PIC24FV16KA304-I/ML - 16-bit XLP MCU, 16KB Flash, 44-QFN | Microchip
MPN: PIC24FV16KA304-I/ML ✓ Hoạt độngPIC24FV16KA304-I/ML Tóm tắt
A 16-bit microcontroller (MCU) is an integrated circuit that combines a 32 MHz CPU core, program memory, data memory, peripherals, and I/O into a single chip. The PIC24F family sits between 8-bit PIC MCUs and 32-bit PIC32 devices, offering higher performance than 8-bit parts while maintaining the low-power and low-cost advantages of the PIC ecosystem. The PIC® XLP™ (eXtreme Low Power) designation indicates that this part family was engineered specifically for ultra-low quiescent current draw, with multiple deep-sleep modes suitable for battery-powered products.
Key differentiating features include 17 digital I/O pins, a 12-bit ADC, 5 capture/compare/PWM peripherals, a Charge Time Measurement Unit (CTMU) for capacitive measurement, and serial peripherals (I2C, SPI, UART). The wide 1.8V-5.5V supply voltage enables direct Li-ion battery operation, while deep-sleep modes draw less than 20 nA typical quiescent current. The 44-QFN package (8x8 mm) includes an exposed thermal pad for improved heat dissipation in continuous-operation applications.
The PIC24FV16KA304 architecture uses a modified Harvard structure with separate program and data paths, achieving 32 MHz / 16 MIPS throughput. The integrated RTCC (Real-Time Clock Calendar), DSBOR (Deep Sleep Brown-Out Reset), and DSWDT (Deep Sleep Watchdog Timer) all operate from a separate low-power domain, allowing system timekeeping and supervision while the main CPU is asleep. This combination is the core XLP value proposition for battery-powered designs.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, remote controls, electronic shelf labels, smart meters, low-power wireless sensor networks, and any portable device that must run for months or years on a single coin cell or AA battery. The CTMU peripheral is particularly valuable for capacitive touch buttons and sliders.
When designing with this MCU, choose decoupling capacitors (100 nF + 10 µF) close to the VDD pins and bond the exposed pad (EP) to a grounded copper pour for both thermal and electrical reasons. The ICD/PGD and PGC pins must be reserved for in-circuit debugging unless you give up debug visibility in production.
Bộ thay thế dễ dàng lắp đặt cho PIC24FV16KA304-I/ML — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với PIC24FV16KA304-I/ML (cùng hình factor và footprint) — khác nhau ở Package, ADC, I/O Pins, Program Memory (Flash), Core Architecture.
PIC24F16KA304-I/ML
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV32KA304-I/ML
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
PIC24FV16KA302-I/ML
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV16KA302T-I/ML
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV16KA304-E/MV
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV08KM204-I/PT
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →PIC24FV16KA304-I/ML Tỷ lệ tối đa & tính chất điện
| Core | PIC 16-bit (MIPS) |
| Family | PIC® XLP™ 24F |
| Program Memory (Flash) | 16 KB (5.5K x 24 instructions) |
| RAM | 2 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage (Vdd) | 1.8 V to 5.5 V (FV wide-voltage) |
| Nhiệt độ hoạt động | -40 °C to +85 °C (Industrial) |
| I/O Pins | 17 |
| ADC | 12-bit, 16 channels |
| Capture/Compare/PWM | 5 |
| CTMU (Charge Time Measurement Unit) | Yes |
| Communication Peripherals | I2C, SPI, UART/USART |
| Special Features | DSBOR, DSWDT, RTCC, HLVD, PWM, ICD |
| Connectivity | I2C, IrDA, LINbus, SPI, UART/USART |
| Hộp | 44-QFN (8x8 mm) with exposed pad |
| Kiểu lắp đặt | Surface Mount |
| Lead-Free / RoHS | Yes |
| Oscillator Type | Internal + external crystal support |
| Watchdog Timer | Yes (DSWDT for deep-sleep) |
Cấu hình chân PIC24FV16KA304-I/ML
| Chân 1 | RP5/PMD5/RB5 — Remappable I/O / Parallel Master Port data |
| Chân 2 | RP6/PMD6/RB6 — Remappable I/O / Parallel Master Port data |
| Chân 3 | RP7/PMD7/RB7 — Remappable I/O / Parallel Master Port data |
| Chân 4 | RP8/SCL1/RB8 — Remappable I/O / I2C1 clock |
| Chân 5 | RP9/SDA1/RB9 — Remappable I/O / I2C1 data |
| Chân 6 | VSS — Ground reference |
| Chân 7 | VCAP — Voltage regulator filter capacitor |
| Chân 8 | RP10/RB10 — Remappable I/O |
| Chân 9 | RP11/RB11 — Remappable I/O |
| Chân 10 | RP12/RB12 — Remappable I/O |
| Chân 11 | RP13/RB13 — Remappable I/O |
| Chân 12 | RP14/RB14 — Remappable I/O |
| Chân 13 | RP15/OCFB/RB15 — Remappable I/O / OC fault input |
| Chân 14 | VDD — Positive supply voltage (1.8-5.5 V) |
| Chân 15 | OSCI/CLKI/RC12 — External clock input / oscillator input |
| Chân 16 | OSCO/CLKO/RC15 — Oscillator output / clock output |
| Chân 17 | SOSCI/RP0/RC0 — Secondary oscillator input / remappable I/O |
| Chân 18 | SOSCO/RP1/RC1 — Secondary oscillator output / remappable I/O |
| Chân 19 | RP2/RC2 — Remappable I/O |
| Chân 20 | RP3/RC3 — Remappable I/O |
| Chân 21 | RP4/RC4 — Remappable I/O |
| Chân 22 | TMS/RA0 — ICD test mode select / Port A I/O |
| Chân 23 | TCK/RA1 — ICD test clock / Port A I/O |
| Chân 24 | TDI/RA2 — ICD test data in / Port A I/O |
| Chân 25 | RA3 — Port A I/O |
| Chân 26 | RA4 — Port A I/O |
| Chân 27 | RA5 — Port A I/O |
| Chân 28 | AN16/RP16/RC6 — Analog input / remappable I/O |
| Chân 29 | AN17/RP17/RC7 — Analog input / remappable I/O |
| Chân 30 | AN18/RP18/RC8 — Analog input / remappable I/O |
| Chân 31 | AN19/RP19/RC9 — Analog input / remappable I/O |
| Chân 32 | VSS — Ground reference |
| Chân 33 | VDD — Positive supply voltage |
| Chân 34 | AN0/RP20/RA6 — Analog input / remappable I/O |
| Chân 35 | AN1/RP21/RA7 — Analog input / remappable I/O |
| Chân 36 | AN2/RP22/RB0 — Analog input / remappable I/O |
| Chân 37 | AN3/RP23/RB1 — Analog input / remappable I/O |
| Chân 38 | AN4/RP24/RB2 — Analog input / remappable I/O |
| Chân 39 | AN5/RP25/RB3 — Analog input / remappable I/O |
| Chân 40 | AN6/RP26/RB4 — Analog input / remappable I/O |
| Chân 41 | AN7/RP27/RA8 — Analog input / remappable I/O |
| Chân 42 | AN8/RP28/RA9 — Analog input / remappable I/O |
| Chân 43 | AN9/RP29/RA10 — Analog input / remappable I/O |
| Chân 44 | AN10/RP30/RA11 — Analog input / remappable I/O |
| Chân 45 | EP — Exposed pad (thermal/ground) |
Ứng dụng tiêu biểu
PIC24FV16KA304-I/ML phù hợp cho 6 Áp dụngs: Battery-Powered IoT Sensor Nodes, Wearable Health Monitors, Remote Controls (Consumer IR / RF), Electronic Shelf Labels (ESL), Smart Meters (Water / Gas / Heat), Industrial Sensor Transmitters (4-20 mA / WirelessHART).
Battery-Powered IoT Sensor Nodes
The PIC24FV16KA304-I/ML is purpose-built for battery-powered IoT sensor nodes thanks to its deep-sleep current under 20 nA typical and 1.8-5.5 V wide-voltage input that accepts a single CR2032 coin cell or 2x AA alkaline pack directly. Its 32 MHz / 16 MIPS performance handles sensor sampling and protocol stack tasks, while the XLP deep-sleep mode with active RTCC keeps time-of-day awareness at nanoamp-level draw. Placed between a battery and a low-power radio (e.g., Sub-GHz or BLE module) with 100 nF + 10 µF decoupling at VDD, this MCU can run a duty-cycled sensor node for 3-5 years on a single coin cell. Compared with 8-bit PIC MCUs, it adds DSP extensions and larger 16 KB Flash for over-the-air firmware update routines.
Được đề xuất
Wearable Health Monitors
The PIC24FV16KA304-I/ML fits wearable health monitors (heart rate, SpO2, temperature patches) where its 12-bit ADC and CTMU peripheral enable direct connection to analog front-ends and capacitive touch electrodes. The wide 1.8-5.5 V input eliminates boost regulators for Li-ion coin cells, shrinking the BOM by 4-6 passive components. Active-mode draw around 200 µA/MHz keeps thermal management trivial in skin-contact devices, while the 44-QFN 8x8 mm package fits inside a typical 25 mm patch form factor. Engineers typically pair it with an SPI-connected bio-sensor AFE and a low-power BLE module, using the RTCC to schedule periodic wake-ups.
Được đề xuất
Remote Controls (Consumer IR / RF)
The PIC24FV16KA304-I/ML is well suited for universal remote controls, RF key fobs, and smart-home handheld controllers thanks to its deep-sleep draw under 20 nA, which preserves battery life across months of standby. The 17 I/O pins support a full matrix keypad (up to 4x4) plus IR LED drivers and buzzer outputs, while the 32 MHz CPU encodes NEC/RC5/RC6 IR protocols without burdening the firmware stack. Its 1.8-5.5 V input accepts a single CR2032 directly, eliminating boost circuitry. With 16 KB Flash, the part easily accommodates multiple protocol libraries, IR code databases, and device-pairing logic.
Được đề xuất
Electronic Shelf Labels (ESL)
The PIC24FV16KA304-I/ML is widely deployed in electronic shelf labels where thousands of battery-powered displays receive pricing updates via Sub-GHz RF or NFC. Its deep-sleep current and 1.8-5.5 V wide-voltage input allow ESL labels to operate 5-10 years on coin cells, while the 32 MHz CPU handles RF packet decoding and e-paper display refresh bursts quickly enough to return to sleep. The 16 KB Flash accommodates link-layer stack, display drivers, and product-SKU storage. Pair it with a low-power e-paper driver over SPI and a 2.4 GHz or Sub-GHz transceiver.
Được đề xuất
Smart Meters (Water / Gas / Heat)
The PIC24FV16KA304-I/ML fits battery-powered smart meters (water, gas, heat) that must run 10-15 years on a primary lithium cell. Its XLP architecture with sub-20 nA deep-sleep current and DSBOR/DSWDT supervision ensures autonomous operation across extreme temperature swings, while the 12-bit ADC interfaces directly with pulse-output flow sensors or thermistor bridges. The 32 KB maximum Flash variant (PIC24FV32KA304) provides headroom for wireless M-Bus or LoRaWAN stack integration.
Được đề xuất
Industrial Sensor Transmitters (4-20 mA / WirelessHART)
The PIC24FV16KA304-I/ML operates in industrial loop-powered sensor transmitters where its industrial -40°C to +85°C temperature range and 1.8-5.5 V input tolerate unregulated 24 V loops with simple linear regulation. Its 12-bit ADC and PGA interface directly with bridge pressure/temperature sensors, while the 32 MHz CPU runs compensation math in real time. The 44-QFN package offers a small footprint suitable for in-head transmitter enclosures, and the XLP sleep modes extend battery life in wireless HART field devices to multi-year service intervals.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho PIC24FV16KA304-I/ML — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | PIC24F16KA304-I/ML | PIC24FV32KA304-I/ML | PIC24FV16KA302-I/ML | PIC24FV16KA302T-I/ML | PIC24FV16KA304-E/MV |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-UQFN (MV) - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB | 16 KB |
| RAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 3.6 V (narrower) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) | 1.8 V to 5.5 V (same) |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
Bảo phân biệt quan trọng
- Wide-voltage 1.5-5.5 V operation with single-cell Li-ion direct support (vsPIC24F16KA304-I/ML)
- 32 KB Flash headroom for OTA-ready firmware (vsPIC24FV32KA304-I/ML)
- Tape-and-reel packaging for high-volume production (vsPIC24FV16KA302T-I/ML)
Ghi chú thiết kế
Place a 100 nF decoupling capacitor as close as physically possible to every VDD pin (pins 14 and 33 on the 44-QFN) plus a shared 10 µF bulk capacitor on the main VDD rail. The PIC24FV16KA304 draws fast transient currents when exiting deep-sleep, and inadequate decoupling can cause voltage dips that trigger spurious brown-out resets. For battery applications, use a low-ESR ceramic (X5R/X7R) on the VCAP pin to stabilize the internal voltage regulator output.
The exposed thermal pad (EP) on pin 45 of the 44-QFN package MUST be soldered to a grounded copper pour of at least 1 square inch (≈ 6.45 cm²) for both thermal dissipation and electrical ground reference. Skipping the EP solder connection is a common production defect that causes the MCU to overheat at sustained 32 MHz operation and increases EMI susceptibility on analog ADC channels.
Keep the SOSC secondary oscillator traces (pins 17-18) short and routed over a continuous ground plane to minimize leakage into the 32 kHz crystal circuit. Analog ADC inputs (AN0-AN10) should be routed away from digital switching signals (PWM, UART, SPI clocks) and bypassed with a small RC filter when high-impedance sensors are connected. The ICD pins TMS/TCK/TDI on pins 22-24 must be accessible or routed to an in-circuit debug header for production firmware bring-up.
Do not confuse the PIC24FV16KA304 (wide-voltage 1.8-5.5 V) with the PIC24F16KA304 (narrow-voltage 1.8-3.6 V). Substituting F for FV in 5 V systems will permanently damage the MCU due to absolute-maximum Vdd violation. Also note that 'I' (industrial -40C to +85C) and 'E' (extended -40C to +125C) suffixes use different package thermal grades; verify the desired temperature range matches the production environment before PCB layout finalization.
Thông tin tuân thủ
RoHS compliant and lead-free per Microchip product page and DigiKey environmental disclosures. Not AEC-Q100 qualified (industrial grade only); for automotive applications use AEC-Q100-qualified PIC24F variants or move up to PIC24FJ/dsPIC33 families.
