MPC852TCZT66A - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP
MPN: MPC852TCZT66A ✗ Cuối đờiMPC852TCZT66A Tóm tắt
A PowerQUICC processor is a system-on-chip that combines a general-purpose embedded CPU with dedicated hardware communications engines. The MPC852T PowerQUICC delivers a versatile, integrated solution for telecom and networking controller applications such as line cards, routers, and remote-access equipment, offloading communications-intensive processing from the embedded core to the CPM. In the broader taxonomy it belongs to microprocessors -> embedded processors -> communications processors -> SoC, sitting between general microcontrollers and full application processors.
Key features include a 32-bit Power Architecture core with 66 MHz core clock, an integrated CPM supporting serial protocols (Ethernet, HDLC, UART), 256-pin plastic BGA package for high-density board assembly, and a wide industrial operating temperature window suitable for outdoor telecom cabinets. The architecture is complemented by an embedded memory controller and a rich set of peripherals typical of the MPC8xx family. Compared with discrete MCU-plus-ASIC solutions, the MPC852T integrates glue logic, DMA, timers, and protocol handling into a single die.
Typical applications include Ethernet-to-Ethernet bridging line cards, ISDN modem pools, low-end router control planes, and industrial serial-protocol gateways. The combination of deterministic CPM and embedded core makes the part well suited to legacy telecom and networking designs where the MPC8xx family has decades of proven deployment.
When designing with this device, plan for PBGA thermal management, multi-layer PCB with controlled-impedance routing, and follow the manufacturer reference manual for CPM buffer descriptor structures. This page synthesizes distributor pricing, parametric comparison, and application context not bundled in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho MPC852TCZT66A — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC852TCZT66A (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, RoHS Status, Core Architecture, Number of Cores.
MPC852TVR66A
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC852TZT66A
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC855TCZT66A
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC860TVR66A
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC860TZP66A
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
MPC852TCZT66A Tỷ lệ tối đa & tính chất điện
| Product Family | MPC8xx / PowerQUICC |
| Core Architecture | 32-bit Power Architecture |
| Core Count | 1 |
| Core Frequency | 66 MHz |
| Process Technology | 0.18 µm CMOS |
| Điện áp cung cấp | 3.3 V |
| Nhiệt độ hoạt động | -40 °C to +100 °C |
| Hộp | 256-pin PBGA (23x23) |
| Kiểu lắp đặt | Surface Mount |
| Sub-category | MPU / Communications Processor |
| Integrated Module | CPM (Communications Processor Module) |
| Kiểu bộ nhớ | External memory controller (Flash/DRAM) |
| Peripherals | Ethernet, HDLC, UART, timers, DMA |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Hướng dẫn cấu hình chân MPC852TCZT66A 256-pin pbga (23x23)
Cấu hình chân cho MPC852TCZT66A (256-pin pbga (23x23) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC852TCZT66A.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC852TCZT66A phù hợp cho 6 Áp dụngs: Ethernet Line Card Controller, ISDN Modem Pool and Remote-Access Equipment, Industrial Serial-Protocol Gateway, Low-End Router Control Plane, Legacy Telecom Base-Station Controller, Tape-and-Reel Production Programming.
Ethernet Line Card Controller
The MPC852TCZT66A fits Ethernet line cards where its integrated CPM offloads Ethernet MAC handling from the embedded core, freeing the 32-bit Power Architecture CPU for routing-table lookups and management plane tasks. With a 66 MHz core and industrial -40 °C to +100 °C temperature range, it bridges the WAN PHY and switch fabric in legacy telecom access equipment. Placed between the PHY and the system backplane, the part handles full-duplex 10/100 Ethernet at wire speed while the CPM autonomously manages frame buffering and DMA, unlike a discrete MCU-plus-MAC implementation which would tie up CPU cycles. The 256-pin PBGA package provides the high-density pin count required for the external memory bus plus multiple serial channels in line-card designs.
Được đề xuất
ISDN Modem Pool and Remote-Access Equipment
The MPC852TCZT66A's CPM integrates HDLC and serial-channel controllers that map directly onto ISDN BRI/PRI channelisation, making it a fit for modem-pool shelves and remote-access concentrators. The 66 MHz Power Architecture core handles signalling stacks while the CPM autonomously services multiple HDLC channels with deterministic latency, replacing banks of discrete serial controllers. At 3.3 V supply in a 256-PBGA, the part delivers high integration density for rack-mounted central-office equipment where PCB area is constrained. Compared to a software-only solution, the hardware offload reduces CPU loading by an order of magnitude, leaving sufficient cycles for management and authentication tasks.
Được đề xuất
Industrial Serial-Protocol Gateway
In factory-floor gateways bridging Profibus, Modbus, and serial-fieldbus to Ethernet, the MPC852TCZT66A provides the multi-protocol serial channels required through its CPM, plus the embedded Power Architecture core for protocol translation. The industrial -40 °C to +100 °C temperature range supports operation inside unconditioned control cabinets, while the 256-PBGA package withstands industrial shock and vibration profiles better than leaded alternatives. Compared to a soft-CPU implementation on a Cortex-M, the PowerQUICC's hardware-protocol acceleration delivers deterministic latency for real-time industrial control loops where protocol jitter is unacceptable.
Được đề xuất
Low-End Router Control Plane
The MPC852TCZT66A can serve as the control-plane processor in low-end branch-office routers where its CPM handles WAN serial links (T1/E1, V.35) and the embedded core runs the routing-stack forwarding logic. At 66 MHz with 32-bit Power Architecture, the part delivers sufficient throughput for sub-100 Mbps routing workloads while maintaining the deterministic serial-protocol timing required for leased-line interfaces. The 256-PBGA package enables the high pin density needed for the external SDRAM bus plus multiple PHY interfaces, making the PCB layout compact. A discrete design would require a microcontroller, MAC, and serial controller spread across multiple ICs.
Được đề xuất
Legacy Telecom Base-Station Controller
For 2G/3G base-station controllers in legacy cellular networks, the MPC852TCZT66A's combination of CPM-driven E1/T1 framers and embedded Power Architecture CPU matches the deterministic latency demands of Abis-interface signalling. Operating from 3.3 V with industrial -40 °C to +100 °C temperature range, it tolerates outdoor-cabinet thermal stress without derating. The 0.18 µm CMOS process and 256-PBGA 23x23 mm footprint deliver high integration density for the multi-channel baseband-control assemblies. Replacing this part with a newer Cortex-A core would require a full firmware re-write of the BTS signalling stack, so the MPC852T remains the path of least disruption for field-deployed equipment.
Được đề xuất
Tape-and-Reel Production Programming
The MPC852TCZT66A in 256-PBGA ships in tray packaging for production-line board assembly, allowing standard pick-and-place lines with BGA-handling capability to assemble boards without reel-feeding infrastructure. Programming the part's boot configuration and CPM buffer descriptors occurs in-circuit after PCB assembly using JTAG or BDM debug ports per the NXP reference manual. Compared to fine-pitch QFP alternatives, the 256-PBGA's 1.27 mm pitch eases PCB manufacturing tolerances and improves long-term solder-joint reliability under thermal cycling. This packaging format is the standard for high-volume production of PowerQUICC-based networking equipment.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC852TCZT66A — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC852TVR66A | MPC852TZT66A | MPC855TCZT66A | MPC860TVR66A | MPC860TZP66A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Core Frequency | 66 MHz | 66 MHz | 66 MHz | 80 MHz | 66 MHz | 66 MHz |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Integrated CPM | Yes (Ethernet, HDLC, UART) | Yes | Yes | Yes (enhanced) | Yes (more Ethernet channels) | Yes (more Ethernet channels) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40 °C to +100 °C | -40 °C to +100 °C | -40 °C to +100 °C | -40 °C to +100 °C | -40 °C to +100 °C | -40 °C to +100 °C |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS |
Bảo phân biệt quan trọng
- Same 256-PBGA footprint across the MPC852T/MPC855T/MPC860 family (vsMPC860TVR66A)
- Higher-throughput upgrade available in same package (vsMPC855TCZT66A)
- Industrial temperature window matches outdoor telecom cabinets (vsMPC852TZT66A)
Ghi chú thiết kế
The 256-PBGA package requires attention to thermal dissipation because the plastic BGA die is mounted to a laminate substrate that limits heat transfer to the PCB. Place thermal vias directly under the package centre following the NXP application-note land-pattern recommendations; do not rely solely on the top-side copper pour. At continuous 66 MHz operation with CPM activity, the part can dissipate 1.5 to 2.5 W typical, requiring adequate via-stitching to inner copper planes. Estimated: junction-to-ambient thermal resistance without forced airflow is approximately 25-30 °C/W, implying a 50-60 °C rise above 25 °C ambient under typical loads.
PCB layout for the MPC852TCZT66A must follow the NXP MPC8xx hardware design checklist: matched-impedance routing for the external memory bus, length-matched address and data lines within ±50 mils, and decoupling capacitors placed as close as possible to each power pin. Use a six-layer stack-up minimum to provide dedicated ground and power planes, which are required for the parallel 32-bit memory bus to meet timing budgets at 66 MHz. The 1.27 mm BGA pitch allows standard PCB manufacturing but microvia technology is recommended for inner-row escape routing.
Common pitfalls in MPC852T designs include incorrect CPM buffer-descriptor alignment (must be 8-byte aligned and contiguous in dual-port RAM), improper reset configuration word programming in the BCSR register, and missing BSD-style licence compliance for the U-Boot firmware payload. Power-up sequencing requires the 3.3 V core supply to reach regulation before the I/O drivers are enabled; bypassing the sequence can latch the part into a permanent reset state requiring power-cycle recovery. Always validate the JTAG/BDM debug path before reflow to catch footprint errors while rework is still trivial.
Thông tin tuân thủ
RoHS compliant and lead-free per NXP product page. Not AEC-Q100 qualified - this is an industrial/telecom-grade part, not automotive. Halogen-free and conflict-minerals status not explicitly stated in verified distributor data.
