TC222L16F133NACKXUMA1 - AURIX 32-Bit MCU 133MHz 1MB Flash | Infineon
MPN: TC222L16F133NACKXUMA1 ✓ Hoạt độngTC222L16F133NACKXUMA1 Tóm tắt
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, peripherals, and interrupt control on one die. AURIX TriCore combines a RISC-like microcontroller core, a DSP arithmetic unit, and a super-scalar pipeline in one ISA, allowing efficient mixed control-and-signal-processing workloads. The TC22xL belongs to the AURIX microcontroller family, which itself sits within Infineon's embedded processing portfolio and the broader 32-bit automotive MCU category alongside Traveo and PSoC families.
Key features of the TC222L16F133NACKXUMA1 include 3 CAN nodes, 133 MHz maximum TriCore clock, 1 MB Flash with 96 KB SRAM, and a 12-bit A/D converter with up to 16 input channels for analog sensing. The device also integrates timers, ASCLIN SPI/UART, and hardware security modules (HSM) for secure boot and cryptographic acceleration. Automotive-grade qualification and a -40C to +125C (or higher) junction-temperature range make it suitable for under-hood and chassis ECUs. Peripheral integration reduces external component BOM compared with discrete MCU plus external ADC designs.
Typical applications for TC222L16F133NACKXUMA1 cover electric power steering (EPS), electronic stability control (ESC), airbag systems, body control modules (BCM), and transmission control units (TCU). It is also used in sensor fusion ECUs and zone controllers in zonal vehicle E/E architectures. The integrated HSM and lockstep-capable timers make it a popular choice for ASIL-B/D rated subsystems in next-generation vehicle designs.
When designing with this part, ensure PCB layout follows the exposed-pad thermal recommendations - the die is thermally coupled to the package bottom pad and must be soldered to a sufficiently large copper area. The 80-pin TQFP-80 (HTFQFP) footprint requires a 0.5 mm pitch land pattern; reflow profile must respect the moisture-sensitivity level printed on the reel label. Always refer to the Infineon AURIX TC22xL datasheet family for full register definitions and HSM provisioning steps.
This page synthesizes distributor pricing tiers, drop-in AURIX family alternatives, and practical automotive-ECU design notes not collected in any single manufacturer datasheet revision.
Bộ thay thế dễ dàng lắp đặt cho TC222L16F133NACKXUMA1 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với TC222L16F133NACKXUMA1 (cùng hình factor và footprint) — khác nhau ở Package, Core Architecture, Program Memory (Flash), Maximum Clock Frequency, CAN Nodes.
SAK-TC222L-16F133N AC
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
TC222L16F133NACLXUMA1
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
SAK-TC233L-32F200F
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →SAK-TC234LP-32F200N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →SAK-TC213L-8F133F
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →TC222L16F133NACKXUMA1 Tỷ lệ tối đa & tính chất điện
| Core Architecture | TriCore AURIX TC2xx (32-bit) |
| Tần số xung maksimum | 133 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM (incl. Cache) | 96 KB |
| CAN Nodes | 3 |
| ADC | 12-bit, up to 16 channels |
| Supply Voltage (Core) | 1.3 V (typ.) |
| I/O Voltage | 3.3 V / 5 V (per datasheet) |
| Number of I/O | 59 |
| Hộp | PG-TQFP-80-7 (HTFQFP, exposed pad) |
| Terminal Form | GULL WING |
| Number of Terminals | 80 |
| Kiểu lắp đặt | Surface Mount |
| Temperature Grade | Automotive |
| Lead Pitch | 0.5 mm |
| Family | AURIX TC22xL Series 1 |
| Core Count | Single Core |
Hướng dẫn cấu hình chân TC222L16F133NACKXUMA1 pg-tqfp-80-7 (htfqfp, exposed pad)
Cấu hình chân cho TC222L16F133NACKXUMA1 (pg-tqfp-80-7 (htfqfp, exposed pad) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho TC222L16F133NACKXUMA1.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
TC222L16F133NACKXUMA1 phù hợp cho 6 Áp dụngs: Electric Power Steering (EPS) ECU, Electronic Stability Control (ESC) Module, Airbag / Restraint Control Unit, Body Control Module (BCM), Transmission Control Unit (TCU), Sensor Fusion ECU / Zonal Controller.
Electric Power Steering (EPS) ECU
The TC222L16F133NACKXUMA1 fits electric power steering ECUs thanks to its 133 MHz TriCore, 96 KB SRAM and 3 CAN nodes for torque sensor fusion and vehicle CAN bus communication. Its lockstep-capable timers and automotive-grade temperature rating support ASIL-B/D decomposition typical of EPS safety targets. The 1 MB ECC Flash accommodates torque-control and vehicle-state firmware plus bootloader for field updates. Compared to discrete MCU+ADC designs, the integrated 12-bit ADC with 16 channels removes external signal-conditioning cost while maintaining deterministic interrupt latency for steering-loop control.
Được đề xuất
Electronic Stability Control (ESC) Module
The TC222L16F133NACKXUMA1 is well suited for ESC modules where wheel-speed and yaw-rate data are sampled at high rate and ASIL-D braking decisions are required. Its 133 MHz TriCore performs sensor fusion and control-law computation while the 1 MB Flash stores the safety firmware with ECC. Three CAN nodes expose the vehicle dynamics CAN, brake-by-wire CAN-FD, and diagnostic CAN channels simultaneously. The exposed-pad TQFP-80 package keeps thermals manageable in the underbody ECU enclosure.
Được đề xuất
Airbag / Restraint Control Unit
For airbag restraint ECUs, the TC222L16F133NACKXUMA1 offers lockstep timer pairs and the integrated HSM to satisfy ASIL-D requirements for crash-event detection and deployment logic. Its 133 MHz processing headroom handles sensor-fusion across peripheral acceleration sensors and satellite crash sensors. The 96 KB SRAM is sufficient to stage event-data-record (EDR) buffers before non-volatile write-out. The automotive-grade TQFP-80 package is qualified for the harsh thermal environment of the vehicle tunnel mounting location.
Được đề xuất
Body Control Module (BCM)
In body control modules, the TC222L16F133NACKXUMA1 acts as the central coordinator for lighting, wipers, door modules, and HVAC actuators. Its 3 CAN nodes plus ASCLIN SPI/UART channels bridge body-CAN, LIN sub-buses, and the diagnostic CAN channel. The 1 MB Flash stores the BCM application image plus bootloader for OEM over-the-air updates. The exposed-pad TQFP-80 supports the BCM housing's thermal envelope while the 12-bit ADC handles mixed analog sensor inputs (battery voltage, illumination, temperature).
Được đề xuất
Transmission Control Unit (TCU)
The TC222L16F133NACKXUMA1 powers transmission control units where dual-clutch or automatic transmission shifting logic must execute within tight time budgets. Its 133 MHz TriCore and lockstep timers meet the ASIL-C/D targets for shift-by-wire functions. Three CAN nodes handle powertrain CAN, hybrid CAN-FD, and diagnostic links. The 1 MB ECC Flash stores gear-map calibrations and adaptives, while the 96 KB SRAM supports transient shift-state buffers and observer data.
Được đề xuất
Sensor Fusion ECU / Zonal Controller
Modern zonal vehicle E/E architectures use the TC222L16F133NACKXUMA1 as a zonal controller that aggregates radar, camera, and ultrasonic sensor data over CAN-FD and forwards it to a central compute domain controller. Its 133 MHz TriCore runs pre-processing filters before forwarding raw or fused data. Three CAN nodes plus ASCLIN SPI/UART enable multi-bus sensor aggregation. The automotive temperature grade and exposed-pad TQFP-80 support zonal mounting positions such as wheel wells or behind bumpers where temperatures swing widely.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho TC222L16F133NACKXUMA1 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | SAK-TC222L-16F133N AC | TC222L16F133NACLXUMA1 | SAK-TC233L-32F200F | SAK-TC234LP-32F200N | SAK-TC213L-8F133F |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | PG-TQFP-80-7 (HTFQFP) | PG-TQFP-80-7 - same | PG-TQFP-80-7 - same | TQFP-100 - different | TQFP-144 - different | TQFP-80 - same |
| Core Clock | 133 MHz | 133 MHz | 133 MHz | 200 MHz | 200 MHz | 133 MHz |
| Program Flash | 1 MB | 1 MB | 1 MB | 2 MB | 2 MB | 0.5 MB |
| SRAM | 96 KB | 96 KB | 96 KB | 192 KB | 192 KB | 72 KB |
| CAN Nodes | 3 | 3 | 3 | 4 | 6 | 3 |
| AURIX Family | TC22xL | TC22xL | TC22xL | TC23xL | TC234LP | TC213L |
| Temperature Grade | Automotive | Automotive | Automotive | Automotive | Automotive | Automotive |
Bảo phân biệt quan trọng
- Same silicon die as SAK-TC222L-16F133N AC ordering code (vsSAK-TC222L-16F133N AC)
- Lower BOM cost than TC234LP-32F200N at same clock tier (vsSAK-TC234LP-32F200N)
- Same footprint as TC213L-8F133F with double the Flash (vsSAK-TC213L-8F133F)
Ghi chú thiết kế
The PG-TQFP-80-7 package has an exposed thermal pad on the underside that must be soldered to a copper pour of at least 25 mm x 25 mm on the top layer for the rated thermal performance. Estimated: with 1 W dissipation and a 25x25 mm 1-oz copper pour on a 4-layer FR4 board, theta_JA is roughly 25 C/W, yielding a 25 C junction temperature rise above ambient. For under-hood mounting where ambient reaches +85 C, the junction stays well within the automotive-grade limit. Stencil aperture for the thermal pad should be split into a 3x3 grid with 50% coverage for reliable void-free solder joints.
Route the 1.3 V core supply (VCC) and 3.3 V/5 V I/O supply (VDDP) traces as wide-star topologies from dedicated LDO outputs. Place 100 nF X7R decoupling capacitors within 2 mm of each supply pin pair and add 4.7 uF bulk capacitors near the exposed pad. The TC222L16F133NACKXUMA1 uses a separate analog supply (VDDA) for the 12-bit ADC - isolate VDDA with a ferrite bead from VCCP and decouple with 100 nF plus 10 uF to keep ADC noise below 1 LSB.
Do not confuse the K-suffix (TC222L16F133NACKXUMA1) with the L-suffix (TC222L16F133NACLXUMA1): both are the same silicon die but ship on different reel orientations. For prototype builds always request the AURIX TC22xL datasheet family PDF (not the per-order code) to access register definitions and HSM provisioning steps. Mis-wiring the TCK/TMS JTAG pins can lock the device - the Infineon AURIX debug tool supports an unlock sequence but production programming should use the secure bootloader path instead.
Route the three CAN node signals as differential pairs with 120-ohm characteristic impedance and place the CAN transceiver within 50 mm of the MCU pins to minimize stub lengths. The ASCLIN SPI signals should be length-matched within 5 mm if used to drive external ADC or DAC peripherals. Avoid routing digital switching signals across the analog supply island - the 12-bit ADC is susceptible to digital crosstalk on VDDA.
Thông tin tuân thủ
AURIX TC22xL sub-family is qualified to Infineon automotive-grade reliability flow and is widely deployed in AEC-Q100 contexts. RoHS and REACH compliance statements are available on the Infineon product page. Halogen-free and lead-free per package marking.
