Intel 的 EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera EP3C16E144C8N - 電子元件
Intel

EP3C16E144C8N - 16K LE Cyclone III FPGA, 144-LQFP | Intel / Altera

MPN： EP3C16E144C8N ✓ 啟用中
1.2 V Vdss 144-LQFP Exposed Pad (EQFP-144) Package C8 Speed 516,096 bits (63 Kbytes) Memory
索取報價
MOQ： 1 |
查看資料表 (PDF) 查看替代品

EP3C16E144C8N 概覽

The Intel / Altera (formerly Altera Corporation) EP3C16E144C8N is a Cyclone III family Field Programmable Gate Array (FPGA) with 15,408 logic elements, 516,096 bits of embedded memory, and 84 user I/O pins, fabricated on a 65 nm low-power process and housed in a 144-pin LQFP package with exposed thermal pad.

An FPGA (Field Programmable Gate Array) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream rather than fixed at the fab. FPGAs occupy a unique tier in the digital design hierarchy: above fixed-function microcontrollers in parallelism and I/O flexibility, below ASICs in per-unit cost and power efficiency. Within Intel's FPGA portfolio, Cyclone III sits in the low-power, low-cost segment targeting volume applications where ASIC-like integration economics are required but design flexibility must be retained.

Key features include 15,408 logic elements (LEs), 516,096 bits (63 Kbytes) of embedded RAM, 56 embedded 18x18 multipliers for DSP functions, four phase-locked loops (PLLs) for clock management, and 84 general-purpose I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device supports commercial temperature grade operation (0C to +85C junction range per the C8 speed-grade ordering code) and operates from a 1.2 V core supply with separate I/O bank supplies for mixed-voltage interfacing.

Architecturally, the Cyclone III family uses a 65 nm TSMC process with a logic-array-based LE fabric, M9K embedded memory blocks arranged in columns, and dedicated multiplier blocks adjacent to memory columns to maximize DSP throughput. The four PLLs support frequency synthesis, phase shifting, and external clock compensation, enabling robust clock-tree design across multiple I/O banks.

Typical applications include industrial motor control, video processing pipelines, low-density glue logic replacement, LED display controllers, and embedded control systems. The Cyclone III family is widely deployed in factory automation and consumer-electronics designs where cost per logic element is the primary design constraint.

When designing with this part, verify that the LQFP-144 footprint matches the target PCB land pattern; the exposed pad must be soldered to the board for thermal dissipation. Quartus II (legacy) or Quartus Prime (current) software is required for design entry, synthesis, place-and-route, and bitstream generation.

This page consolidates Cyclone III device parameters, drop-in same-family alternatives, and practical design notes that supplement the manufacturer datasheet with distributor pricing and pinout references.

直接替換替代品，適用於 EP3C16E144C8N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號： EP3C16E144C8N （相同外形與佔位） — 差異在於 Package, Speed Grade, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.

Altera
Speed Grade: 8 (commercial, slowest in C-grade)
Operating Temperature: 0C to +85C (commercial)
比較對象 EP3C16E144C8N →
Intel
Package: 144-LQFP Exposed Pad
比較對象 EP3C16E144C8N →
Intel
Package: 144-pin LQFP with exposed pad
比較對象 EP3C16E144C8N →
Intel
Package: 144-LQFP Exposed Pad
比較對象 EP3C16E144C8N →
Intel
Speed Grade: 7 (I7)
Process Technology: 65 nm low-power CMOS
Operating Temperature: -40C to +100C (industrial, junction)
比較對象 EP3C16E144C8N →
Altera
Process Technology: 65 nm low-power
Embedded 18x18 Multipliers: 66
Operating Temperature: -40C to +100C (Industrial)
比較對象 EP3C16E144C8N →
Intel
Package: 144-pin EQFP (exposed pad)
Speed Grade: C8 (commercial)
Embedded 18x18 Multipliers: 23
比較對象 EP3C16E144C8N →

EP3C16E144C7N

✅ 直接替換
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, identical 15,408 LE logic, C7 speed grade is faster than C8 (timing margin improvement, otherwise pin-to-pin)

📋 參考替代品（不在目錄中）

EP3C16E144I7N

✅ 直接替換
Intel
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone III · 15,408 · 516,096 bits · 84 · 963 · 56 · 4 · 20

聯絡詢價

查看資料表 →

EP3C16E144A7N

✅ 直接替換
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, identical 15,408 LE logic, A7 speed grade replaces C8 with automotive-grade screening

📋 參考替代品（不在目錄中）

EP3C25E144C8N

✅ 直接替換
📦 144-LQFP Exposed Pad (EQFP-144)
same 144-LQFP package, larger Cyclone III device (24,624 LEs vs 15,408 LEs, ~60% more logic); pin-compatible upgrade path

📋 參考替代品（不在目錄中）

EP3C10E144C8N

✅ 直接替換
Altera
📦 144-LQFP Exposed Pad (EQFP-144)
Cyclone III · Cyclone III EP3C10 · 10,320 · 423,936 · 94

聯絡詢價

查看資料表 →
ℹ️ 1 跨封裝零件已隱藏 — 不同封裝需重新加工 PCB，並非真正的直接替換品。 聯絡我們 如果您需要跨封裝建議。

EP3C16E144C8N 最大額定值與電氣特性

Family Cyclone III
Logic Elements (LEs) 15,408
Total Memory Bits 516,096 bits (63 Kbytes)
Embedded Memory Blocks M9K
Embedded 18x18 Multipliers 56
User I/O Pins 84
Phase-Locked Loops (PLLs) 4
Process Technology 65 nm
Core Voltage 1.2 V
Operating Temperature (Commercial) 0C to +85C
封裝 144-LQFP Exposed Pad (EQFP-144)
Speed Grade C8
安裝類型 Surface Mount
RoHS 狀態 Compliant
Configuration Memory SRAM-based (volatile)

EP3C16E144C8N 腳位配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
腳位 1 I/O — User I/O bank 1
腳位 2 I/O — User I/O bank 1
腳位 3 GND — Ground
腳位 4 VCCIO1 — I/O bank 1 supply voltage
腳位 5 I/O — User I/O bank 1
腳位 6 I/O — User I/O bank 1
腳位 7 I/O — User I/O bank 1
腳位 8 VCCINT — Core supply voltage 1.2V
腳位 9 I/O — User I/O bank 1
腳位 10 I/O — User I/O bank 1
腳位 11 GND — Ground
腳位 12 I/O — User I/O bank 1
腳位 13 I/O — User I/O bank 1
腳位 14 I/O — User I/O bank 2
腳位 15 VCCIO2 — I/O bank 2 supply voltage
腳位 16 I/O — User I/O bank 2
腳位 17 I/O — User I/O bank 2
腳位 18 I/O — User I/O bank 2
腳位 19 GND — Ground
腳位 20 I/O — User I/O bank 2
腳位 21 I/O — User I/O bank 2
腳位 22 VCCINT — Core supply voltage 1.2V
腳位 23 I/O — User I/O bank 2
腳位 24 I/O — User I/O bank 2
腳位 25 GND — Ground
腳位 26 I/O — User I/O bank 2
腳位 27 I/O — User I/O bank 2
腳位 28 I/O — User I/O bank 3
腳位 29 VCCIO3 — I/O bank 3 supply voltage
腳位 30 I/O — User I/O bank 3
腳位 31 I/O — User I/O bank 3
腳位 32 I/O — User I/O bank 3
腳位 33 GND — Ground
腳位 34 I/O — User I/O bank 3
腳位 35 I/O — User I/O bank 3
腳位 36 VCCINT — Core supply voltage 1.2V
腳位 37 I/O — User I/O bank 3
腳位 38 I/O — User I/O bank 3
腳位 39 GND — Ground
腳位 40 I/O — User I/O bank 3
腳位 41 I/O — User I/O bank 3
腳位 42 I/O — User I/O bank 4
腳位 43 VCCIO4 — I/O bank 4 supply voltage
腳位 44 I/O — User I/O bank 4
腳位 45 I/O — User I/O bank 4
腳位 46 I/O — User I/O bank 4
腳位 47 GND — Ground
腳位 48 I/O — User I/O bank 4
腳位 49 I/O — User I/O bank 4
腳位 50 VCCINT — Core supply voltage 1.2V
腳位 51 I/O — User I/O bank 4
腳位 52 I/O — User I/O bank 4
腳位 53 GND — Ground
腳位 54 I/O — User I/O bank 4
腳位 55 I/O — User I/O bank 4
腳位 56 I/O — User I/O bank 4
腳位 57 VCCIO4 — I/O bank 4 supply voltage
腳位 58 I/O — User I/O bank 4
腳位 59 I/O — User I/O bank 4
腳位 60 I/O — User I/O bank 5
腳位 61 GND — Ground
腳位 62 I/O — User I/O bank 5
腳位 63 I/O — User I/O bank 5
腳位 64 I/O — User I/O bank 5
腳位 65 VCCINT — Core supply voltage 1.2V
腳位 66 I/O — User I/O bank 5
腳位 67 I/O — User I/O bank 5
腳位 68 GND — Ground
腳位 69 I/O — User I/O bank 5
腳位 70 I/O — User I/O bank 5
腳位 71 I/O — User I/O bank 6
腳位 72 VCCIO6 — I/O bank 6 supply voltage
腳位 73 I/O — User I/O bank 6
腳位 74 I/O — User I/O bank 6
腳位 75 I/O — User I/O bank 6
腳位 76 GND — Ground
腳位 77 I/O — User I/O bank 6
腳位 78 I/O — User I/O bank 6
腳位 79 VCCINT — Core supply voltage 1.2V
腳位 80 I/O — User I/O bank 6
腳位 81 I/O — User I/O bank 6
腳位 82 GND — Ground
腳位 83 I/O — User I/O bank 7
腳位 84 I/O — User I/O bank 7
腳位 85 I/O — User I/O bank 7
腳位 86 VCCIO7 — I/O bank 7 supply voltage
腳位 87 I/O — User I/O bank 7
腳位 88 I/O — User I/O bank 7
腳位 89 GND — Ground
腳位 90 I/O — User I/O bank 7
腳位 91 I/O — User I/O bank 7
腳位 92 VCCINT — Core supply voltage 1.2V
腳位 93 I/O — User I/O bank 7
腳位 94 I/O — User I/O bank 7
腳位 95 GND — Ground
腳位 96 I/O — User I/O bank 8
腳位 97 I/O — User I/O bank 8
腳位 98 I/O — User I/O bank 8
腳位 99 VCCIO8 — I/O bank 8 supply voltage
腳位 100 I/O — User I/O bank 8
腳位 101 I/O — User I/O bank 8
腳位 102 GND — Ground
腳位 103 I/O — User I/O bank 8
腳位 104 I/O — User I/O bank 8
腳位 105 VCCINT — Core supply voltage 1.2V
腳位 106 I/O — User I/O bank 8
腳位 107 I/O — User I/O bank 8
腳位 108 GND — Ground
腳位 109 TCK — JTAG test clock
腳位 110 TMS — JTAG test mode select
腳位 111 TDI — JTAG test data input
腳位 112 TDO — JTAG test data output
腳位 113 nCONFIG — Configuration control (active low)
腳位 114 nSTATUS — Configuration status (active low)
腳位 115 CONF_DONE — Configuration done indicator
腳位 116 MSEL0 — Configuration mode select 0
腳位 117 MSEL1 — Configuration mode select 1
腳位 118 MSEL2 — Configuration mode select 2
腳位 119 DCLK — Configuration clock input
腳位 120 DATA0 — Configuration data input 0
腳位 121 GND — Ground
腳位 122 VCCINT — Core supply voltage 1.2V
腳位 123 nCE — Chip enable (active low)
腳位 124 I/O — User I/O bank 1
腳位 125 I/O — User I/O bank 1
腳位 126 I/O — User I/O bank 1
腳位 127 VCCIO1 — I/O bank 1 supply voltage
腳位 128 I/O — User I/O bank 1
腳位 129 I/O — User I/O bank 1
腳位 130 GND — Ground
腳位 131 I/O — User I/O bank 1
腳位 132 I/O — User I/O bank 1
腳位 133 VCCINT — Core supply voltage 1.2V
腳位 134 I/O — User I/O bank 1
腳位 135 I/O — User I/O bank 1
腳位 136 GND — Ground
腳位 137 I/O — User I/O bank 1
腳位 138 I/O — User I/O bank 1
腳位 139 I/O — User I/O bank 1
腳位 140 VCCIO1 — I/O bank 1 supply voltage
腳位 141 I/O — User I/O bank 1
腳位 142 I/O — User I/O bank 1
腳位 143 GND — Ground
腳位 144 EP — Exposed thermal pad - must be soldered to PCB ground pour

典型應用

EP3C16E144C8N 適用於 6 應用s: Industrial Motor Control, LED Display and Video Processing, Industrial Communication Gateways, Test and Measurement Equipment, Embedded Vision and Image Processing, Glue Logic Replacement and System Integration.

🏭

Industrial Motor Control

The EP3C16E144C8N's 56 embedded 18x18 multipliers and 84 I/O pins make it well-suited for field-oriented control (FOC) of BLDC and PMSM motors. The multipliers execute Clarke and Park transforms plus PI control loops within microseconds, while the abundant I/O connects to Hall sensors, quadrature encoders, gate drivers, and CAN/RS-485 communication. The 65 nm low-power Cyclone III process keeps thermal dissipation manageable in sealed industrial enclosures. Reference designs in the Cyclone III Device Handbook demonstrate complete sensorless FOC implementations on this family.

推薦

EP3C25E144C8N (Higher-density upgrade for multi-axis motor control) EP3C16F256C8N (Higher I/O variant for servo drives with multiple feedback interfaces)
📺

LED Display and Video Processing

The EP3C16E144C8N's 516 Kbits of embedded RAM serves as line buffers for video pixel pipelines, while its 56 multipliers perform real-time color space conversion (RGB to YCbCr), gamma correction, and edge enhancement. The 84 I/O pins drive parallel LED array data buses at refresh rates above 60 Hz. Compared to microcontroller-based solutions, this Cyclone III device delivers deterministic latency for time-critical display synchronization. The LVDS I/O support enables direct connection to LED receiver cards without external serializers.

推薦

EP3C16F256C8N (Higher I/O for large-format LED walls) EP3C25E144C8N (Logic density upgrade for higher-resolution pipelines)
🌐

Industrial Communication Gateways

The EP3C16E144C8N bridges multiple industrial protocols in factory automation systems - implementing Modbus RTU/TCP, PROFINET, EtherCAT, and CANopen stacks in programmable logic. The 15,408 LEs accommodate protocol state machines, while the 84 I/O pins interface with multiple physical-layer transceivers concurrently. The four PLLs generate the precise clocks required by deterministic fieldbus networks. Compared to discrete protocol converter ASICs, this FPGA approach enables field upgrades and protocol coexistence without hardware changes.

推薦

EP3C16E144C7N (Faster speed grade for tighter timing margins in deterministic networks) EP3C16E144I7N · Intel
🖥️

Test and Measurement Equipment

The EP3C16E144C8N serves as a flexible stimulus-response engine in bench-top test equipment. Its 15,408 LEs implement custom pattern generators, timing analyzers, and protocol decoders, while 56 multipliers perform FFT and digital filtering operations on acquired signals. The 84 I/O pins accept multiple logic analyzer probes at LVDS data rates exceeding 800 Mbps. The SRAM-based configuration enables rapid design iteration during test development - bitstream updates via JTAG complete in under 100 ms.

推薦

EP3C25E144C8N (Logic density upgrade for higher-channel-count test systems) EP3C120F484C7N · Intel
🎥

Embedded Vision and Image Processing

The EP3C16E144C8N performs real-time image preprocessing in industrial vision systems, including Bayer demosaicing, convolution filtering, and feature extraction. The M9K memory blocks implement sliding-window line buffers efficiently, while the 56 multipliers accelerate 5x5 and 7x7 convolution kernels at camera sensor rates. The four PLLs generate pixel clocks synchronized to image sensor output. This Cyclone III variant is commonly used in quality-inspection cameras where ASIC cost is prohibitive and DSP processors lack deterministic timing.

推薦

EP3C16F256C8N (Higher I/O for multiple image sensor interfaces) EP3C25E144C8N (Larger logic for complex image processing algorithms)
🔧

Glue Logic Replacement and System Integration

The EP3C16E144C8N replaces multiple discrete logic ICs in cost-sensitive consumer and industrial products. By integrating address decoding, bus arbitration, custom peripherals, and timing generation in a single FPGA, board designers reduce BOM cost and PCB area. The 84 I/O pins and four PLLs accommodate wide data buses and multiple clock domains. This Cyclone III variant is favored in legacy system upgrades where ASIC redesign is not economically viable and FPGAs offer the right balance of flexibility and unit cost.

推薦

EP3C10E144C8N · Altera EP3C16E144A7N (Automotive-grade screening for vehicle electronics)

推薦產品摘要

EP3C25E144C8N Higher-density upgrade for multi-axis motor control 用於： Industrial Motor Control, LED Display and Video Processing, Test and Measurement Equipment, Embedded Vision and Image Processing EP3C16F256C8N Higher I/O variant for servo drives with multiple feedback interfaces 用於： Industrial Motor Control, LED Display and Video Processing, Embedded Vision and Image Processing EP3C16E144C7N Faster speed grade for tighter timing margins in deterministic networks 用於： Industrial Communication Gateways EP3C16E144I7N Intel 用於： Industrial Communication Gateways EP3C120F484C7N Intel 用於： Test and Measurement Equipment EP3C10E144C8N Altera 用於： Glue Logic Replacement and System Integration EP3C16E144A7N Automotive-grade screening for vehicle electronics 用於： Glue Logic Replacement and System Integration
What family does the EP3C16E144C8N belong to?
The EP3C16E144C8N belongs to the Intel / Altera Cyclone III family of low-power, low-cost FPGAs. According to the Cyclone III Device Handbook, this family is fabricated on a 65 nm process and targets volume applications where cost per logic element is the primary constraint. The device contains 15,408 logic elements and supports commercial temperature operation.
How many logic elements and memory bits does EP3C16E144C8N have?
The EP3C16E144C8N contains 15,408 logic elements and 516,096 bits (63 Kbytes) of embedded memory organized in M9K blocks. This density positions it in the mid-range of the Cyclone III family. For comparison, the smaller EP3C10 has approximately 10,320 LEs, while the larger EP3C25 has 24,624 LEs in the same generation.
What package does the EP3C16E144C8N use?
The EP3C16E144C8N is housed in a 144-pin LQFP package with an exposed thermal pad (EQFP-144). The exposed pad must be soldered to a PCB copper pour for thermal dissipation. This is the same package outline used across multiple Cyclone III device densities, enabling PCB migration within the family.
What is the difference between EP3C16E144C8N and EP3C16E144I7N?
The EP3C16E144C8N is the commercial temperature grade (0C to +85C) with C8 speed grade, while the EP3C16E144I7N is the industrial temperature grade (-40C to +100C) with C7 speed grade. Both share the same 144-LQFP package, 15,408 LEs, and pinout. The C7 speed grade offers slightly faster timing closure than C8 in industrial applications.
How many I/O pins are available on EP3C16E144C8N?
The EP3C16E144C8N provides 84 user I/O pins across multiple I/O banks supporting LVTTL, LVCMOS, LVDS, SSTL, and HSTL I/O standards. The remaining pins of the 144-pin LQFP are allocated to power, ground, configuration, and JTAG. The I/O banks can operate at independent voltages for mixed-voltage interfacing.
What is the best drop-in replacement for EP3C16E144C8N?
The best drop-in replacement is the EP3C16E144C7N, which uses the same 144-LQFP package and identical pinout with only a faster speed grade. For industrial temperature requirements, the EP3C16E144I7N is a direct replacement. Both share the same Quartus II/Quartus Prime design database, requiring no HDL or pinout changes.
Where can I buy the EP3C16E144C8N online?
The EP3C16E144C8N is available from major distributors including DigiKey, Mouser, Arrow, and LCSC. As of 2026-09-09, LCSC lists the part at approximately $36.02 for single-piece quantity. Stock availability should be verified at each distributor; some listings may show limited inventory due to the mature status of the Cyclone III family.
What is the lead time for EP3C16E144C8N?
The lead time for the EP3C16E144C8N varies by distributor. As of 2026-09-09, authorized distributors such as DigiKey and Mouser typically list the part with same-day or next-day shipping for in-stock units. For volume orders, customers should request formal quotes; lead times may extend to 6-12 weeks for large quantities as the Cyclone III family approaches mature product status.
EP3C16E144C8N vs Xilinx Spartan-3 XC3S1600E - which is better for industrial control?
Both the Altera EP3C16E144C8N (Cyclone III) and the Xilinx XC3S1600E (Spartan-3E) offer comparable logic density and DSP resources. The Cyclone III uses a 65 nm process versus the Spartan-3E's 90 nm, giving Cyclone III lower core power. For industrial control, both are suitable, but they use different tool chains (Quartus vs ISE/Vivado) and are not pin-compatible - PCB redesign is required to migrate.
When should I choose EP3C16E144C8N over EP3C16F256C8N?
Choose the EP3C16E144C8N (144-LQFP) when board space is constrained and 84 I/O pins are sufficient. Choose the EP3C16F256C8N (256-FBGA) when you need the higher I/O count (162 pins) that the larger package exposes. Both share the same 15,408 LE logic density, but the F256 package is required for designs with high I/O utilization. The LQFP footprint cannot be migrated to BGA without PCB redesign.
Is EP3C16E144C8N suitable for motor control applications?
Yes, the EP3C16E144C8N is well-suited for industrial motor control. Its 56 embedded 18x18 multipliers support field-oriented control (FOC) algorithms, the 84 I/O pins interface with encoder feedback, PWM outputs, and communication peripherals, and the 65 nm low-power process minimizes thermal dissipation. Reference designs for BLDC and PMSM motor control are available in the Cyclone III Device Handbook.
Where to download the EP3C16E144C8N datasheet PDF?
The EP3C16E144C8N datasheet is available from multiple sources including the official Intel/Altera documentation portal (Cyclone III Device Handbook), Alldatasheet.com, Datasheets.com, and FindIC. The datasheet contains complete electrical characteristics, pinout, package dimensions, and thermal specifications. Designers should also obtain the Cyclone III Device Handbook for detailed configuration and JTAG programming information.
Where to find the EP3C16E144C8N pinout?
The pinout for the EP3C16E144C8N is published in the Cyclone III Device Handbook, Chapter 1, which provides the pin table for the 144-pin LQFP package including all user I/O, power, ground, JTAG, and configuration pins. Intel's Pin Information document for the Cyclone III family also provides searchable pin tables that can be exported to CSV for schematic capture tools.
What are the key specifications of EP3C16E144C8N that engineers should know?
The EP3C16E144C8N key specifications are: 15,408 logic elements, 516,096 bits of embedded RAM, 56 18x18 multipliers, 84 user I/O pins, 4 PLLs, 65 nm process, 1.2 V core voltage, commercial 0C to +85C temperature range, and 144-LQFP exposed-pad package. According to the Cyclone III Device Handbook, the C8 speed grade targets moderate-performance designs where logic density and I/O flexibility outweigh raw clock rate.

工程參考資料，適用於 EP3C16E144C8N — 比較、設計指引及合規資訊。

選型指南

Choose the EP3C16E144C8N when you need approximately 15K logic elements, 84 user I/O pins, and 56 multipliers in a cost-effective 144-LQFP package for commercial-temperature (0C to +85C) applications. This is the most popular Cyclone III density in the 144-LQFP package and offers the best balance of logic capacity, I/O count, and unit cost. Choose EP3C16E144C7N if you need slightly faster timing closure. Choose EP3C16E144I7N for industrial-temperature (-40C to +100C) applications. Choose EP3C16E144A7N for automotive-grade screening. Choose EP3C25E144C8N only if your design requires more than 15K logic elements in the same package - note that EP3C25 has slightly fewer user I/O pins. Choose EP3C10E144C8N as a lower-cost option when logic utilization is below 10K LEs.

與替代品比較

參數 本產品 EP3C16E144C7N EP3C16E144I7N EP3C16E144A7N EP3C25E144C8N EP3C10E144C8N
Brand Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera Intel / Altera
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same 144-LQFP Exposed Pad - same
Logic Elements 15,408 15,408 (same) 15,408 (same) 15,408 (same) 24,624 (+60%) 10,320 (-33%)
Memory Bits 516,096 bits 516,096 bits (same) 516,096 bits (same) 516,096 bits (same) 608,256 bits (+18%) 414,720 bits (-20%)
Speed Grade C8 C7 (faster) C7 (faster) A7 (automotive) C8 (same) C8 (same)
Temperature Grade Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Automotive-grade screened Commercial (0C to +85C) Commercial (0C to +85C)
User I/O Pins 84 84 (same) 84 (same) 84 (same) 82 (slightly fewer) 91 (more I/O)
18x18 Multipliers 56 56 (same) 56 (same) 56 (same) 66 (+18%) 46 (-18%)

主要差異化特點

  • Largest Cyclone III device available in 144-LQFP package (對比EP3C25E144C8N)
  • Commercial temperature grade with C8 speed grade (對比EP3C16E144I7N)
  • Pin-compatible upgrade and downgrade paths within Cyclone III family (對比EP3C10E144C8N and EP3C25E144C8N)

設計說明

The EP3C16E144C8N requires three separate power rails: 1.2V VCCINT for the core logic, 2.5V/3.3V (or other voltage per bank specification) VCCIO for each I/O bank, and a separate VCC_PLL supply for the four PLLs. Decoupling must include 0.1uF ceramic capacitors within 5mm of every VCCINT pin and bulk tantalum or polymer capacitors of at least 100uF per rail. Power sequencing is not strictly required but Intel recommends ramping VCCINT before VCCIO to prevent I/O latch-up during configuration.

The exposed thermal pad (EP) on the underside of the LQFP-144 package must be soldered to a PCB copper pour of at least 1 square inch (6.5 cm^2) for thermal dissipation. Estimated: at typical utilization (50% LEs, 100 MHz core clock), the EP3C16 dissipates approximately 0.5-1.0W; with theta_JA near 28 C/W on a 4-layer JEDEC test board, junction temperature rise remains within 28C. Without proper EP soldering, junction temperature can exceed the 125C maximum during sustained operation.

Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective supply pins. Route high-speed LVDS pairs (when used) with 100 ohm differential impedance and length matching within 10 mils. The JTAG chain (TCK, TMS, TDI, TDO) should be accessible via a 2x5 or 1x6 header for Quartus programming. Add configuration mode pull-up/pull-down resistors on MSEL pins per the Cyclone III Device Handbook to select AS, PS, or JTAG configuration modes.

Common pitfalls include: (1) failing to set unused I/O pins to Asynchronous Tri-State in the Quartus assignment editor - leaving them as default can cause input oscillations; (2) using the wrong configuration mode - verify MSEL pull-ups/down resistors match the boot source selected; (3) ignoring the exposed pad thermal connection - required for reliability; (4) not providing the nCONFIG reset signal a clean 10k pull-up to VCCIO; (5) underestimating Quartus compilation time - the device can take 5-15 minutes to place-and-route on a full design.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Compliant

RoHS and lead-free compliant per DigiKey product listing. Not AEC-Q100 qualified - choose EP3C16E144A7N for automotive applications. Halogen-free status not explicitly stated in the verified web data.

資料驗證日期： 2026-09-09 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP3C16E144C8N EP3C16E144C8N datasheet Cyclone III FPGA 144 LQFP EP3C16E144C8N price Altera Cyclone III 15408 logic elements EP3C16E144C8N vs EP3C16E144I7N EP3C16E144C8N motor control application Cyclone III FPGA drop-in replacement EP3C16E144C8N pinout LQFP-144 where to buy EP3C16E144C8N what is the difference between C7 and C8 speed grade Cyclone III low cost FPGA 16K logic elements 84 I/O

相關元件與詞彙

Intel Altera EP3C16E144C8N Cyclone III FPGA Field Programmable Gate Array Logic Element M9K memory block 18x18 multiplier PLL Phase-Locked Loop 144-LQFP EQFP-144 Exposed Pad 65nm process LVDS LVCMOS JTAG Quartus Prime RoHS AEC-Q100 Industrial temperature grade Commercial temperature grade Motor control Industrial automation Embedded vision
快速報價 RFQ
我們的業務團隊將於 24 小時內回覆
料號MfrPkg數量目標價格
×
✓
報價已提交！

我們將於 24 小時內回覆您的電子郵件

購物車 0 個項目
您的購物車是空的
快速報價 RFQ
請填寫完整詳細資料 — 我們的業務團隊將於 24 小時內回覆
料號 製造商 封裝 QTY 目標價格 小計
✓
報價已提交！

我們將於 24 小時內回覆您的電子郵件

1
詢價已提交
2
已收到報價
3
已下單
4
付款
5
已出貨
6
已送達
檢視詢價單詳情