MPC8535BVTANGA557 - PowerQUICC III 800MHz SoC | NXP Semiconductors
MPN: MPC8535BVTANGA557 ✗ Cuối đờiMPC8535BVTANGA557 Tóm tắt
An MPU (microprocessor unit) is the CPU-centric engine of an embedded system. PowerQUICC III represents NXP's evolution of the PowerQUICC II family, scaling from 667 MHz up to 1.5 GHz while adding hardware-accelerated networking, security offload, and high-speed serial interfaces. Within the broader hierarchy, MPC8535 sits as a mid-tier member of the PowerQUICC III lineup: PowerQUICC III -> PowerQUICC family -> Power Architecture SoC -> microprocessor -> semiconductor.
Key features include the e500 32-bit core with Book-E MMU and dual-issue pipeline, integrated L1/L2 caches, hardware cryptography acceleration, dual 10/100/1000 Ethernet MACs, dual PCI/PCIe controllers, SATA II port, USB 2.0 host/device, SDHC, dual I2C, DUART, GPIO, and a 64-bit DDR2/DDR3 SDRAM controller with ECC. The device supports industrial temperature grade 0 to 105 C, making it suitable for fanless networking and telecom equipment.
The architecture combines a complex application processor with the QUICC Engine technology block, offloading packet processing, ATM, and HDLC/PPP workloads from the e500 core. This heterogeneous design lets the MPC8535 act as both control-plane CPU and data-plane engine in a single chip, reducing BOM count versus discrete CPU+ASIC solutions. The integrated SEC 2.0 block accelerates DES/3DES/AES/SHA, offloading IPSec and MACsec from software.
Typical applications include industrial routers, network switches, security gateways, networked printers, industrial control with Ethernet connectivity, and embedded Linux/VxWorks appliances. The wide peripheral set and dual GbE also suit it for factory automation gateways and small-business NAS/SAN appliances.
When designing with this device, allocate adequate PCB area for the 783-ball FCBGA - a minimum 4-layer board with continuous GND/VCC planes is recommended for signal integrity. Use matched-length routing for DDR3 and Ethernet MDI pairs, and follow the NXP hardware design guide for decoupling, which specifies bulk ceramic and polymer capacitors across all power rails.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho MPC8535BVTANGA557 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với MPC8535BVTANGA557 (cùng hình factor và footprint) — khác nhau ở Core Architecture, Memory Controller, Operating Temperature, Package, SATA.
MPC8535EBVTANGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8535BVTANGA
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →MPC8536EBVTANGA
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MPC8535BVTANGA557 Tỷ lệ tối đa & tính chất điện
| Core Architecture | Power Architecture e500 (Book-E) |
| Core Count | 1 |
| Bit Width | 32-bit |
| Maximum Core Frequency | 800 MHz |
| L1 Cache | 32 KB instruction + 32 KB data |
| Memory Controller | DDR2/DDR3 with ECC (64-bit) |
| Ethernet MAC | Dual 10/100/1000 Mb/s (RGMII/SGMII) |
| PCI/PCIe | PCI 2.3 + PCIe interface |
| SATA | SATA II (1 port) |
| USB | USB 2.0 (Host/Device) |
| SDHC | 1 port |
| Cryptography Accelerator | SEC 2.0 (DES/3DES/AES/SHA) |
| Serial Interfaces | 2x I2C, 2x UART, GPIO |
| Hộp | 783-ball FCBGA (29x29 mm) |
| Nhiệt độ hoạt động | 0 C to 105 C |
| Kiểu lắp đặt | Surface Mount |
| Lifecycle | Not Recommended for New Designs (NRND) |
Hướng dẫn cấu hình chân MPC8535BVTANGA557 783-ball fcbga (29x29 mm)
Cấu hình chân cho MPC8535BVTANGA557 (783-ball fcbga (29x29 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho MPC8535BVTANGA557.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
MPC8535BVTANGA557 phù hợp cho 6 Áp dụngs: Industrial Router and Gateway, Network Switch Control Plane, Security Appliance and VPN Gateway, Networked Industrial Printer, Small Business NAS Appliance, Industrial IoT Edge Gateway.
Industrial Router and Gateway
Industrial routers and remote-site gateways benefit from the MPC8535BVTANGA557's combination of an 800 MHz e500 application core with dual GbE MACs (RGMII/SGMII) and PCI/PCIe for expansion. The integrated SEC 2.0 block accelerates IPSec and SSL/TLS tunnels, allowing WAN-side encryption at line rate without CPU bottlenecking. DDR2/DDR3 with ECC support provides reliable memory operation across industrial temperature ranges from 0 C to 105 C, and the SATA II plus SDHC ports enable local log storage or firmware staging. Compared with discrete CPU+ASIC designs, the MPC8535 consolidates control-plane and data-plane in one package, reducing BOM and PCB area. Power consumption at 800 MHz typically stays within 6-8 W envelope, suitable for fanless enclosures.
Được đề xuất
Network Switch Control Plane
Managed enterprise and industrial switches use the MPC8535BVTANGA557 as the main control-plane processor running the management stack (CLI, SNMP, web UI). The e500 800 MHz core with Book-E MMU comfortably handles Linux or VxWorks BSPs with full L2/L3 forwarding tables. PCI/PCIe provides a clean interface to external switch fabric ASICs, while dual GbE acts as CPU/mgmt port plus service port. The 105 C upper temperature limit supports deployment in unventilated wiring closets. Engineers can leverage NXP's reference Linux BSP and the QUICC Engine-free variant keeps code footprint small for non-protocol applications.
Được đề xuất
Security Appliance and VPN Gateway
Small-business VPN gateways, UTM appliances, and IPsec concentrators use the MPC8535BVTANGA557's SEC 2.0 engine to accelerate AES, 3DES, SHA, and RSA workloads, delivering wire-speed encryption on Gigabit WAN links. The e500 core handles routing, NAT, firewall policies, and management UI while the SEC block offloads bulk crypto. Dual GbE provides dedicated WAN and LAN ports without external bridge. DDR3-800 memory support lets the system hold large IPsec SPD/SADB tables. Industrial-grade temperature range plus the NRND-acceptable legacy lifecycle make it suitable for long-life security appliances where design re-spins are costly.
Được đề xuất
Networked Industrial Printer
Networked multifunction printers and production-line label printers integrate the MPC8535BVTANGA557 to drive the main controller logic plus dual GbE connectivity for office and factory networks. The e500 800 MHz core can drive a Linux-based print spooler plus the raster image processor (RIP) for PCL/PostScript streams. USB 2.0 supports direct-attached storage or scanner modules, while SDHC holds fonts and macros. PCI/PCIe provides expansion for additional network ports or wireless modules. The 0-105 C industrial temperature range lets the design sit inside the printer's heated chassis.
Được đề xuất
Small Business NAS Appliance
Entry-level NAS and SAN appliances use the MPC8535BVTANGA557 as the main storage controller with SATA II providing one direct-attached disk port, plus PCI/PCIe expansion for additional SATA or SAS HBA cards. The e500 800 MHz core runs the file system stack (NFS, SMB, iSCSI target) with adequate headroom for RAID calculations. DDR3-800 with ECC ensures data integrity across RAID rebuild operations. GbE connectivity supports link aggregation for higher throughput. The QUICC Engine-free variant keeps BOM cost low versus the MPC8535E, making this part attractive to cost-sensitive SOHO/SMB storage designs.
Được đề xuất
Industrial IoT Edge Gateway
Industrial IoT edge gateways aggregate fieldbus or wireless sensor data and forward it to the cloud using the MPC8535BVTANGA557 as the central processing engine. The 800 MHz e500 core runs MQTT brokers, OPC UA servers, or custom protocols, while dual GbE provides bridged connectivity to upstream networks and downstream device clusters. USB 2.0 supports LTE/5G modems or Wi-Fi modules, and SDHC stores buffered telemetry during WAN outages. The 105 C top temperature rating is essential for cabinets near motors or ovens. Industrial temperature plus wide peripheral mix makes this part a strong fit for protocol-conversion gateways.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho MPC8535BVTANGA557 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | MPC8535EBVTANGA | MPC8535BVTANGA | MPC8536EBVTANGA | P2020NSE7MMC | P1010NSE5FFB | AMCC460EX-S |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | AppliedMicro |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 689-FCPBGA (31x31) | 425-FCPBGA (19x19) | 1088-ball FCBGA |
| Core Architecture | PowerPC e500 (Book-E) | PowerPC e500 (Book-E) | PowerPC e500 (Book-E) | PowerPC e500 (Book-E) | PowerPC e500v2 (dual) | PowerPC e500v2 (single) | PowerPC 460EX |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | Up to 1.25 GHz | Up to 1.0 GHz | Up to 1.0 GHz | Up to 1.0 GHz |
| Core Count | 1 | 1 | 1 | 1 | 2 | 1 | 1 |
| DDR Memory Support | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC | DDR2/DDR3 + ECC |
| GbE MACs | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Cryptography Accelerator | None (SEC 2.0 on E variant) | SEC 2.0 | None | SEC 3.0 | None | None | None |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | -40 C to 105 C | -40 C to 105 C | 0 C to 70 C |
| Approximate Unit Price (qty 1) | $118.04 | $130-145 | $118.04 | $150-180 | $65-85 | $30-45 | $40-60 |
Bảo phân biệt quan trọng
- Integrated SEC 2.0 cryptography absent vs E variant (vsMPC8535EBVTANGA)
- Pin-compatible path to faster successor (vsMPC8536EBVTANGA)
- Lower BOM cost vs newer QorIQ P-series (vsP2020NSE7MMC)
Ghi chú thiết kế
Estimated: at 800 MHz typical core voltage (1.0 V) the MPC8535BVTANGA557 draws roughly 6-8 W depending on workload. The 783-ball FCBGA exposes the die through the top of the package and requires either a heatsink or a copper spreader on the lid for high-ambient industrial deployments. Place NTC or on-die thermal diode routing for active fan control if your chassis exceeds 60 C ambient. Keep junction below 105 C by derating Tcase to 95 C max for design margin.
Use a minimum 8-layer PCB stack-up with continuous GND and VCC planes adjacent to the top signal layer to supply the FCBGA balls. Per NXP's hardware design guide, every VDD rail (1.0 V core, 1.5 V DDR3, 2.5 V SerDes, 3.3 V I/O) needs its own bulk ceramic plus polymer decoupling placed within 5 mm of the package perimeter. Match DDR3 address/command/clock traces within 50 mils and use fly-by topology with termination at the last memory device.
The MPC8535's SGMII and PCIe SERDES lanes require 100-ohm differential routing with intra-pair skew below 5 mils and length matching to within 25 mils across pairs. Reference NXP application note AN3941 for stack-up, via-in-pad recommendations, and AC-coupling capacitor placement (typically 100 nF X7R 0402 at the receiver end). Place PHY magnetics within 25 mm of the MDI traces and keep them away from switching power inductors to avoid common-mode noise injection.
Do not confuse the MPC8535 with the MPC8535E variant - the E variant has SEC 2.0 and QUICC Engine while the non-E (this part) does not. Boot ROM configuration via the cfg_sys_pll and cfg_reset_source pins must match your hardware reset sequencer, and a missing pull-up on cfg_sys_pll[0..3] prevents the part from booting. Verify the local bus and DDR configuration resistors against the latest NXP reference schematic before fab, since PCB rework on a 783-ball FCBGA is impractical.
Thông tin tuân thủ
Compliance values not stated in retrieved web data; engineers should request the latest RoHS/REACH declarations directly from NXP before production commitment. This part is not AEC-Q100 qualified - automotive designs should choose an AEC-Q100 alternative.