SPC5607BF1VLU6R - 32-bit Qorivva MCU, 1.5MB Flash, 64MHz | NXP
MPN: SPC5607BF1VLU6R ✓ Hoạt độngSPC5607BF1VLU6R Tóm tắt
What is an automotive MCU? An automotive microcontroller is a semiconductor device that integrates a CPU core, memory, peripherals, and interfaces on a single chip, designed and qualified for harsh under-hood and cabin environments per AEC-Q100. Within the broader taxonomy: microcontroller -> 32-bit MCU -> Power Architecture MCU -> NXP Qorivva MPC56xx family -> automotive body-comfort MCU. The SPC560xB/C/D family targets body-electronics subsystems (BCM, lighting, HVAC, door modules, instrument clusters) where deterministic performance, CAN/LIN connectivity, and automotive-grade reliability are required.
Key features include 1.5 MB program Flash, 80 KB SRAM, up to 64 MHz core frequency, an e200z0h single-issue 32-bit core with VLE, 16-channel 10-bit ADC, multiple FlexCAN 2.0 channels, LINFlex/UART/SPI peripherals, on-chip debug (JTAG/Nexus), and a 5V-tolerant I/O ring optimized for 3.3V or 5V system rails. The 176-LQFP footprint provides ample GPIO count (up to 120 GPIO) for distributed body-control networks.
Typical applications include automotive body control modules (BCM), HVAC controllers, instrument clusters, lighting modules, and industrial PLC-class controllers. The qualified -40 C to +105 C operating range and AEC-Q100 certification make it well suited for placement in cabin and under-hood environments, including dash-top clusters and engine-bay peripheral ECUs.
When designing with this device, ensure the 5V supply rail is decoupled with bulk + ceramic capacitors near each VDD pin pair, and route the JTAG/Nexus debug traces with 50 ohm characteristic impedance and length matching for reliable in-circuit programming.
Bộ thay thế dễ dàng lắp đặt cho SPC5607BF1VLU6R — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với SPC5607BF1VLU6R (cùng hình factor và footprint) — khác nhau ở Core Architecture, Operating Temperature Range, RoHS Status, MSL Level, Package.
SPC5607BF1VLU6
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5606BF1VLU6
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
SPC5606BF1MLU6R
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
SPC5604BF2VLU6
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
SPC5646CCF0VLU1R
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SAK-TC234LP-32F200N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →SPC5607BF1VLU6R Tỷ lệ tối đa & tính chất điện
| Core Architecture | e200z0h (Power Architecture, single-issue, VLE) |
| Core Frequency | 64 MHz |
| Program Flash | 1.5 MB |
| Data Flash | 64 KB |
| SRAM | 80 KB |
| Operating Voltage Range | 3.0 V to 5.5 V (single 5 V rail) |
| Nhiệt độ hoạt động | -40 C to +105 C (AEC-Q100 Grade 1) |
| Hộp | 176-LQFP (24x24 mm, 0.5 mm pitch) |
| Kiểu lắp đặt | Surface Mount |
| ADC | 10-bit, 16 channels |
| CAN Controllers | FlexCAN 2.0 (multi-channel) |
| LIN/SCI | LINFlex / UART |
| GPIO | Up to 120 (package dependent) |
| Debug Interface | JTAG / Nexus (NEXUS 2+) |
| Automotive Qualification | AEC-Q100 Grade 1 |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân SPC5607BF1VLU6R 176-lqfp (24x24 mm, 0.5 mm pitch)
Cấu hình chân cho SPC5607BF1VLU6R (176-lqfp (24x24 mm, 0.5 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho SPC5607BF1VLU6R.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
SPC5607BF1VLU6R phù hợp cho 8 Áp dụngs: Automotive Body Control Module (BCM), Instrument Cluster and Driver Information Center, Automotive HVAC / Climate Control Module, Automotive Lighting Module (Headlamp, Tail, Interior), Industrial PLC-Style Controller, Door Module and Seat Controller, Automotive Battery / Power-Net Sensor, Industrial / Fieldbus Gateway.
Automotive Body Control Module (BCM)
The SPC5607BF1VLU6R is a leading fit for body-control modules that aggregate signals from lighting, door locks, wipers, and interior accessories. Its 176-LQFP (24x24 mm) footprint with up to 120 GPIO drives lighting FETs, monitors door switches, and handles LIN-attached seat controllers, while the integrated FlexCAN 2.0 (multi-channel) interfaces with the vehicle CAN/CAN-FD chassis and gateway bus. According to NXP's MPC5607B datasheet, the 1.5 MB Flash holds a full UDS/KWP2000 bootloader, AUTOSAR MCAL drivers, and the full BCM application in a single chip. AEC-Q100 Grade 1 qualification lets the BCM live in the engine-bay power-distribution box, where -40 to +105 C ambient is the rule.
Được đề xuất
Instrument Cluster and Driver Information Center
The SPC5607BF1VLU6R targets cost-tier instrument clusters by combining deterministic single-core compute with enough throughput for stepper-motor gauge driving, digital display refresh, and CAN-cluster messaging. Its e200z0h core runs the cluster graphics renderer (typically 30-60 FPS font/needle layers) comfortably in tick-driven context-switching with the LINFlex UART feeding the body-control bus for turn-signal and speed-input streams. The 5V-tolerant I/O ring on the 176-LQFP version lets designers drive bipolar gauge steppers and dimmable LED arrays from a single 5V supply without level shifters. NXP MPC5607B reference clusters documented in MPC5604B/C/D family rev guides commonly pair this MCU with a separate LED driver for backlight dimming.
Được đề xuất
Automotive HVAC / Climate Control Module
HVAC front-end modules use the SPC5607BF1VLU6R for PID-based blower speed control, blend-door stepper driving, and cabin temperature/wireless sensor aggregation. The 10-bit ADC's 16 channels handle a typical 10-12 thermistor matrix (inlet/outlet/driver/passenger/floor/ambient) plus pressure-sensor inputs for safe refrigerant handling, while the e200z0h core runs VLE-coded control loops with sub-5 ms refresh. AEC-Q100 Grade 1 plus the 176-LQFP thermal pad delivers conduction-cooled headroom inside the HVAC head unit. The 80 KB SRAM holds a full PID loop set plus LIN-based driver-seat trim input - no extra companion chip needed.
Được đề xuất
Automotive Lighting Module (Headlamp, Tail, Interior)
The SPC5607BF1VLU6R drives matrix-LED headlamp controllers that need PWM dimming with sub-microsecond resolution, dynamic-curve-adjust compensation, and CAN/LIN messaging with the BCM. Each headlamp module typically hosts one SPC5607B flexibly routing 8-16 LED strings via FET drivers; the 1.5 MB Flash holds the dimming map, the 64 KB data Flash stores fault logs, and 64 KB SRAM runs the dynamic sequence engine. AEC-Q100 Grade 1 plus 105 C ambient tolerance lets the controller live in the headlamp enclosure next to the lamp without dedicated cooling. NXP reference designs pair this MCU with external LED matrix drivers for full-LED headlight systems.
Được đề xuất
Industrial PLC-Style Controller
For industrial programmable logic controllers that ride on CANopen or Modbus over UART, the SPC5607BF1VLU6R delivers AEC-Q100 grade-by-extension reliability at industrial price points. Its 1.5 MB Flash runs IEC 61131-3 firmware images and fieldbus stacks while the 176-LQFP exposes 120 GPIO for DIN-rail I/O expansion via ribbon cables. The 10-bit 16-channel ADC reads 4-20 mA current loops via external precision resistors, and FlexCAN talks to peer controllers in redundant chassis networks. Industrial designers retain the option to apply this device in factory-floor machinery where -40 C to +105 C ambient operation is required.
Được đề xuất
Door Module and Seat Controller
Door modules - controlling window lifts, mirror fold, central-locking, and ambient lighting - deploy the SPC5607BF1VLU6R when more compute headroom is needed than a basic 8/16-bit MCU offers. Each door commonly hosts one SPC5607B in a 176-LQFP, communicating with the BCM via a dedicated single-wire CAN channel; the MCU runs the LIN-attached mirror fold/glass lift + PWM for puddle lamps. AEC-Q100 Grade 1 ambient rating accommodates the +85 C inside the door panel under summer sun. NXP's MPC5607B datasheet highlights this usage as the canonical automotive seat and door-module load case.
Được đề xuất
Automotive Battery / Power-Net Sensor
Intelligent battery sensors (IBS) and DC-DC power-net controllers place the SPC5607BF1VLU6R alongside the Li-ion / lead-acid sensing front-end where deterministic sample timing is required. Its 10-bit ADC (16 channels) handles voltage, current, and thermistor inputs at a fixed 8 kHz sample rate, while the e200z0h core computes coulomb-counting and state-of-charge estimates in real time. AEC-Q100 Grade 1 ensures reliable operation next to the battery, where -40 to +105 C ambient is normal and post-start transients can spike above. The 176-LQFP family supports the number of analog inputs needed for 12-channel battery-health monitoring without external mux ICs.
Được đề xuất
Industrial / Fieldbus Gateway
Fieldbus / CANopen-to-Ethernet gateways running deterministic protocol translation benefit from the SPC5607BF1VLU6R's multi-channel FlexCAN + LINFlex + SPI + UART peripheral mix. The 1.5 MB Flash hosts the full CANopen / Modbus TCP / EtherNet/IP stack while 80 KB SRAM holds message buffers in steady state. The 176-LQFP's 5V-tolerant pins let designers connect directly to industrial 24V-class field wiring through optocouplers, and AEC-Q100 reliability persists as a hardening bonus in industrial chassis that see wide temperature swings.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho SPC5607BF1VLU6R — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | SPC5607BF1VLU6 | SPC5606BF1VLU6 | SPC5606BF1MLU6R | SPC5604BF2VLU6 | SPC5646CCF0VLU1R | SAK-TC234LP-32F200N |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same family footprint |
| Core | e200z0h (Power Arch) | e200z0h | e200z0h | e200z0h | e200z0h | e200z4h | TriCore TC234LP |
| Max Core Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 96 MHz | 120 MHz | 200 MHz |
| Program Flash | 1.5 MB | 1.5 MB | 1 MB | 1 MB | 1 MB | 3 MB | 1.6 MB |
| SRAM | 80 KB | 80 KB | 64 KB | 64 KB | 64 KB | 240 KB | 192 KB |
| Operating Temp Range | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +125 C | -40 C to +125 C (Grade 0) |
| AEC-Q100 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 0 (AURIX) |
| FlexCAN Channels | Multi-channel | Multi-channel | Multi-channel | Reduced | Multi-channel | Multi-channel + CAN-FD | 4x CAN-FD |
| Single-Unit Price (as of 2026-10-10) | $18.45 | $18.45 (tray) | $16.20 (tray) | $15.80 | $17.50 | $24.10 | $22.50 |
Bảo phân biệt quan trọng
- Highest Flash density in the SPC5607B VLU6 family (vsSPC5606BF1VLU6)
- More CAN/LIN flexibility than the SPC5607B MLU6 sibling (vsSPC5606BF1MLU6R)
- Automotive-grade thermal envelope vs the SPC5646 upgrade part (vsSPC5646CCF0VLU1R)
- Cross-brand AURIX grade 0 option for higher-reliability systems (vsSAK-TC234LP-32F200N)
Ghi chú thiết kế
The SPC5607BF1VLU6R's 176-LQFP package has a thermal pad that should be soldered to a top-layer copper pour of at least 25x25 mm for thermal conduction. At full 64 MHz activity with all peripherals running, expect 200-400 mW dissipation on the die, which translates to a 12-25 C junction rise on a properly thermal-coupled 4-layer board. For under-hood placements where ambient reaches +105 C, ensure the thermal pad ties to the inner GND plane with 4 thermal vias to spread heat uniformly.
Estimated: place one 100 nF ceramic + one 4.7 uF decoupling capacitor adjacent to each VDD/VDDA pin pair (the 176-LQFP has approximately 6 VDD pin pairs) and route the analog AVDD through its own RC-filtered regulator from the digital 3.3V supply. Keep JTAG/Nexus trace lengths under 50 mm and route them over a continuous ground strip for reliable boundary-scan and high-speed Nexus operation. Adhere to the reference layout in the MPC5604B/C/D family reference manual rev 4.
Always confirm the suffix code (VLU6, MLU6, VLU6R, etc.) when ordering - the suffix changes peripheral channel count and pinout in subtle ways across the SPC5607B family. Common design errors include omitting external CAN transceivers (the integrated FlexCAN controller is a protocol engine, not the physical layer) and forgetting the external RESET pull-up to the AUX voltage domain. Do not assume e200z0h performance equals e200z4h throughput when migrating to higher-tier devices - cycle count differs by 1.5-2x.
The SPC5607BF1VLU6R supports 3.0V to 5.5V single-rail operation, but for optimal ADC accuracy supply VDD with a low-noise regulator filtered with 100 uH + 10 uF LC if the upstream rail is shared with motor drivers or LED backlights. Estimated: at 64 MHz core / all peripherals on / CAN at 1 Mbit, typical VDD current is 60-90 mA; budget 120 mA per device for final BOM worst-case calculations.
Thông tin tuân thủ
AEC-Q100 Grade 1 qualified per NXP product family certification. RoHS / REACH compliant per DigiKey distributor listing. Automotive product; not for non-automotive/consumer-channel release without PPAP paperwork.
