SPC5746CSK1MKU6 - Dual-Core 160MHz 3MB Flash MCU | NXP
MPN: SPC5746CSK1MKU6 ✓ Hoạt độngSPC5746CSK1MKU6 Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, sitting at the top of the embedded hierarchy: MCU -> embedded processor -> integrated circuit -> semiconductor. The MPC574x family belongs to NXP's automotive-grade Qorivva/SPC5 line of Power Architecture-based MCUs designed for safety-critical body, gateway, and industrial control systems.
Key features of the SPC5746CSK1MKU6 include dual-core lockstep-capable processing for functional safety support, a hardware security module (HSM) that protects ECUs against attack scenarios, enhanced low-power modes for efficient operation, and rich mixed-signal peripherals including 10-bit and 12-bit ADCs. The device provides up to 147 GPIOs and operates from a 3.0 V to 3.6 V I/O supply across the -40 C to +125 C automotive temperature range.
Architecturally, the asymmetric dual-core e200 Power Architecture design allows the high-performance e200z4 core to run the main application while the e200z2 core handles diagnostics, communication stacks, or safety monitoring, improving determinism compared to single-core operation. According to NXP, the MPC574xB/C/G family provides a highly integrated, safe and secure single-chip solution for next-generation central body control, gateway, and industrial applications.
Typical applications include automotive central body control modules (BCM), vehicle network gateways handling CAN/LIN/FlexRay traffic, and industrial automation controllers requiring functional safety support and secure firmware storage.
Design consideration: the 176-LQFP package has a 0.5 mm pin pitch; verify your PCB fab supports this geometry and use the exposed pad for thermal relief and ground integrity.
This page synthesizes verified distributor pricing, drop-in family alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho SPC5746CSK1MKU6 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với SPC5746CSK1MKU6 (cùng hình factor và footprint) — khác nhau ở ADC Resolution, Core Architecture, Number of I/Os, Operating Temperature, Product Family.
SPC5746BSK1MKU2
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →SPC5748GHK0AMKU6
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5744PFK1AMLQ9
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5746RK1MLU3
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SPC5644AF0MLU1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →SPC5746CSK1MKU6 Tỷ lệ tối đa & tính chất điện
| Core Architecture | 32-bit dual-core e200z2 + e200z4 (Power Architecture) |
| Core Frequency | 80 MHz (e200z2) / 160 MHz (e200z4) |
| Program Memory (Flash) | 3 MB (3M x 8) |
| RAM | 384 KB |
| Hộp | 176-LQFP (24x24 mm), exposed pad |
| Kiểu lắp đặt | Surface Mount |
| Number of I/Os | 147 (per family comparison data) |
| I/O Supply Voltage | 3 V to 3.6 V |
| ADC Resolution | 10-bit, 12-bit |
| Nhiệt độ hoạt động | -40 C to +125 C |
| Security | Hardware Security Module (HSM) |
| Functional Safety | Safety mechanism support (per NXP family description) |
| Product Family | MPC574xB/C/G (Qorivva/SPC5) |
| Trạng thái RoHS | Compliant (per distributor listings) |
Hướng dẫn cấu hình chân SPC5746CSK1MKU6 176-lqfp (24x24 mm), exposed pad
Cấu hình chân cho SPC5746CSK1MKU6 (176-lqfp (24x24 mm), exposed pad gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho SPC5746CSK1MKU6.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
SPC5746CSK1MKU6 phù hợp cho 6 Áp dụngs: Automotive Central Body Control Module (BCM), Vehicle Network Gateway, Industrial Automation Controllers, Secure ECU Firmware and Key Management, ADAS Domain Boundary and Sensor Hub Nodes, Low-Power Telematics and Always-On Nodes.
Automotive Central Body Control Module (BCM)
The SPC5746CSK1MKU6 fits central body control modules because it combines dual-core processing (e200z4 at 160 MHz for the application, e200z2 at 80 MHz for diagnostics) with 3 MB of Flash for large feature sets such as lighting, access, and wiper control. NXP explicitly positions the MPC574xB/C/G family for next-generation central body control. In this role the MCU drives 147 multiplexed GPIOs through external high-side drivers, samples load diagnostics via its 10/12-bit ADCs, and its hardware security module protects immobilizer and key-management functions. The exposed-pad 176-LQFP aids thermal dissipation in the confined BCM enclosure.
Được đề xuất
Vehicle Network Gateway
Gateway ECUs aggregate CAN, CAN FD, LIN, and Ethernet traffic, and the SPC5746CSK1MKU6 provides the deterministic headroom for this: the 160 MHz e200z4 core executes routing stacks while the 80 MHz e200z2 core independently handles network management and security tasks. Its 384 KB of on-chip RAM buffers message queues without external memory, and 3 MB of Flash stores firmware plus a hardware security module (HSM) for secure onboarding of ECUs, per NXP's family description. Typical designs pair it with NXP CAN transceivers (e.g., TJA1044) and Ethernet PHYs, using the MCU's DSPI and FlexRay-capable interface controllers for deterministic in-vehicle backbone communication.
Được đề xuất
Industrial Automation Controllers
In industrial control, the SPC5746CSK1MKU6 serves as a safety-supporting main controller: NXP lists industrial applications as a primary MPC574xB/C/G use case, citing functional safety support and enhanced low-power capability. The dual-core split lets one core execute the control loop (using eMIOS timers and 12-bit ADC feedback) while the second core supervises plausibility and communication. 3 MB Flash accommodates field-updatable application firmware plus a secure boot chain guarded by the hardware security module. The -40 C to +125 C rating and 3.0-3.6 V I/O operation match industrial 24 V systems front-ended by a 3.3 V buck regulator.
Được đề xuất
Secure ECU Firmware and Key Management
Any ECU that stores cryptographic keys or runs secure OTA updates benefits from the SPC5746CSK1MKU6's integrated hardware security module, which per NXP protects ECUs against various attack scenarios. The 3 MB Flash provides room for application code, bootloader, and key storage zones with hardware-enforced access control. In a secure-gateway or telematics ECU, the HSM performs AES/ECC operations offload from the 160 MHz e200z4 core, keeping the main application deterministic while cryptographic sessions run. The automotive -40 C to +125 C temperature range and 176-LQFP exposed-pad package fit standard ECU PCB processes without special thermal design.
Được đề xuất
ADAS Domain Boundary and Sensor Hub Nodes
While not an ADAS compute processor, the SPC5746CSK1MKU6 is often used at the domain boundary as a safe, secure data concentrator between sensor nodes and the central compute unit. Its dual-core 80/160 MHz pairing handles packet preprocessing and health monitoring, 384 KB RAM buffers sensor frames, and functional safety support aligns with ASIL-oriented architectures per NXP's family positioning. The 10/12-bit ADCs allow local analog telemetry from power and sensor supplies. Designs typically front it with a buck regulator and pair it with high-speed CAN FD transceivers, using the e200z2 core to supervise the safety-relevant data path.
Được đề xuất
Low-Power Telematics and Always-On Nodes
NXP highlights enhanced low-power capabilities across the MPC574xB/C/G family, providing increased functionality with more efficient operation. For telematics units and always-on body nodes that must wake on CAN/LIN activity while sipping current from the battery, the SPC5746CSK1MKU6 supports standby modes from which the 80 MHz e200z2 domain or wake logic restarts the system. The 3 MB Flash retains dual-bank images for OTA updates, and the HSM secures cellular-connected communication. Pairing with a low-quiescent-current SBC and partial-networking CAN transceiver achieves the microamp-level sleep budget these nodes require.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho SPC5746CSK1MKU6 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | SPC5746BSK1MKU2 | SPC5748GHK0AMKU6 | SPC5744PFK1AMLQ9 | SPC5644AF0MLU1 |
|---|---|---|---|---|---|
| Package | 176-LQFP (24x24 mm), exposed pad | 176-LQFP - same | 176-LQFP - same (MKU6) | 176-LQFP - same | 176-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Configuration | Dual-core e200z2 80 MHz + e200z4 160 MHz | Dual-core, same family | Multi-core G-series, higher integration | Dual-core, lower memory grade | e200z0h + e200z4d, 120 MHz max |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C (A-grade class) | -40 C to +125 C |
Bảo phân biệt quan trọng
- Integrated hardware security module (HSM) (vsSPC5644AF0MLU1)
- More RAM for gateway buffering (vsSPC5644AF0MLU1)
- Higher main core clock (vsSPC5644AF0MLU1)
- Flash cost-down path within same footprint (vsSPC5746BSK1MKU2)
Ghi chú thiết kế
Power the SPC5746CSK1MKU6 from a clean 3.3 V rail within 3.0-3.6 V on the I/O supply. The MPC574x integrates internal LDOs for the core domain; place the required decoupling capacitors specified in the NXP reference manual directly on the VDD_LDO output pins with short, wide traces. Estimated: at 160 MHz with peripherals active, core current is typically in the hundreds of milliamps range (exact figure per datasheet power table), so budget the upstream buck for at least 500 mA headroom plus peripheral loads. Use a power SBC such as the MC33907 for automotive reset and wake supervision.
The 176-LQFP has a 0.5 mm pin pitch - confirm your fabrication house supports this geometry and specify solder-mask-defined or non-solder-mask-defined pads per IPC-7351 guidance for LQFP. The exposed pad on the package bottom must be soldered to a grounded copper keep-out with a via array (estimated: 5x5 via grid under the pad) to serve as the main ground and thermal path. Route JTAG/Nexus debug pins to a standard SPC5 debug connector during layout; adding them later on a 0.5 mm pitch board is very difficult.
Pin multiplexing is the most common integration error on this device: many of the 147 I/Os share functions across CAN, LIN, DSPI, eMIOS, and ADC channels, so always configure the SIUL multiplexing registers against the NXP reference manual tables, not assumptions from other MPC574x variants. Second pitfall: migrating code from the SPC5644 predecessor - the memory map and peripheral base addresses differ substantially despite architectural similarity. Third: never exceed 3.6 V on I/O rails during hot-plug or transient conditions; add TVS protection on external connector-facing lines.
Thông tin tuân thủ
Automotive-qualified MPC574x family part per NXP product positioning; RoHS compliance indicated by distributor listings. REACH, halogen-free, and conflict-minerals statuses should be confirmed on the NXP product page certificate of conformance.
