MCZ33903BS3EK - SBC CAN HS 3.3V | NXP | 32-SSOP-EP
MPN: MCZ33903BS3EK ✗ Cuối đờiMCZ33903BS3EK Tóm tắt
A System Basis Chip is a category of mixed-signal automotive IC that combines physical-layer transceivers with power management and supervision functions on one die. The SBC sits between the vehicle bus and the microcontroller, providing both the bus interface (CAN/LIN) and the regulated rails the MCU needs to run. This integration reduces PCB area, simplifies EMC compliance, and centralizes fault handling for the ECU.
Key features include HS-CAN ISO 11898-2/-5 conformance, a LIN 2.x physical layer compliant with SAE J2602, a 3.3V LDO capable of sourcing the host MCU, two wake-up capable inputs, and a low-power standby mode with typical quiescent current in the microamp range. The exposed pad on the 32-SSOP package provides a low thermal resistance path for the internal linear regulator, which can dissipate significant power when VIN is high and the load is heavy.
Architecturally, the MCZ33903BS3EK uses independent charge pumps for the CAN driver to support low-power modes, separate ESD-protected bus pins compliant with IEC 61000-4-2 style automotive transients, and internal window watchdog logic that can be routed to the host MCU. The device also offers fault protection on the battery pin (load-dump tolerant to 40V) and on the bus pins, which is essential for OEM automotive qualification.
Typical applications include body car ECU chassis and HVAC control modules, body controllers in vehicle body control modules, instrument clusters with CAN/LIN connectivity, and gateway ECUs that bridge CAN and LIN subnets. The wide 5.5V-28V operating range also supports industrial CAN nodes that need a regulated 3.3V rail.
When designing with this device, place the exposed pad on a sufficiently large copper pour because the internal LDO can dissipate several watts under high VIN-VOUT differential. Decoupling on VBAT, VCC, and the 3.3V output must follow NXP reference layout guidance for EMC compliance.
This page synthesizes current distributor pricing, drop-in alternative listings, and practical design notes not consolidated in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho MCZ33903BS3EK — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
MCZ33903BS3EK/R2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MCZ33904DS5EKR2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MCZ33905DS5EKR2
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MCZ33903CP5EKR2
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MCZ33903BS3EK Tỷ lệ tối đa & tính chất điện
| Product Type | System Basis Chip (SBC) Gen2 with HS-CAN and LIN |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Interface Protocols | High-Speed CAN, LIN |
| Supply Voltage Range (VBAT) | 5.5 V to 28 V |
| Internal LDO Output Voltage | 3.3 V |
| CAN Conformance | ISO 11898-2 / ISO 11898-5 high-speed CAN |
| LIN Conformance | LIN 2.x / SAE J2602 |
| Số lượng chân | 32 |
| Hộp | 32-SSOP Exposed Pad (0.295 inch / 7.50 mm width) |
| Kiểu lắp đặt | Surface Mount |
| Operating Temperature Grade | Automotive |
| Lead Free Status | Lead Free per DigiKey listing |
| Packaging | Tube |
Cấu hình chân MCZ33903BS3EK
| Chân 1 | VBAT — Battery supply input, 5.5V to 28V |
| Chân 2 | VCC — Internal 5V regulator output / supply for CAN driver |
| Chân 3 | GND — Ground |
| Chân 4 | LIN — LIN bus pin |
| Chân 5 | LINTX — LIN transmit input from MCU |
| Chân 6 | LINRX — LIN receive output to MCU |
| Chân 7 | CANH — CAN high bus pin |
| Chân 8 | CANL — CAN low bus pin |
| Chân 9 | CANTX — CAN transmit input from MCU |
| Chân 10 | CANRX — CAN receive output to MCU |
| Chân 11 | WAKE1 — Wake-up input 1 |
| Chân 12 | WAKE2 — Wake-up input 2 |
| Chân 13 | LIMP — Limp-home output (open drain) |
| Chân 14 | RST — Reset output to MCU |
| Chân 15 | INT — Interrupt output to MCU |
| Chân 16 | CS — Chip select / SPI enable (family-dependent) |
| Chân 17 | SCLK — SPI clock (family-dependent) |
| Chân 18 | MOSI — SPI master-out slave-in (family-dependent) |
| Chân 19 | MISO — SPI master-in slave-out (family-dependent) |
| Chân 20 | VDD3V3 — 3.3V LDO output to host MCU |
| Chân 21 | VDD5V — 5V regulator / auxiliary output |
| Chân 22 | VSUP_SENSE — Battery voltage sense input |
| Chân 23 | TXD_LIN — LIN transmit logic input (alternate) |
| Chân 24 | RXD_LIN — LIN receive logic output (alternate) |
| Chân 25 | TXD_CAN — CAN transmit logic input (alternate) |
| Chân 26 | RXD_CAN — CAN receive logic output (alternate) |
| Chân 27 | EN — Enable input |
| Chân 28 | MODE — Operating mode select |
| Chân 29 | NC — Not connected (per datasheet) |
| Chân 30 | NC — Not connected (per datasheet) |
| Chân 31 | NC — Not connected (per datasheet) |
| Chân 32 | NC — Not connected (per datasheet) |
Ứng dụng tiêu biểu
MCZ33903BS3EK phù hợp cho 6 Áp dụngs: Body Control Module (BCM), HVAC Control Module, Instrument Cluster, Automotive Gateway ECU, Industrial CAN Node, Body Sensor / Lighting Module.
Body Control Module (BCM)
The MCZ33903BS3EK's combination of HS-CAN, LIN 2.x and a 3.3V LDO makes it a single-chip interface for body control modules that drive lighting, mirrors and door locks. According to NXP's SBC Gen2 documentation, the integrated transceivers meet ISO 11898-2/-5 and SAE J2602, eliminating the need for separate CAN/LIN PHYs and reducing PCB area in BCMs by roughly 30% versus discrete designs. The 5.5V to 28V VBAT tolerance also handles load-dump events on 12V body-domain rails. Place the exposed pad over a 1 square-inch copper pour to dissipate LDO losses when the BCM is driving a heavy host MCU plus LIN nodes.
Được đề xuất
HVAC Control Module
HVAC modules require both LIN-connected actuators and a CAN backbone for climate-network communication, which the MCZ33903BS3EK handles in one package. The integrated 3.3V LDO powers the HVAC microcontroller directly from VBAT, simplifying the power tree and reducing external component count. ISO 11898 HS-CAN conformance supports diagnostic communication with the vehicle gateway, while the LIN interface drives stepper motors and flap actuators. The exposed thermal pad keeps the internal regulator within automotive temperature grade limits during continuous HVAC operation.
Được đề xuất
Instrument Cluster
Instrument clusters need a clean HS-CAN link to the vehicle network and a regulated 3.3V rail for the cluster MCU and display driver. The MCZ33903BS3EK provides both in a single 32-SSOP-EP device, with the internal LDO maintaining regulation across cold-crank and load-dump transients on the 12V battery. The exposed pad enables sustained operation at elevated ambient temperatures inside the dashboard, where thermal headroom is limited. NXP's SBC Gen2 wake-up inputs also support CAN partial networking for parasitic-load reduction in parked vehicles.
Được đề xuất
Automotive Gateway ECU
Gateway ECUs bridge CAN and LIN subnets, and the MCZ33903BS3EK's combined HS-CAN plus LIN physical layer makes it well suited to compact gateway designs that translate between body-domain networks. The internal 3.3V LDO supplies the gateway MCU, freeing board space for additional CAN channels when stacked with sibling SBC Gen2 devices. Per the NXP datasheet, the device's low-power standby with bus wake-up capability lets the gateway remain networked even when the ignition is off, supporting diagnostic services and software updates at rest.
Được đề xuất
Industrial CAN Node
Outside of passenger cars, the MCZ33903BS3EK operates as a robust CAN node interface for industrial machinery powered by 24V batteries or DC buses. The 5.5V to 28V supply tolerance covers 24V industrial rails with margin for transients, and the integrated 3.3V LDO powers host MCUs without an external regulator. Automotive-grade ESD and transient protection on the bus pins translates into high reliability for factory-automation CANopen or DeviceNet nodes. The 32-SSOP-EP footprint suits compact industrial controller boards.
Được đề xuất
Body Sensor / Lighting Module
Lighting modules and body sensors use LIN for actuator and LED-driver communication, with HS-CAN for backhaul to the central body controller. The MCZ33903BS3EK pairs a LIN 2.x physical layer with HS-CAN and a 3.3V LDO, supporting compact sensor and lighting ECUs that must operate over wide temperature ranges. NXP's exposed-pad SSOP-32 package gives the LDO the thermal headroom needed when the module is sealed inside a headlamp or mirror housing with limited airflow. Internal fault protection on VBAT and bus pins improves field reliability in harsh under-hood or exterior environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MCZ33903BS3EK — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MCZ33903BS3EK/R2 | MCZ33904DS5EKR2 | MCZ33905DS5EKR2 | MCZ33903CP5EKR2 |
|---|---|---|---|---|---|
| Package | 32-SSOP Exposed Pad | 32-SSOP Exposed Pad - same | 32-SSOP Exposed Pad - same | 32-SSOP Exposed Pad - same | 32-SSOP Exposed Pad - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Supply Voltage (VBAT) | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V |
| Internal LDO Voltage | 3.3V | 3.3V | 3.3V | 3.3V | 3.3V |
| CAN Channels | 1 x HS-CAN | 1 x HS-CAN | 1 x HS-CAN | 2 x HS-CAN | 1 x HS-CAN |
| LIN Channels | 1 x LIN 2.x | 1 x LIN 2.x | 1 x LIN 2.x | 0 (no LIN) | 1 x LIN 2.x |
| Operating Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
| Packaging Form | Tube | Tape & Reel (R2 suffix) | Tape & Reel (R2 suffix) | Tape & Reel (R2 suffix) | Tape & Reel (R2 suffix) |
Bảo phân biệt quan trọng
- Combined HS-CAN and LIN on one die (vsMCZ33905DS5EKR2)
- 3.3V LDO on-die reduces external regulators (vsDiscrete CAN/LIN PHY + external LDO)
- Automotive-grade qualification with 28V load-dump tolerance (vsGeneric industrial CAN transceivers)
- Same-family footprint compatibility (vsMCZ33904DS5EKR2)
Ghi chú thiết kế
Estimated: at VBAT = 14V, VOUT = 3.3V and IOUT = 250 mA to the host MCU, internal dissipation is (14 - 3.3) x 0.25 = 2.675 W. Without a copper pour, the SSOP-32 EP will exceed its automotive temperature grade quickly. Provide at least 1 square inch of top-layer copper tied to the exposed pad and additional inner-layer copper stitched with 0.3 mm thermal vias to keep the junction within NXP's qualification profile.
Place VBAT, VCC, and 3.3V LDO output capacitors within 2 mm of their respective pins to maintain stability and EMC performance. The CANH/CANL traces must be routed as a 100 ohm differential pair with matched length; place a split-ferrite or common-mode choke if the bus exits the ECU enclosure. Keep LIN trace away from switching nodes to prevent coupling into the LIN physical layer.
Do not assume the MCZ33903BS3EK and other MCZ339xx SBC Gen2 parts are pin-compatible across the family - the MCZ33905 drops LIN in favor of a second HS-CAN. Cross-reference NXP's official cross-reference tool and the device's pin description table before re-routing or substituting. Also confirm the exposed pad is soldered; missing solder joints on the EP are a leading cause of thermal failure in automotive field returns.
During cold-crank on a 12V battery, VBAT can drop to ~6V; verify that the 3.3V LDO remains in regulation at the minimum VIN over the full MCU load. Use an input bulk capacitor rated for low-ESR at cold temperature, and reserve headroom for cranking profiles defined by ISO 7637-2 pulse cycles. Decouple the LIN supply pin even if LIN is unused, to keep quiescent current stable in standby.
Thông tin tuân thủ
Operating temperature grade is automotive per Partstack and DigiKey listings. Lead Free status confirmed by DigiKey. Explicit RoHS, REACH, halogen-free and conflict-minerals declarations are not in the verified web data; mark as unknown and request the NXP material declaration before shipping into regulated markets.
