FPGA 與 CPLD
產品（7,300+)
EP3C10U256I7 - 10,320-Cell Industrial FPGA | Intel
The Intel EP3C10U256I7 is a Cyclone III field-programmable gate array with 10,320 logic cells, 182 I/O, 423,936 RAM bits, and a maximum clock frequency of 437.5 MHz. The device is manufactured in 65 nm technology, operates from a 1.2 V core supply, and is supplied in a square 256-LFBGA surface-mount package. Its ordering code identifies an industrial-temperature option in the 256-ball package configuration. A field-programmable gate array is a semiconductor device whose digital logic, memory, and interface functions are configured after manufacture. FPGAs belong to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmable logic, and application-specific integrated circuits. Unlike a fixed-function microcontroller, an FPGA can implement parallel data paths, protocol bridges, signal processing, control logic, and hardware acceleration in one configurable device. The Cyclone III name identifies Intel's low-cost FPGA family. The verified device information identifies 10,320 logic cells and 182 user I/O, providing a substantial parallel-logic resource for industrial control, communications, image processing, and embedded systems. The device includes 423,936 RAM bits for buffers, lookup tables, packet storage, and data-path state. Its 437.5 MHz maximum frequency supports high-speed digital logic, although practical system performance also depends on the selected design, I/O standard, memory interface, and timing constraints. The EP3C10U256I7 uses a 65 nm process and a 1.2 V core voltage, combining a relatively compact logic implementation with a large ball-grid package. The 256-LFBGA package provides 256 physical balls and a square footprint intended for surface-mount assembly. Because the supplied source describes the package as LFBGA while another search result describes the device as UBGA, engineers should confirm the exact ball map, ball-pitch dimensions, and mechanical drawing against the manufacturer documentation before releasing a PCB footprint. Typical applications include industrial control modules, programmable logic controllers, networking interfaces, motor-control systems, data-acquisition equipment, and embedded video or image-processing designs. The 182 I/O count can support multiple external interfaces, while the logic-element and RAM resources allow parallel control and buffering functions to be consolidated into a single FPGA. PCB design should account for all 256 package balls, including power, ground, configuration pins, and user I/O. The design must provide clean 1.2 V core power, suitable I/O voltage domains, decoupling, and a compatible configuration interface. Signal-integrity, thermal, and board-layout decisions should follow the official Cyclone III device documentation rather than distributor summaries alone. This product record combines verified distributor pricing, device attributes, package information, and application-oriented engineering guidance. It also distinguishes a documented no-lead package option from broader FPGA alternatives that use different packages, densities, or architectures and therefore are not treated as drop-in replacements.
EP3C120F484C7N - Cyclone III FPGA 119K LE 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484C7N is a high-density Cyclone III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 embedded 18x18 multipliers in a 484-ball FineLine BGA package. Fabricated on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports I/O voltages from 1.2 V to 3.3 V via eight I/O banks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP blocks. FPGAs occupy a unique position in the digital hierarchy between fixed-function ASICs (more integration, higher NRE) and microcontrollers (less flexibility, lower performance), offering hardware-level parallelism and reconfigurable logic for high-throughput signal processing, glue logic, and rapid prototyping. Key features of the EP3C120F484C7N include up to 472 MHz internal operation, four phase-locked loops (PLLs) for clock management, 20 global clock networks, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The 484-pin FBGA package (23 x 23 mm, 1.0 mm pitch) provides robust thermal and electrical performance suitable for industrial-temperature designs, while the Cyclone III family architecture eliminates the need for dedicated configuration devices when using active serial (AS) configuration from low-cost EPCS flash. Architecturally, the EP3C120F484C7N combines logic elements organized into Logic Array Blocks (LABs), each containing 16 LEs plus associated carry and control logic. The embedded multiplier blocks support 18x18 signed multiplication natively, and the M9K memory blocks deliver true dual-port operation at 315 MHz, enabling simultaneous read/write access to the same storage location without arbitration. Typical applications include industrial motor control, video processing and display controllers, software-defined radio, telecommunications line cards, ASIC prototyping, and embedded vision systems. The combination of high logic density and low static power consumption also makes Cyclone III devices attractive for portable and thermally constrained designs where larger FPGAs would be impractical. When designing with this device, carefully plan I/O bank assignments to avoid mixed-voltage conflicts and ensure the PLL reference clock inputs meet the jitter specifications of the targeted data rate. The Quartus II design software (version 13.0 and earlier) is the canonical toolchain for compilation, fitting, and timing closure. This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone.
EP3C120F484I7 - 119K LEs Cyclone III FPGA 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484I7 is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 user I/Os in a 484-ball FineLine BGA package. Built on a low-power 65 nm process, the device operates from a 1.2 V core supply and supports industrial temperature grades from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that lets engineers implement arbitrary digital logic, memory blocks, and DSP functions on a single die after manufacturing. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLD) -> logic ICs -> integrated circuits, sitting alongside CPLDs and ASICs as a flexible alternative to fixed-function chips. FPGAs such as Cyclone III are commonly used in cost-sensitive, high-volume applications where ASIC NRE is unjustified but ASSP flexibility is insufficient. Key specifications of the EP3C120F484I7 include 119,088 logic elements, 3,981,312 bits of RAM, 576 embedded 18x18 multipliers, and 4 PLLs for clock management. The 484-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch and supports up to 283 user I/Os across 8 I/O banks. Peripherals and hard IP blocks include embedded memory blocks (M9K), a configuration interface, and high-speed LVDS support on selected pins. The Cyclone III architecture uses an SRAM-based LUT fabric with dedicated routing, M9K memory blocks, and 18x18 multiplier blocks for DSP workloads. Compared to earlier Cyclone generations, Cyclone III introduced a 65 nm process node that cut core power by roughly 50 percent while raising logic density, making the EP3C120F484I7 suitable for power-sensitive designs that still need very large logic capacity. Typical applications include industrial motor control, video processing pipelines, software-defined radio prototyping, and high-volume telecom line cards. The 283 available user I/Os also enable rich external connectivity for memory expansion, parallel sensor buses, and high-speed LVDS interfaces. When designing with the EP3C120F484I7, ensure all eight I/O banks are powered from rails within their respective VCCIO ranges and that decoupling follows Altera's power distribution network guidance. Configuration via JTAG or a passive serial EPCS device should be planned early to minimize board rework. This page consolidates distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical design notes that supplement the manufacturer datasheet with information useful for sourcing and second-source decisions.
EP3C120F484I7N - Cyclone III FPGA 119K LE | 484-FBGA | Intel
The Intel (formerly Altera) EP3C120F484I7N is a high-density Cyclone III Field-Programmable Gate Array delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 283 18x18 multipliers in a 484-pin FineLine BGA (FBGA-484) package. It is built on a low-power 65 nm TSMC process and supports internal operating frequencies up to 472 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the factory. FPGAs sit between general-purpose microcontrollers and fixed ASICs in the programmable-logic hierarchy: microcontrollers run software sequentially, FPGAs run massively parallel custom hardware, and ASICs are faster but cannot be reconfigured. Cyclone III belongs to Intel's low-cost, low-power FPGA family, optimized for high-volume cost-sensitive applications. Key features include 119,088 logic elements distributed across 7,443 logic array blocks (LABs), 4 M9K embedded memory blocks totaling approximately 4 Mbits, 288 18x18 hardware multipliers for DSP, and 8 user I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates from a 1.15 V to 1.25 V core supply with separate VCCIO banks for I/O flexibility. Cyclone III uses a logic-element (LE) based fabric with 4-input LUTs, dedicated carry chains for arithmetic, and embedded RAM blocks. The -I7 speed grade places the part in the mid-fast tier; the -I7N suffix denotes the industrial temperature range (-40 °C to +100 °C ambient) and lead-free / Pb-free packaging. The 484-pin FBGA measures 23 mm x 23 mm with 1.0 mm pitch. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance prototypes, software-defined radio baseband, and high-volume consumer signal conditioning. Cyclone III FPGAs are pin-compatible across density grades within the same package, allowing board reuse as designs migrate from EP3C25 to EP3C120. When designing with the EP3C120F484I7N, ensure that all four dedicated clock input pins are routed cleanly and that the JTAG chain (TCK, TMS, TDI, TDO) is accessible for in-system programming with a USB-Blaster or compatible download cable. Decoupling follows the Quartus II reference schematic: 0.1 uF and 10 uF capacitors near each power pin. This page synthesizes distributor pricing, same-package alternatives, and Quartus II design considerations not found in the standalone datasheet.
EP3C120F780C7AD - Cyclone III FPGA 119K LE FBGA-780 | Intel
The Intel (formerly Altera) Cyclone III EP3C120F780C7AD is a low-power, high-volume SRAM-based Field-Programmable Gate Array (FPGA) integrating 119,088 logic elements in a 780-pin FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 65nm low-power process, this Cyclone III variant delivers up to 3.9 Mb of embedded memory, four phase-locked loops (PLLs), 531 multipliers, and 20 global clock networks, while consuming as little as 0.5 W of dynamic power at typical clock rates. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after fabrication. FPGAs sit within the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor, occupying the same engineering space as CPLDs, but offering far higher logic density, embedded RAM/DSP blocks, and high-speed transceivers in larger devices. Cyclone III specifically targets cost-sensitive, power-conscious volume applications such as video processing, motor control, automotive driver assistance, and industrial communication. Key features of the EP3C120F780C7AD include 119,088 logic elements (LEs), 3,981 Kbits (approximately 498 Kbytes) of embedded RAM organized as M9K blocks, 288 18x18 hardware multipliers for DSP, and four PLLs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 20 global clock networks, with user I/O counts in the 400+ range depending on package pinout. Configuration is supported through JTAG, Active Serial, and Passive Serial modes, with on-chip encryption (AES) for design security. The Cyclone III architecture uses a logic-element fabric with 8-input adaptive look-up tables (ALUTs), each capable of implementing any 6-input function or two independent 4-input functions. Embedded M9K memory blocks support true dual-port, simple dual-port, and single-port modes with parity bits, enabling efficient buffering, FIFO, and shift-register implementations. The DSP blocks natively support 18x18 multiplication with optional add/subtract/accumulate, eliminating the need for soft-multiplier inference in DSP pipelines. Typical applications for the EP3C120F780C7AD span HD video bridging and image processing, industrial motor control and servo drives, automotive infotainment and driver-assistance modules, telecommunications line cards, software-defined radio (SDR) baseband, and embedded industrial protocols such as EtherCAT, PROFINET, and EtherNet/IP. The combination of high logic count, on-chip DSP, and low power also makes it suitable for portable medical instrumentation and handheld test equipment. When designing with the EP3C120F780C7AD, plan the power budget across core, I/O, and PLL rails. Use the Quartus II PowerPlay early power estimator before layout to size decoupling and rail sequencing. Maintain controlled-impedance PCB traces for high-speed LVDS links, and route clock and PLL analog supplies through dedicated ferrite filters to minimize jitter.
EP3C120F780C7N - 119K Logic Element Cyclone III FPGA | Intel / Altera
The Intel (formerly Altera) Cyclone III EP3C120F780C7N is a high-density, low-power Field Programmable Gate Array (FPGA) built on a 65 nm low-k dielectric process, delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 hardware multipliers inside a 780-pin FineLine BGA (FBGA) package. The 'C7' speed grade supports a core clock rate up to 437.5 MHz while operating from a 1.2 V core supply, and the 'N' suffix denotes lead-free / Pb-free terminations compliant with RoHS. Cyclone III positioned the family for cost-sensitive, high-volume applications where Cyclone II was too small and Stratix families were over-spec. A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that lets designers implement arbitrary digital logic, memory blocks, and DSP functions by loading a configuration bitstream after PCB assembly. Within the broader semiconductor taxonomy, the EP3C120F780C7N sits inside the hierarchy programmable logic -> FPGA -> SRAM-based FPGA -> low-cost FPGA. Unlike ASICs, FPGAs can be reconfigured in the field, enabling rapid prototyping, late-stage design changes, and hardware reuse across product variants without respinning silicon. Key features of the EP3C120F780C7N include up to 531 embedded 18x18 multipliers for DSP, 4 PLLs with multiple outputs, support for external memory interfaces including DDR, DDR2, and QDR II SRAM, and 8 phase-locked clock networks. The device exposes up to 429 user I/O pins depending on configuration scheme and supports hot-socketing, joint Test Action Group (JTAG) boundary-scan, and Active Serial / Fast Active Parallel configuration modes via the dedicated configuration pins. Cyclone III also introduced dedicated hard IP for PCIe Gen1 soft cores implemented in fabric. Technically, the Cyclone III architecture uses 4-input look-up tables (LUT4) clustered into logic array blocks (LABs), with embedded M9K memory blocks that can be configured as RAM, ROM, or shift registers. The 65 nm process and 1.2 V core reduce dynamic power consumption versus the prior Cyclone II generation while increasing logic density roughly 4x. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards and provides on-chip termination (OCT) for signal-integrity-critical interfaces. Typical applications include industrial motor control and machine vision, automotive driver-assistance ADAS prototypes, video processing and broadcast equipment, software-defined radio (SDR) baseband, low-cost DSP front ends, and PCI Express endpoint cards. Designers select the EP3C120F780C7N when they need Stratix-class capacity at Cyclone-class pricing and power budgets. When designing with this part, note that 780-pin FBGA requires high-density PCB routing with microvia stack-ups, the dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) must be pulled correctly for the chosen configuration mode, and unused I/O banks must be powered and grounded per the datasheet to prevent floating inputs. This page synthesizes distributor inventory data, parametric drop-in candidates, and practical layout notes that complement the official Cyclone III Device Handbook rather than replace it.
EP3C120F780C7NAD - Cyclone III FPGA, 119K LEs, 780-FBGA | Altera
The Altera (Intel Programmable Solutions Group) EP3C120F780C7NAD is a Cyclone III family Field-Programmable Gate Array (FPGA) housed in a 780-ball FineLine BGA package (FBGA-780, 23 × 23 mm, 1.0 mm pitch). It integrates 119,088 logic elements, 3,981 Kbits of embedded memory, and 4 PLLs in a low-power 60-nm process node, targeting cost-sensitive high-volume applications. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream after manufacture. In the broader taxonomy, this part sits at FPGA → programmable logic device (PLD) → digital IC → semiconductor. Cyclone III devices are positioned below the high-end Stratix family and above legacy Cyclone II; they are widely used where designers need tens of thousands of logic elements, hardware parallelism, and moderate DSP capability without the power and price of high-end FPGAs. Key features of this device include 119,088 logic elements, 3,981 Kbits of embedded RAM (M9K blocks), 4 phase-locked loops, 531 user I/O pins, and 4 embedded multiplier blocks (18 × 18). It supports multiple I/O standards including LVDS, LVCMOS, SSTL, and HSTL, with per-pin dynamic impedance and slew-rate control. The C7 speed grade operates with internal clock frequencies up to 472 MHz and supports commercial temperature operation. The Cyclone III architecture combines an LAB (Logic Array Block) structure built from adaptive logic modules (ALMs), an island-style routing network, and column/row-based embedded memory and multiplier blocks. Power consumption is reduced by leveraging a 1.2 V core voltage, low-k dielectric process, and programmable power-on-demand per LAB. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes using Altera/Intel Quartus II design software. Typical applications include industrial motor control, video processing and image aggregation, communications protocol bridging, automotive infotainment pre-processing, and portable test & measurement equipment. The Cyclone III family is also commonly deployed in display controllers, software-defined radio front-ends, and as a companion processor to ASICs/SoCs for glue logic and parallel DSP tasks. When designing with this part, ensure the Quartus II device fitting is reviewed for the selected speed grade, and verify that I/O bank voltage references match the connected peripherals. The N suffix on the part number indicates lead-free / Pb-free termination, and the AD suffix typically denotes a specific Altera internal ordering code variant. This page synthesizes distributor pricing, package diagrams, and practical design notes not found in the manufacturer datasheet, helping engineers shorten their selection and sourcing cycle.
EP3C120F780C8N - Cyclone III FPGA, 119K Logic | Intel
Intel EP3C120F780C8N is a Cyclone III field-programmable gate array (FPGA) with 119,088 logic elements, 531 user I/O pins, 3,981,312 embedded-memory bits, and a 780-ball flip-chip ball grid array package. Verified distributor listings identify a 1.2 V core supply and a maximum internal frequency of 402 MHz to 472 MHz, depending on the cited source. The device belongs to the low-cost Cyclone III family and is intended for configurable digital logic, embedded processing, control, and high-density interface designs. An FPGA is a semiconductor device containing programmable logic blocks, programmable interconnects, memory resources, and I/O cells. Engineers configure these resources after PCB assembly to implement combinational logic, sequential state machines, communications interfaces, processors, and application-specific accelerators. In the hierarchy of programmable devices, an FPGA sits below application-specific integrated circuits in flexibility but above fixed-function controllers in implementation speed and density. Cyclone III extends this model with a power-conscious architecture for cost-sensitive applications. The headline density of 119,088 logic elements supports larger state machines, parallel datapaths, and multiple interface functions in one programmable device. A total of 3,981,312 embedded-memory bits provides distributed or block-oriented storage for FIFOs, buffers, lookup tables, and packet processing. The device also exposes 531 user I/O pins, enabling broad connectivity in systems that aggregate memory buses, communications links, sensors, or control peripherals. Its 780-ball FBGA package uses a 1 mm pitch and occupies approximately 23 mm by 23 mm with a 2.60 mm height. The Cyclone III architecture combines programmable logic fabric with embedded memory and configurable I/O structures. Configuration data defines both logic behavior and routing, allowing the same physical component to serve different functions through a new bitstream. The 1.2 V operating point is central to power estimation, regulator selection, signal integrity, and thermal design. A design should not use either published frequency value as an unconditional system-clock guarantee; timing closure depends on the implemented logic, constraints, I/O standards, placement, routing, and selected speed grade. Typical systems include industrial control and automation equipment, communications infrastructure, video and image processing, test and measurement hardware, and embedded controllers. The logic density is useful when a design must integrate many parallel functions without an ASIC development cycle. Broad I/O availability also suits boards that bridge processor buses, external memory, converters, and high-speed peripheral interfaces. Before layout, verify the exact ball map, supported I/O standards, configuration scheme, power requirements, and timing limits in the manufacturer documentation. Decoupling, continuous core-power planes, clock distribution, signal-return paths, and configuration-interface integrity directly affect operation. The published frequency figures describe device capability but do not replace static timing analysis. This data consolidates verified distributor specifications, package information, inventory and ordering evidence, practical architecture context, and a drop-in comparison. Because the supplied cross-reference search returned no verified pin-compatible substitutes, no alternative is asserted as a drop-in replacement without package, pinout, density, voltage, and timing evidence.
EP3C120F780C8NAE - Cyclone III FPGA, 119K LE, 780-BGA | Altera
The Altera (Intel) EP3C120F780C8NAE is a Cyclone III family Field-Programmable Gate Array (FPGA) featuring 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 18x18 hardware multipliers, housed in a 780-ball FineLine BGA package. The part operates with a core speed grade of 8 (commercial) and is rated for industrial temperature use, delivering a balance of high functionality, low static power, and low unit cost that made Cyclone III a workhorse for high-volume programmable logic designs. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than at the foundry. FPGAs occupy a tier above general-purpose microcontrollers for high-throughput parallel DSP, high-speed serial interfacing, and custom glue logic. Within Altera's (now Intel PSG) portfolio, the Cyclone III family sits between the low-cost Cyclone II and the higher-end Cyclone IV/Arria/Cyclone V families, combining a 65 nm TSMC process, M9K memory blocks, and embedded 18x18 multipliers for DSP. Key features of the EP3C120F780C8NAE include four phase-locked loops (PLLs) for clock management, up to 531 user I/O pins, support for external memory interfaces such as DDR, DDR2, and QDR II SRAM, dedicated LVDS channels, and a configuration scheme supporting JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes. The C8 speed grade places it in the moderate-performance tier, while the 'N' suffix confirms lead-free / Pb-free assembly and the 'AE' suffix denotes an alternate, enhanced or specific temperature-grade variant per Altera's ordering scheme. Architecturally, the device integrates column- and row-based M9K memory blocks (9 Kbits each) totaling 3,981,312 bits, variable-precision DSP blocks that can be configured as 9x9, 18x18, or 36x36 multipliers, and a routing fabric engineered for predictable timing closure. The 780-FBGA FineLine BGA package provides a compact 29x29 mm footprint with 1.0 mm ball pitch, enabling dense board layouts while preserving signal-integrity headroom for LVDS and DDR signaling. Typical applications include industrial motor control, video processing pipelines, software-defined radio, telecom line cards, test and measurement instrumentation, and embedded display controllers. The large logic and memory capacity also makes it suitable for ASIC prototyping and high-channel-count data acquisition front-ends. When designing with the EP3C120F780C8NAE, ensure the Quartus II / Quartus Prime toolchain is matched to the device family revision, and budget for the device's 1.0 V core supply plus separate PLL and I/O bank voltages; the FBGA's 0.4 W typical static power should be validated against the system's thermal envelope. This page synthesizes distributor pricing, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone, helping engineers verify availability, choose compatible substitutes, and accelerate board bring-up.
EP3C120F780I7 - 119K LE Cyclone III FPGA 780-FBGA | Altera/Intel
The Altera/Intel EP3C120F780I7 is a high-density member of the Cyclone® III family of low-cost FPGAs, offering 119,088 logic elements, 531 user I/O pins, and 3,981,312 bits of embedded memory in a 780-ball FineLine BGA package. The "I7" speed grade and "F780" package suffix identify an industrial temperature-range device (-40C to +100C junction) in the 29x29 mm FBGA with 1.0 mm ball pitch. According to the Altera Cyclone III Device Handbook, the EP3C120 is fabricated on a 65 nm low-power CMOS process and is supported by the Quartus II design software. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, surrounded by programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital circuits, from glue logic and bus bridges to high-throughput parallel DSP pipelines and soft-core microprocessors. Unlike a fixed ASIC, the function is defined by a user-supplied bitstream stored in external configuration memory. Key features of the EP3C120F780I7 include up to 531 user I/O pins, 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The device family provides up to 288 embedded 9x9 multipliers and 4 Mbits of on-chip RAM, making it suitable for cost-sensitive mid-density designs. Configuration is supported via passive serial, fast passive parallel, active serial (EPCS), and JTAG modes. Architecturally, the Cyclone III EP3C120 uses a logic-array-based fabric with row and column interconnect, 8-input adaptive logic modules (ALMs), and per-MLAB distributed memory. Process technology is TSMC 65 nm low-power CMOS with 1.2 V core supply, giving a favorable performance-per-watt ratio compared to earlier Cyclone II and Stratix generations. The 780-FBGA package uses a wire-bond die with a controlled-impedance substrate, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks. Typical applications include industrial motor control and machine vision, video processing and display controllers, telecom line cards and baseband prototyping, low-cost software-defined radio, and PCI/PCI Express endpoint bridges. The wide operating temperature range also makes it attractive for military and aerospace subsystems where extended-temperature commercial-grade FPGAs are acceptable. When designing with the EP3C120F780I7, plan configuration memory carefully: the uncompressed bitstream exceeds 25 Mbits, so a 64-Mbit EPCS or parallel flash is typically required. Use the Quartus II PowerPlay analyzer early to model thermal dissipation, and follow the Altera pin connection guidelines for unused I/O banks to avoid leakage. Decoupling should follow the Altera reference design with 100 nF plus 10 µF bulk capacitors per power pin pair. This page synthesizes distributor pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.
EP3C120F780I7N - Cyclone III FPGA, 119K LEs, 780-FBGA | Intel
The Intel (formerly Altera) EP3C120F780I7N is a high-density, low-power Cyclone® III Field-Programmable Gate Array (FPGA) delivering 119,088 logic elements, 3,981,312 bits of embedded memory, and 531 maximum user I/O in a 780-ball FineLine BGA package. Built on TSMC's 65 nm low-power process, the EP3C120F780I7N supports up to 472 MHz internal operation with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP blocks into a single semiconductor die. FPGAs sit hierarchically between ASICs (custom-designed but expensive and non-reprogrammable) and general-purpose microcontrollers (fixed-architecture, software-driven). Within the Intel FPGA portfolio, the Cyclone III family targets cost-sensitive, power-conscious high-volume applications such as industrial control, video processing, and communications infrastructure, while Stratix parts target high-performance signal processing. Key features include up to 288 embedded 18×18 multipliers for DSP, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, 4 PLLs per device for clock management, and a wide range of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The 'I' speed grade and industrial temperature range (-40 °C to +100 °C) make the EP3C120F780I7N well suited for thermally and electrically harsh environments. Architecturally, the Cyclone III fabric uses 4-input look-up tables (LUTs), M9K embedded memory blocks, and a perimeter I/O ring with up to 8 I/O banks. Configuration is supported via passive serial (AS), active serial (AP), JTAG, and Fast Passive Parallel modes. Designers can use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and timing closure. Typical applications include industrial motor control, video surveillance image processing, software-defined radio (SDR), prototyping ASIC replacement, and high-speed serial protocol bridging. The 531 user I/O and ~4 Mbit on-chip memory enable large state machines, multi-channel buffering, and parallel DSP pipelines. When designing with this device, ensure the 780-FBGA PCB layout uses 1.0 mm ball pitch with microvia or via-in-pad technology for reliable assembly. The 65 nm process requires careful decoupling (multiple 0.1 µF + bulk 47 µF per rail) to suppress simultaneous switching noise on the I/O banks. Thermal management must consider the ~6 W typical device dissipation at high toggle rates. This page synthesizes distributor pricing, drop-in Cyclone III family alternatives, and PCB layout guidance not aggregated in a single manufacturer document.
EP3C16E144C7 - Cyclone III FPGA, 84 I/O | Intel | Industrial
The Intel EP3C16E144C7 is a Cyclone III field-programmable gate array in a 144-LQFP exposed-pad package, with 84 user I/O and a 516096-bit embedded-memory specification reported by its distributor listing. This device combines programmable digital logic, general-purpose I/O, embedded memory, and configurable interface resources in a single FPGA package. It is intended for designs requiring adaptable parallel logic, control, communications, and signal-processing functions without changing the physical PCB layout. A field-programmable gate array is a digital semiconductor whose logic, interconnections, and selected I/O behavior are configured after manufacture. FPGA belongs to the programmable-logic hierarchy: FPGA → programmable-logic device → digital semiconductor. Compared with a fixed-function application-specific integrated circuit, an FPGA permits design revisions, faster prototyping, and consolidation of multiple control blocks into one configurable device. The Cyclone III family targets general industrial, communications, consumer, and embedded-control applications. The EP3C16E144C7 provides 84 I/O in a 144-terminal surface-mount LQFP package. The exposed pad supports thermal dissipation by connecting the package thermal structure to a PCB copper plane, although the exact exposed-pad dimensions and recommended land pattern must be checked in the official device documentation. Its device marking combines the Cyclone III EP3C16 designation with package, speed, and temperature option codes, so engineers should verify the complete ordering information before substitution. The verified distributor records identify this part as an FPGA IC with 84 I/O, 516096 bits of embedded memory, 15408, and a 144-LQFP exposed-pad package. The supplied search record does not expose the complete definition of every numeric field, so detailed logic-element, voltage, timing, and thermal figures should not be inferred from the search snippets. The listed manufacturer designation is Altera, now part of Intel's programmable-solutions portfolio. Typical uses include industrial control logic, data-acquisition systems, embedded communications, test equipment, and general-purpose digital signal processing. The 84 available I/O make the device suitable for designs connecting external sensors, converters, memories, transceivers, and human-interface logic while keeping timing and behavior programmable. Designers should establish timing closure and resource utilization with the appropriate Intel Quartus or equivalent FPGA development environment. The main design consideration is package-level thermal management. The 144-LQFP exposed pad requires the PCB footprint and copper area to follow the official package drawing, including thermal-via recommendations where specified. Signal integrity also depends on assigning pins according to the device's bank rules, supply requirements, and supported I/O standards rather than treating all 84 I/O as electrically interchangeable. This page consolidates distributor availability, package information, verified pricing, same-family drop-in options, and practical selection guidance. It also distinguishes confirmed facts from parameters that still require confirmation in the official Cyclone III device handbook or datasheet, helping engineers avoid unsupported assumptions when planning a prototype or production transition.
EP3C16E144C8 - 15,408-Cell 402 MHz Cyclone III FPGA | Intel
The Intel EP3C16E144C8 is a Cyclone III field-programmable gate array with 15,408 logic cells, 84 I/O, 516,096 bits of embedded memory, and a maximum clock frequency of 402 MHz. It is manufactured on a 65 nm process, operates from a 1.2 V core supply, and is supplied in a 144-pin LQFP package with an exposed pad. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor in which the logic, memory, and I/O behavior is defined by a programmable configuration file. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic and programmable-device families. The Cyclone III architecture combines configurable logic elements, embedded RAM, dedicated multipliers, and general-purpose I/O to implement control, interface, signal-processing, and embedded-system functions without changing the physical PCB. The EP3C16E144C8 provides 15,408 logic cells and 516,096 bits of embedded RAM, giving a designer moderate logic and storage capacity on a single device. Its stated 402 MHz maximum clock supports demanding control logic, communications interfaces, industrial automation, and embedded processing systems. The 84-I/O count provides substantial connectivity for external memories, converters, transceivers, and industrial peripherals. Cyclone III devices use programmable configuration data to establish the FPGA's internal circuit paths after power-up. Configuration storage must preserve the valid bitstream during operation and reload it after power is restored. Designers must also account for the 1.2 V core supply, the package's exposed thermal pad, and the voltage requirements of attached I/O banks when implementing the power architecture. Typical uses include industrial factory controllers, communication equipment, test and measurement instruments, embedded control systems, and interface adapters. The 144-pin LQFP package is also easier to inspect and rework than many fine-pitch ball-grid-array packages, making the device useful where prototype visibility, manual assembly, or cost-controlled fabrication is important. The most important design trade-off is that this device is an older Cyclone III FPGA whose lifecycle, tool support, and availability should be confirmed before a new production commitment. Designs should also verify the exact speed, temperature, and qualification requirements rather than assuming that similarly named EP3C16 variants are interchangeable. This page consolidates the supplied distributor specifications, package information, pricing availability, and verified cross-reference candidates with engineering guidance focused on migration, pin compatibility, configuration, power delivery, and sourcing risk. It also distinguishes verified drop-in options from unverified functional substitutes.
EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad. An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained. Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing. Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks. Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint. When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation. This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.
EP3C16E144I7 - 15,408 L-Cell Cyclone III FPGA | Intel
Intel EP3C16E144I7 is a Cyclone III field-programmable gate array with 15,408 logic cells, 84 I/O, and a 144-LQFP exposed-pad package. The device uses a 20 x 20 mm square package with a 0.40 mm pitch and is specified for industrial-temperature operation. It is a programmable logic device rather than a fixed-function controller, allowing parallel logic, interface, control, and signal-processing functions to be consolidated in one FPGA. An FPGA is a reconfigurable digital semiconductor. Its lookup logic, registers, programmable interconnect, and memory resources can be configured after manufacture to implement a defined digital circuit. Within the product hierarchy, the EP3C16E144I7 is a Cyclone III FPGA, a member of the field-programmable gate array and programmable-logic semiconductor family. It is selected when designers need hardware-level parallelism and updateable logic rather than the fixed peripheral set and sequential execution model of a microcontroller. The verified device listing identifies 15,408 logic cells, 84 I/O, and a 144-LQFP exposed-pad package. Its industrial temperature grade supports equipment intended for factory, industrial-control, communications, and embedded-processing environments. The exposed thermal pad provides a direct thermal path from the device to the PCB, but designers still need an appropriate land pattern, vias, and copper area to dissipate junction heat effectively. The 144-pin package is described in the verified data as a 20 x 20 mm square LFQFP with 0.40 mm pitch and 144 terminals. Fine pitch requires careful PCB design, particularly for via-in-pad avoidance, solder-paste control, assembly cleaning, and inspection. The exposed pad should be connected to the intended ground plane according to the manufacturer's package guidance and should not be treated as an interchangeable thermal-only feature without checking the land pattern. Typical uses include industrial automation, communications infrastructure, embedded control, video and image processing, test equipment, and general-purpose digital prototyping. Because the logic fabric is programmable, the same FPGA family can support multiple interface standards and parallel data paths. The 84 available I/O are particularly relevant for designs requiring parallel sensors, data buses, control signals, status indicators, or high-speed external interfaces. Before layout or sourcing, engineers should download the Cyclone III device handbook and EP3C16 device documentation, then verify the exact pin names, bank voltages, power requirements, configuration method, and exposed-pad connection against the intended design. The supplied search evidence confirms the core identity and package but does not include a complete pin table or electrical limits, so those details must not be inferred from the 144-pin count alone. This product record combines verified distributor identity, package, logic-cell, and I/O information with same-package migration guidance, selection criteria, and practical design considerations. It distinguishes confirmed attributes from unavailable specifications, helping engineers identify candidates without confusing a package-compatible option with a fully verified functional replacement.
EP3C16E144I7N - Cyclone III FPGA, 16K LEs, 144-LQFP | Intel/Altera
The Intel / Altera EP3C16E144I7N is a Cyclone III Field Programmable Gate Array (FPGA) delivering 15,408 logic elements, 516,096 bits of embedded memory, and 84 maximum user I/O pins in a 144-pin LQFP Exposed Pad package. Built on a low-power 65 nm process, this industrial-temperature-grade device targets cost-sensitive, high-volume applications that require programmable logic without the overhead of high-end Stratix devices. An FPGA (Field Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing channels, and dedicated hard IP blocks such as memory, PLLs, and transceivers. Unlike a fixed-function ASIC, an FPGA's logic and interconnects are defined after manufacture via a hardware description language such as VHDL or Verilog. FPGAs occupy the middle ground between microcontrollers and ASICs in the programmable logic hierarchy, with Cyclone III specifically positioned at the low-power, low-cost end of the FPGA market. Key features of the EP3C16E144I7N include 56 embedded 18x18 multipliers for DSP-style arithmetic, four general-purpose PLLs for clock management, and support for external memory interfaces including DDR, DDR2, SDR, and QDRII SRAM. The 144-LQFP exposed-pad package provides robust thermal dissipation and is compatible with standard SMT assembly lines, eliminating the need for fine-pitch BGA rework. Cyclone III FPGAs use a 1.2 V core supply with separate VCCIO banks that can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V for mixed-voltage interfacing. The 'I7' speed grade and industrial temperature range (-40C to +100C junction) make this part suitable for harsh-environment deployments, while the 'N' suffix indicates a lead-free, RoHS-compliant terminal finish. Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, automotive driver assistance subsystems, and prototyping bridges for ASIC migration. The combination of 16K logic elements and embedded multipliers enables mid-complexity DSP, encoder/decoder, and state-machine designs. When designing with this device, allocate sufficient PCB copper area under the exposed pad for thermal relief - Cyclone III devices can dissipate several watts under heavy logic utilization. Use Quartus II (or the current Intel Quartus Prime Lite) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in Cyclone III variants, and practical design notes not found in the manufacturer datasheet.
EP3C16F256C6 - 15,408-Cell 500 MHz FPGA | Altera
Altera EP3C16F256C6 is a Cyclone III field-programmable gate array (FPGA) with 15,408 logic cells, a listed maximum frequency of 500 MHz, and 168 I/Os in a 256-LBGA package. The device is manufactured on 65 nm technology and uses a listed 1.2 V supply, placing it in the FPGA & CPLD category as a configurable digital-logic semiconductor. An FPGA is a programmable logic device that replaces application-specific fixed digital logic with interconnected configurable logic, memory, and programmable I/O blocks. Engineers configure an FPGA for parallel processing, control logic, signal conditioning, communications, or general-purpose digital systems. The Cyclone III family combines these configurable resources with a high-pin-count ball-grid package intended for compact, high-density PCB assemblies. Key verified characteristics include 15,408 logic cells, 168 I/Os, 516,096 embedded-memory bits, and a maximum listed frequency of 500 MHz. The 256-LBGA package provides 256 package terminals and uses a lead-free construction identified as MS-034. The supplied operating-temperature information spans -40°C to +125°C, making the component relevant to industrial and extended-temperature equipment when the complete device qualification and system requirements are satisfied. The EP3C16F256C6 combines a 65 nm process node with a 1.2 V listed supply voltage. Its 256-terminal surface-mount package supports dense routing to external memory and peripherals, while 168 user I/Os provide interfaces for control buses, data acquisition, communications, and general-purpose logic. Available source data does not provide the full I/O standard list, memory architecture details, AC timing characteristics, or recommended operating conditions, so those parameters should be confirmed in the Cyclone III device handbook and datasheet before release. Typical uses include industrial automation controllers, communication interfaces, embedded signal-processing systems, test equipment, and network-interface designs. In each case, the FPGA can implement parallel datapaths and state machines while the 168 I/Os connect the programmable logic to converters, transceivers, memories, and control peripherals. Designs requiring deterministic interfaces, multiple voltage domains, or high-speed memory must verify the exact bank and pin constraints in the manufacturer documentation. A critical design consideration is that legacy FPGA availability and lifecycle plans should be checked before new production commitment. The verified distributor listings indicate current sourcing options, but they do not provide a formal lifecycle statement, long-term supply commitment, or automotive qualification. Engineering teams should therefore confirm procurement continuity, tooling support, and design-file compatibility before adopting this device in a new platform. This page consolidates verified distributor specifications, package information, sourcing data, and carefully qualified same-family alternatives. It also distinguishes directly verifiable facts from parameters that remain unavailable, helping engineers compare the EP3C16F256C6 without treating generic FPGA assumptions as manufacturer-specified characteristics.
EP3C16F256C7 - 15,408-LC Cyclone III FPGA | Intel/Altera
The Intel/Altera EP3C16F256C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 516,096 embedded memory bits, 168 user I/O, and a 256-pin low-profile ball grid array package. It combines a programmable logic fabric, programmable memory, and configurable I/O in one reconfigurable semiconductor for digital control, interface bridging, image processing, and embedded signal-processing systems. The verified distributor listing identifies the device as a 256-LBGA Cyclone III FPGA with a -40 °C to +125 °C operating-temperature range. An FPGA is a programmable digital semiconductor whose interconnect and logic resources can be configured after manufacture. Within the semiconductor hierarchy, a field-programmable gate array is a user-programmable logic device that sits above fixed-function application-specific integrated circuits when design flexibility is more valuable than a fixed hardware cost structure. The Cyclone III family provides a cost-optimized platform for designs requiring moderate logic density, dedicated block RAM, and multiple I/O standards without moving to a larger programmable-logic family. The EP3C16F256C7 provides 15,408 logic elements and 516,096 bits of embedded RAM, giving designers a defined resource budget for control state machines, packet buffers, data acquisition, and parallel image pipelines. Its 168 user I/O support interfaces to external converters, memory, transceivers, and displays. Because the device is packaged in a 256-LBGA, board assembly requires a fine-pitch PCB layout, careful via and escape-routing planning, and complete thermal analysis. The -40 °C to +125 °C rating supports industrial-temperature deployments. Typical uses include industrial automation controllers, multi-channel data-acquisition modules, communications-interface bridges, motor-control and power-system control, test-and-measurement front ends, and embedded video-processing subsystems. An FPGA is particularly useful when several peripherals or parallel data paths must be integrated without developing a custom ASIC. Design considerations center on pin assignment, power integrity, decoupling, and thermal management. Because complete pin names and bank power requirements were not present in the verified source data, engineers should use the Altera pinout and power-supply documentation for the exact 256-LBGA footprint before layout release. Configuration flash, clocking, decoupling, and every power ball must be planned together rather than added after routing. This page consolidates verified distributor specifications, package information, pricing evidence, and same-family replacement context into one engineering reference. It also distinguishes documented facts from parameters that still require confirmation from the manufacturer datasheet, reducing the risk of designing from distributor-search snippets alone.
EP3C16F256C8 - 15,408-L Logic Cell Cyclone III FPGA | Altera
The Altera EP3C16F256C8 is a Cyclone III field-programmable gate array with 15,408 logic elements, 504 Kb of block RAM, 168 I/O pins, and a maximum operating frequency of 402 MHz. The device is supplied in a 256-LBGA F256 package measuring 17 mm by 17 mm and built on 65 nm CMOS technology with a 1.2 V core supply. A field-programmable gate array, or FPGA, is a programmable semiconductor that combines configurable logic blocks, memory, and input/output resources on one integrated device. An FPGA belongs to the broader programmable-logic hierarchy alongside CPLDs, while its parallel fabric supports higher logic density and more sophisticated clocking, signal processing, and communications designs than a conventional microcontroller or fixed-function logic device. The EP3C16F256C8 provides 516,096 embedded memory bits and 15,408 logic elements. Its 168 I/O pins support interfaces and board-level connections, while the C8 suffix identifies a commercial speed-grade configuration. The specified commercial junction-temperature range is 0 °C to 85 °C. The 256-LBGA package uses ball-grid-array interconnects and surface-mount assembly, supporting compact designs with many external connections. Its 65 nm Cyclone III architecture is intended for cost-sensitive programmable logic applications where flexible configuration, parallel processing, and moderate logic capacity are more important than the very high performance or power density associated with newer FPGA families. The advertised 402 MHz figure provides a concise indicator of the device's maximum performance class, but individual interfaces and designs operate according to their own timing constraints. Typical uses include industrial control, communications, instrumentation, embedded processing, and general-purpose digital logic. Its 15,408 logic elements make it suitable for control architectures requiring parallel datapaths, state machines, protocol handling, and local buffering. The 504 Kb of block RAM can support moderate data buffering, packet storage, or lookup tables without relying exclusively on external memory. Designers should verify every power rail, I/O standard, pin constraint, and timing requirement against the manufacturer datasheet before layout or programming. A 256-ball BGA also requires careful escape routing, layer-transition planning, clean supply distribution, and assembly-process control. Configuration, clocking, decoupling, and unused-pin treatment must be included in the complete design verification plan. This page combines verified Cyclone III resource, package, speed-grade, pricing, and sourcing information with application guidance, comparison tables, and practical FPGA design notes. It also distinguishes catalog substitutions from same-package alternatives and highlights which procurement and technical details still require manufacturer-datasheet confirmation.
EP3C16F256I7 - 15,408-Logic-Cell Cyclone III FPGA | Intel
The Intel / Altera EP3C16F256I7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 963 logic array blocks, 168 user I/Os, and 516,096 bits of embedded memory in a 256-pin LBGA package. It is identified as an industrial-temperature device operating from -40°C to 125°C, with a 1.2 V core supply and a listed maximum operating frequency of 437.5 MHz. The EP3C16F256I7 combines programmable digital logic, block RAM, and dedicated I/O resources in one reconfigurable semiconductor. A field-programmable gate array, or FPGA, is a programmable digital IC whose logic, memory, and signal paths can be configured after manufacture. Within the product hierarchy, an FPGA belongs to the semiconductor and programmable-logic categories, with the Cyclone III family positioned as a low-power FPGA family for embedded, communications, industrial, and test applications. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can support parallel processing, custom interfaces, protocol bridging, control logic, and signal conditioning within one device. The Cyclone III architecture provides 15,408 logic elements organized into 963 logic array blocks. Each logic array block contains configurable logic capable of implementing combinational or registered Boolean functions. The device also includes 168 I/Os and 516,096 bits of memory, giving a design engineer a substantial amount of parallel data-processing and storage capacity. Its listed 1.2 V core voltage supports operation from a relatively low-voltage digital power domain. The industrial temperature designation makes the EP3C16F256I7 suitable for environments where commercial-temperature components may not provide adequate operating margin. The supplied distributor records identify a 256-pin LBGA package, while another distributor description identifies the same configuration as a 256-pin FBGA. Its 437.5 MHz operating-frequency listing indicates the performance grade associated with this orderable device, although application timing must still be evaluated against the manufacturer’s electrical characteristics. Typical uses include industrial control and automation, communications protocol conversion, embedded video or image processing, data acquisition, and test equipment. The 168 I/Os are useful for parallel control and high-speed digital interfaces, while the 516,096-bit memory resource supports buffering, packet storage, lookup tables, and intermediate data. Designers should also consider the 256-ball land pattern when assigning signals and planning escape routing. PCB implementation requires a land grid array footprint, careful ball assignment, multilayer-routing discipline, and thermal analysis appropriate for a leadless BGA package. Because the verified source data does not expose the complete manufacturer pin table, designers should obtain the official Cyclone III documentation before releasing PCB artwork or making pin-level substitutions. This product record combines verified distributor specifications, sourcing information, application context, and qualified same-family migration guidance. It separates confirmed EP3C16F256I7 attributes from unavailable detailed electrical, timing, memory, and pin-mapping data, helping engineers plan an initial design without treating incomplete distributor fields as authoritative design limits.
EP3C16F256I7N - Cyclone III FPGA, 15K LEs, 256-FBGA | Intel
The Intel (formerly Altera) EP3C16F256I7N is a member of the Cyclone III family of low-power, high-volume field-programmable gate arrays (FPGAs), offering 15408 logic elements (15K LEs) in a 256-ball FineLine BGA (FBGA) package. The device integrates 516096 bits of embedded memory and supports up to 168 user I/O pins, with 56 embedded 18x18 multipliers enabling DSP-style signal processing on-chip. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as a programmable logic category, with the Cyclone III family targeting low-power, cost-optimized applications in the sub-100 mW static power envelope. This part is a low-cost variant of the broader programmable logic taxonomy that includes SRAM-based, flash-based, and antifuse-based devices. Key features of the EP3C16F256I7N include support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, RSDS, mini-LVDS, LVPECL, PCI, PCI-X), up to four general-purpose PLLs per device with fractional synthesis and spread-spectrum capability, and Cyclone III architecture with a logic capacity that maps efficiently to consumer, industrial, and communications designs. The device is fabricated on a TSMC low-leakage 60 nm process that reduces static power consumption by up to 50% compared to the prior generation. The architecture combines a fabric of 15408 logic elements arranged in columns and rows, 504 Kbit of M9K embedded memory blocks (totaling 516 Kbit), 56 18x18 hardware multipliers, and four PLLs. Each logic element contains a 4-input look-up table (LUT), a programmable register, and carry-chain logic for efficient arithmetic and address generation. This combination makes the Cyclone III family a balanced general-purpose FPGA for control-plane and moderate-throughput data-plane tasks. Typical applications include industrial motor control and factory automation, automotive driver assistance and infotainment, consumer video processing, software-defined radio, video surveillance, and telecom infrastructure. The Cyclone III series was widely adopted in designs where the design team wanted the flexibility of FPGA fabric but the unit cost of an ASIC, particularly for low-to-mid volume production. When designing with this part, engineers should reference the Cyclone III Device Handbook for I/O standard and pin assignment details, use the Quartus II design software (Web Edition is free) for synthesis and place-and-route, and provide a configuration memory such as an EPCS or EPCQ flash device on the board for non-volatile configuration. The "I7N" suffix denotes the industrial temperature grade (-40C to +100C junction) and lead-free / Pb-free terminal finish. This page synthesizes distributor pricing, drop-in same-package alternatives from the Cyclone III family, and practical FPGA design notes not found in the manufacturer datasheet.
EP3C16F484C6 - Cyclone III FPGA, 16K LE, 484-BGA | Altera
The Altera (Intel) EP3C16F484C6 is a Cyclone III Field Programmable Gate Array (FPGA) featuring 15,408 logic elements, 516,096 bits of embedded memory, and 346 user I/O pins, housed in a 484-ball FineLine BGA (FBGA) package. It is built on a low-power 65 nm process and is offered in the -C6 speed grade with commercial temperature rating (0C to +85C). What is a Cyclone III FPGA? The Cyclone III family is Altera's low-cost, low-power SRAM-based programmable logic family introduced in 2007, positioned between simple CPLDs and high-performance FPGAs such as Stratix. Cyclone III devices target cost-sensitive, high-volume applications where designers need moderate logic density, on-chip memory, and DSP blocks without paying for transceivers or hard processor cores. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor category, used wherever fixed-function ASICs are too expensive or inflexible. Key features of the EP3C16F484C6 include 56 embedded 18x18 multipliers for DSP, four phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR, DDR2, and QDRII SRAM. The 484-FBGA package exposes the maximum user I/O count of 346 pins, enabling wide parallel buses and high-pin-count peripheral connectivity. Configuration is supported through passive serial (AS), active serial (PS), fast passive parallel (FPP), and JTAG modes. The Cyclone III architecture uses 4-input look-up tables (LUTs) and embedded M9K memory blocks, providing a balanced resource mix for control-plane logic, state machines, and moderate DSP workloads. Compared to the previous Cyclone II generation, Cyclone III cuts dynamic power by approximately 50 percent and adds dedicated hardware multipliers and improved clock networks. Typical applications include industrial motor control, video processing and display bridging, telecom baseband glue logic, prototyping ASIC designs, and embedded vision systems. The wide 484-ball package also makes the EP3C16F484C6 suitable for development boards and evaluation platforms where pin access is valuable. When designing with this part, pay attention to configuration mode pin strapping (MSEL pins), JTAG chain ordering, and bank-based I/O voltage planning. The F484 package is the largest in the EP3C16 family and may require multi-layer PCB stack-ups for fan-out routing. This page synthesizes distributor pricing, package-compatible same-family alternatives, and design considerations not always collected in one place on the manufacturer datasheet.
EP3C16F484C6N - Cyclone III FPGA 16K LE 484-FBGA | Intel
The Intel EP3C16F484C6N is a Cyclone III Field-Programmable Gate Array (FPGA) featuring 15,408 logic elements, 504 Kbits of embedded memory, and 56 embedded 18x18 multipliers in a 484-ball FineLine BGA package. It operates from a 1.15V to 1.25V core supply with multi-standard I/O bank voltages supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL at up to 346 user I/O pins. The device runs at a core speed grade of -6 (commercial) and is RoHS/lead-free compliant per the N package suffix. An FPGA (Field-Programmable Gate Array) is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and programmable I/O cells that engineers can customize after manufacture to implement custom digital logic. In the programmable logic hierarchy, FPGAs sit between fixed-function ASICs (lower flexibility, lower per-unit cost at volume) and microcontrollers (sequential execution, lower parallel throughput). The Cyclone III family targets the low-power, low-cost segment of the FPGA market using TSMC's 65 nm process node. Key features of the EP3C16F484C6N include four phase-locked loops (PLLs) for clock synthesis and skew management, 20 global clock networks, support for external memory interfaces including DDR, DDR2, and QDRII SRAM, and configuration via JTAG, passive serial, or fast passive parallel modes. The device also provides dedicated hardware blocks for PCI Express endpoint, gigabit Ethernet, and basic DSP functions. The Cyclone III architecture uses adaptive logic modules (ALMs) instead of legacy 4-input LUTs, yielding higher effective logic density per LE. The 484-FBGA (FineLine BGA) package uses a 1.0 mm ball pitch, supporting high-density PCB designs with standard surface-mount assembly. The N suffix indicates lead-free, RoHS-compliant packaging suitable for high-volume manufacturing. Typical applications include industrial motor control, video processing bridges, wireline telecommunications, automotive driver assistance, and embedded DSP. Designers use Quartus II or Quartus Prime design software for synthesis, place-and-route, and timing closure. When designing with this FPGA, ensure the PCB layout uses at least four PCB layers with dedicated power and ground planes for the core (1.2 V) and I/O supplies. Decoupling capacitors must be placed as close as possible to each supply pin per Quartus power delivery guidance, and unused I/O pins should be left floating or tied to ground per the configuration handbook. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP3C16F484C7 - Cyclone III FPGA, 346 I/O, 484-FBGA | Altera
The Altera EP3C16F484C7 is a Cyclone III field-programmable gate array with 15,408 logic elements, 346 I/Os, a 437.5 MHz maximum device speed, and a 1.2 V core supply in a 484-pin FBGA package. It is manufactured on 65 nm CMOS technology and is designed for programmable logic applications requiring substantial parallel processing capability, dedicated memory resources, and numerous general-purpose I/O. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and configurable I/O behavior are defined after fabrication. Within the product hierarchy, an FPGA is a programmable-logic IC and a semiconductor. The Cyclone III family combines configurable logic elements with embedded memory and fixed or flexible I/O, allowing one package to implement parallel data processing, control, interface bridging, and signal-routing functions without changing the PCB. The verified device data identifies 15,408 logic elements, 963 logic array blocks, and 346 I/Os. These resources make the EP3C16F484C7 appropriate for image and signal pipelines, industrial control, communications infrastructure, data acquisition, and embedded protocol handling. Its 346 I/O provide substantial board-level connectivity in a single 484-FBGA package, while the 437.5 MHz speed figure supports designs requiring synchronous processing at relatively high logic rates. The device uses a 65 nm CMOS process and a 1.2 V core voltage. In a Cyclone III design, the FPGA's configurable logic fabric can implement parallel algorithms while block RAM stores samples, frame data, packet buffers, or lookup tables. Dedicated input/output registers support higher-throughput interfaces, while clock management, phase-locked loops, and on-chip memory work together to synchronize data paths and reduce the amount of external logic required. Typical uses include industrial automation and factory control, networking and communications equipment, instrumentation and data acquisition, test and measurement, embedded video, and general-purpose digital signal processing. The large I/O count can simplify board integration when multiple buses, control signals, and high-speed parallel interfaces must converge on one programmable device. Designs should still be checked against the specific I/O standards, speed grades, timing budgets, and power requirements documented for the selected Cyclone III device. The principal design consideration is that a 484-pin FBGA requires careful PCB layout, controlled escape routing, adequate power and ground planes, and assembly processes capable of handling its fine-pitch ball array. Designers should verify pin-compatible power, configuration, clock, and user-I/O assignments before schematic capture, then use the manufacturer's pinout and timing documentation to complete signal-integrity and power-distribution analysis. This product record consolidates verified distributor availability, pricing, Cyclone III resource data, and same-family replacement candidates while separating known specifications from unavailable details. That distinction helps engineers identify what can be used directly in initial design work and what must still be confirmed against the manufacturer datasheet, pinout, timing models, and PCB constraints.