A3P600-1FG144I vs A3P600-1FGG144 比較
詳細並排比較 A3P600-1FG144I 由 Microchip Technology 與 A3P600-1FGG144 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | A3P600-1FG144I | A3P600-1FGG144 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | — |
| Maximum System Performance | 272 MHz | 350 MHz |
| Technology | 130nm | — |
| Core Supply Voltage | 1.5V | 1.5 V |
| User I/Os | 97 | — |
| RAM Bits | 110592 | — |
| Logic Elements / CLBs | 13824 | — |
| Package Type | FBGA-144 | — |
| Package Pitch | 1 mm | 1.00 mm |
| 工作溫度範圍 | 0°C to 70°C | 0 C to +70 C |
| Logic Family | CMOS | — |
| 安裝類型 | Surface Mount | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Total Gates | — | 600,000 |
| Logic Elements (CLBs) | — | 13,824 |
| Number of I/Os | — | 97 |
| Embedded RAM | — | 110,592 bits |
| 封裝 | — | 144-LBGA (FBGA) |
| 安裝方式 | — | SMD/SMT |
| Packaging | — | Tray |
| I/O Banks | — | 4 |
| Configuration | — | Flash-based (non-volatile) |