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Quectel SE200ZC-AP module: five-camera Rockchip RV1126B design for vision BOMs

Quectel SE200ZC-AP module pairs Rockchip RV1126B/BJ SoC with a 3 TOPS NPU and up to five 12MP cameras for vision BOMs in security, robotics, and industrial lines.

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TL;DR — 三句話摘要

  • Quectel SE200ZC-AP is a 40 x 40 mm smart module on Rockchip RV1126B/BJ with 3 TOPS NPU and a 12MP ISP plus 8MP AI-ISP. (S1)
  • The module supports up to five 12MP cameras via two 4-lane MIPI CSI and one DVP interface. (S1)
  • Memory options are 1GB / 2GB / 4GB LPDDR4x with 64GB eMMC; industrial grade covers -35°C to +80°C. (S1)

取自 key_takeaways (實際欄位,最多 3 筆)。事實與分析分別標示。

Quectel SE200ZC-AP module: five-camera Rockchip RV1126B design for vision BOMs — New Products news briefEditorial cover for a New Products brief. Gear motif; headline "Quectel SE200ZC-AP module: five-camera Rockchip RV1126B design for vision BOMs". Reported key numbers: 64 GB eMMC. 1 cited source. Static cover (no animation).NEW PRODUCTS · NEWS BRIEFQuectel SE200ZC-AP module: five-cameraRockchip RV1126B design for vision BOMsREPORTED KEY NUMBERS64 GB eMMC1 sourceXAIPART
Cover image generated from data already shown on this page: the category motif, the headline, and reported key numbers. No decorative illustration; no third-party image.

您來自 AI 回答 — 這是可驗證的原始內容

AI 摘要可能遺漏了其主張的依據。原始預測、受影響零件及每一項引用皆在本頁,且均可追溯至其來源。

XAIPART 預測

本簡報包含可證偽的預測。

受影響零件

此報導無目錄相符項目 — 寧可不顯示,也不推斷相符。

Reported by CNX-Software on 2026-09-24. Summarized and analyzed by XAIPART Editorial.

What happened

Quectel has launched the SE200ZC-AP, a compact 40 x 40 mm smart module built around the Rockchip RV1126B or RV1126BJ quad-core Arm Cortex-A53 SoC, with the BJ variant designated as the industrial-grade option.S1 The module integrates a 12MP ISP, an 8MP AI-ISP, and a 3 TOPS NPU, and is positioned for smart security, industrial automation, autonomous vehicles, robotic vision, and smart home applications.S1

For camera input, the SE200ZC-AP supports up to five 12MP cameras through two 4-lane MIPI CSI interfaces plus one DVP interface.S1 Peripheral connectivity includes Gigabit Ethernet, USB 3.0/2.0, two CAN FD, up to eight UART, six I2C, two SPI, two SDIO, three SAI, 22 ADC channels, 28 PWM outputs, and up to 115 GPIOs.S1

Memory and storage options are 1GB, 2GB, or 4GB LPDDR4x with 64GB eMMC flash.S1 Quectel offers commercial and industrial grades with operating temperature ranges of -25°C to +75°C and -35°C to +80°C respectively.S1

Key numbers
MetricReported valueSource
Module footprint40 x 40 mmS1
SoCRockchip RV1126B or RV1126BJ (industrial)S1
CPUQuad-core Arm Cortex-A53S1
ISP / AI-ISP / NPU12MP ISP, 8MP AI-ISP, 3 TOPS NPUS1
Camera supportUp to 5 x 12MP cameras (2x 4-lane MIPI CSI + 1x DVP)S1
RAM options1GB / 2GB / 4GB LPDDR4xS1
Flash64GB eMMCS1
Commercial temperature-25°C to +75°CS1
Industrial temperature-35°C to +80°CS1
PricingNot disclosedS1
Lead timeNot disclosedS1

Background timeline

  1. No prior milestones disclosed by the source.

XAIPART take

Technical impact

Five-camera concurrency on a 40 x 40 mm module is the headline feature; two 4-lane MIPI CSI lanes plus a DVP port let engineers route two high-bandwidth 12MP sensors and one legacy parallel sensor on the same carrier. XAIPART analysis

The 3 TOPS NPU is modest by 2026 standards and is best matched to lightweight CV tasks (person/vehicle detection, intrusion zones) rather than transformer-class perception stacks; designs needing higher TOPS should plan a second accelerator. XAIPART analysis

Market impact

Quectel adds another Rockchip-based entry to its smart-module catalog, expanding the SoC options for vision SKUs alongside the better-known Qualcomm and MediaTek variants. XAIPART analysis

For procurement, the industrial-grade RV1126BJ variant with the -35°C to +80°C range addresses outdoor and factory-floor enclosures without a separate ruggedized SKU, reducing BOM complexity for security and AMR designs. XAIPART analysis

Action

Request the RV1126BJ industrial-grade part number, the exact 4GB LPDDR4x + 64GB eMMC ordering code, and the supported Yocto / Linux BSP version before locking the schematic. XAIPART analysis

Map the two MIPI CSI ports and the DVP port against the chosen sensor mix (e.g. two IMX678 + one OV5640) and confirm 22 ADC / 28 PWM / 115 GPIO counts against the carrier I/O budget before commitment. XAIPART analysis

XAIPART Forecast

XAIPART expects Quectel to publish an official SE200ZC-AP datasheet with a unit price below $80 for the 2GB commercial-grade variant by 2027-03-31; if published 1k-unit pricing does not fall below $80 by 2027-03-31, this forecast is wrong. XAIPART analysis

Facts are as reported by the cited source. The design-in, sourcing and forward-looking statements above are XAIPART's analysis, not the source's claims. Pricing, lead time, BSP roadmap and FCC/CE certification status were not disclosed in the source and remain unconfirmed.

Corrections: none at publication. This brief will be updated with a timestamp if the source corrects its report.

替代品與生命週期

已建檔的替代品——目錄範圍,並非市場排名
零件關係生命週期依據
— 檔案中無替代品 需要資料 — 需要 match_type 在任何前代標籤出現之前

「前代」與「替代」標籤僅來自已記錄的相符類型、生命週期狀態或來源文字。未記錄相符項目時,不顯示任何標籤。我們自家的刊登內容不構成市場參考。

值得關注

可證偽預測 — 門檻、時間窗與目前狀態。已證偽的預測仍保留可見。
主張門檻作者狀態
XAIPART expects Quectel to publish an official SE200ZC-AP datasheet with a unit price below $80 for the 2GB commercial-grade variant by 2027-03-31 published 1k-unit pricing does not fall below $80 by 2027-03-31 Pending

事後證明錯誤的預測會保留可見並加以標記。我們不會刪除。

受影響零件

無目錄相符項目。 此消息未對應到 XAIPART 目前上架的任何零件。我們不會推測相符項目,也不會顯示佔位清單。

各維度成本壓力

Source: FRED · Generated · reference output z and composite are algorithm outputs, not a fetch snapshot

Cost pressure by dimension — composite stateDiverging bars for three dimensions around a zero midpoint. Input Cost has no reading; Supply Demand z -1.4711, notable; Fx Energy z 0.1754, neutral. Composite index -9.7, band neutral.0Input costno readingSupply/demandz −1.4711 · notable46 dFX & energyz +0.1754 · neutral5 dcomposite −9.7 · neutral−100 · −40 · −15 · 0 · +15 · +40 · +100
Underlying values — copyable for verification.
DimensionFRED series IDUnitLagAs of
Input costPCOPPUSDM, PALUMUSDM, PNICKUSDMUSD/mt52 d
Supply/demandPCU334413334413, IPG3344Sindex(1982=100) / index(2017=100)46 d
FX & energyDEXCHUS, DCOILBRENTEU, DHHNGSPrate / USD/bbl / USD/MMBtu5 d

No free authoritative interface for: gold · silver · rare earth · polysilicon · lithium carbonate · market share — listed rather than approximated.

本內容的產生方式

流程證據 — 擷取、來源合理性、模型與閘門
此簡報的稽核軌跡
Source fetched CNX-Software · www.cnx-software.com · 2,011 chars · fetch status success
Source sanity (S1) ok — passed before any model call (no s1_ block recorded)
Model / prompt MiniMax-M3 · prompt Blog Agent - News Summary (v2.8-final) · 6,580 tokens · 23s · run completed
Gate verdict pass · 6/6 applicable checks passed · spec v2.9 · C10 ratio 0.112179 · C10 rounds 0

上述每一列皆由流程產生,並非人工撰寫。

編輯評分

確定性閘門結果 — 純 PHP,判定過程無模型參與
閘門評分明細 6 項適用檢查, 6通過: 100 百分比. No hold items or mandatory failures. Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5972. 適用檢查已通過 6 / 6 = 100% · 判定: pass No hold items or mandatory failures Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5972 是否發布由審核關卡決定。獨立稽核分數僅供參考。
發現錯誤? 告訴我們哪裡有誤 ——更正會與原文一同發布並記錄。我們不會默默修改文章。

留言

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來源

  1. Quectel SE200ZC-AP smart module supports up to five cameras with Rockchip RV1126B/BJ SoC — https://www.cnx-software.com/2026/09/24/quectel-se200zc-ap-smart-module-supports-up-to-five-cameras-with-rockchip-rv1126b-bj-soc/ · rss · 存取於

事實標記為 S1/S2,並可追溯至連結來源。標示為 分析 是 XAIPART 自身的推理,與報導事實分開保留。來源連結會被追蹤,而非 nofollow ——署名為刻意為之。