5CSEBA6U23C8SN vs 5CSEBA6U19C8SN 比較
詳細並排比較 5CSEBA6U23C8SN 由 Intel 與 5CSEBA6U19C8SN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 5CSEBA6U23C8SN | 5CSEBA6U19C8SN |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE |
| Device Designator | 5CSEBA6 (U23 speed grade, 8 speed) | — |
| Logic Elements | 110,000 | 110,000 |
| HPS Processor | Single ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Frequency | 600 MHz | 600 MHz |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| DSP Blocks | 224 (18x18 multipliers) | — |
| Embedded Memory | 4.45 Mbits (M10K + MLAB) | — |
| Hard Memory Controller | DDR2/DDR3 with ECC (HPS) | — |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, NAND, SD/MMC, I2C, SPI, UART | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count for U23 package] | — |
| LVDS Channels | Up to 17 (875 Mbps) | — |
| Process Technology | TSMC 28 nm low-power | 28 nm low-power |
| 工作溫度 | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: full range from datasheet] |
| 封裝 | 672-ball UBGA (23x23 mm) | 484-pin UFBGA (19x19 mm) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: per JEDEC J-STD-020] |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Product Type | — | SoC FPGA (FPGA + ARM Cortex-A9 HPS) |
| HPS Core | — | Single ARM Cortex-A9 MPCore with CoreSight |
| DSP Blocks (18x18) | — | 224 |
| Embedded Memory (M10K/M20K) | — | [DATA_NEEDED: total Kbits] |
| Transceivers | — | Up to 5 Gbps (per Cyclone V SE family) |
| Core Voltage | — | 1.1 V |
| Ball Count | — | 484 |