A3P600-2FG256 vs M1AFS1500-2FGG256 比較

詳細並排比較 A3P600-2FG256 由 Microchip Technology 與 M1AFS1500-2FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P600-2FG256 A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip

A3P600-2FG256 - ProASIC3 FPGA 600K Gates 256-FBGA | Microchip

A3P600-2FG256 ✓ 啟用中
Microchip Technology
M1AFS1500-2FGG256 M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip

M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip

M1AFS1500-2FGG256 ✓ 啟用中

規格比較

參數 A3P600-2FG256 M1AFS1500-2FGG256
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Logic Family ProASIC3 —
System Gates 600000 gates 1,500,000
User I/O Count 177 —
Speed Grade -2 -2
Maximum System Frequency 310 MHz —
Core Voltage 1.5 V —
Process Technology 130 nm CMOS flash —
Configuration Memory On-chip Flash (non-volatile) —
I/O Banks 4 —
封裝 256-FBGA (LBGA) —
安裝類型 Surface Mount —
Soft CPU Support Optional soft ARM —
Instant-On Operation Yes —
工作溫度 [DATA_NEEDED: operating temperature range] —
Embedded Memory [DATA_NEEDED: embedded memory bit count] —
RoHS 狀態 [DATA_NEEDED: RoHS status] —
Programmability Reprogrammable (flash) —
Series — M1AFS1500 (Fusion)
Logic Cells — 38,400
Embedded Processor — ARM Cortex-M1
最大時脈頻率 — 350 MHz
Number of I/O — 119
工作電源電壓 — 1.5 V
Flash Memory Bits (reported) — 276480
Technology — CMOS, 130nm class
封裝 / 外殼 — 256-LBGA (FBGA, S-PBGA-B256)
Ball Pitch — 1.00 mm
安裝方式 — SMD/SMT
工作溫度範圍 — 0C to +70C
Analog Blocks — Configurable analog (Fusion mixed-signal architecture)
Programming Type — Flash-based (in-system programmable)
Packaging — Tray
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Total RAM Blocks — [DATA_NEEDED: RAM block count]

資料表與資源

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