10AS032H1F34E1HG vs 10AS032H1F35E1HG 比較
詳細並排比較 10AS032H1F34E1HG 由 Intel 與 10AS032H1F35E1HG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
10AS032H1F34E1HG - Arria 10 SX SoC FPGA, 320K LE, 1152-FBGA | Intel (Altera)
10AS032H1F34E1HG ✓ 啟用中規格比較
| 參數 | 10AS032H1F34E1HG | 10AS032H1F35E1HG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Device Family | Arria 10 SX | — |
| Architecture | 20nm SoC FPGA (FPGA + hard ARM Cortex-A9 subsystem) | — |
| Logic Elements | 320,000 | 320K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz |
| On-chip Memory | Approx. 21 Mb (M20K blocks) | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | Multi-gigabit transceivers (up to 24 channels, family-wide) |
| DSP Blocks | Variable-precision hardened DSP with floating-point | Variable-precision DSP blocks |
| Hard Memory Controllers | DDR4 up to 2133 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| 封裝 | 1152-ball FCBGA (35 x 35 mm) | 1152-FBGA, FC (Flip-Chip BGA), 35x35 mm |
| Operating Temperature (E1 suffix) | 0C to +100C (extended) | — |
| 安裝類型 | Surface Mount, flip-chip BGA | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| Pin/Ball Count | 1152 | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Arria 10 SX |
| Device Type | — | System on Chip (SoC) FPGA |
| Hard Processor Subsystem (HPS) | — | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| User I/O Count | — | 384 |
| Process Technology | — | 20nm TSMC |
| Embedded Memory | — | M20K blocks (variable, density per family) |
| External Memory Interfaces | — | DDR4, DDR3, RLDRAM3, QDRII+ |
| Hard Memory Controller | — | Yes |
| Hard PCIe | — | PCI Express Gen3 controllers (hard IP) |
| Partial Reconfiguration | — | Supported |
| 工作溫度 | — | Industrial / Extended grade (per part suffix) |
| Lead-Free | — | Yes |