A3P600-1FGG256 vs A3P600-1FGG256I 比較

詳細並排比較 A3P600-1FGG256 由 Microchip Technology 與 A3P600-1FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P600-1FGG256 A3P600-1FGG256 - ProASIC3 FPGA 600K Gates | Microchip

A3P600-1FGG256 - ProASIC3 FPGA 600K Gates | Microchip

A3P600-1FGG256 ✓ 啟用中
Microchip Technology
A3P600-1FGG256I A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip

A3P600-1FGG256I - ProASIC3 FPGA, 600K Gates | Microchip

A3P600-1FGG256I ✓ 啟用中

規格比較

參數 A3P600-1FGG256 A3P600-1FGG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
FPGA Family ProASIC3 —
System Gates 600,000 —
VersaTiles / Logic Cells 13,824 —
RAM Bits 110,592 —
User I/O 177 —
I/O Banks 4 —
封裝 256-ball FBGA / LBGA, 17x17 mm, 1.00 mm pitch —
Speed Grade -1 —
最大時脈頻率 350 MHz —
Core Supply Voltage 1.5 V 1.5V
I/O Supply Voltage Range 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
工作溫度範圍 0C to +85C (commercial) —
Configuration Technology Nonvolatile flash, instant-on —
安裝類型 Surface Mount Surface Mount
Lead-Free / RoHS Lead-free, RoHS compliant finish (FGG) —
Family — ProASIC3
Number of Logic Elements/Cells — 7KLEs
Total RAM Bits — 110592
Number of I/O — 177
Number of Gates — 600K
Voltage - Supply — 1.425V ~ 1.575V
封裝 / 外殼 — 256-LBGA
Supplier Device Package — 256-FBGA
工作溫度 — -40°C ~ 100°C (TJ)
Maximum Operating Frequency — 272 MHz
Technology — 130nm
Number of I/O Banks — [DATA_NEEDED: Number of I/O Banks]
Embedded Memory — 110592 bits
RoHS 狀態 — Compliant

資料表與資源

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