGA-256 package thermal resistance is approximately 18 C/W (junction-to-ambient with 4-layer PCB and 1 oz copper). At maximum toggle rate and 100% I/O utilization, internal power may reach 1.5-2.0 W, yielding a 27-36C junction temperature rise. The industrial -40C to +85C ambient range combined with self-heating requires derating above 70C ambient for high-utilization designs. Estimated: TJ_max for industrial-grade EPM3512A is 150C; users should target TJ < 110C for long-term reliability per Arrhenius MTBF models.
Thông tin tuân thủ
RoHS/REACH status not confirmed in the verified web data; original Altera MAX 3000A family was launched before RoHS mandate (2006), so lead-free compliance depends on specific date code and PCN revision. Industrial temperature grade -40C to +85C does not imply AEC-Q100 automotive qualification - the EPM3512A is not AEC-Q100 qualified.
