A3P600-FG256 vs A3P600L-FG256I 比較
詳細並排比較 A3P600-FG256 由 Microchip Technology 與 A3P600L-FG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ 啟用中Microchip Technology
A3P600L-FG256I - 600K Gate Flash FPGA, 177 I/O | Microchip
A3P600L-FG256I ✓ 啟用中規格比較
| 參數 | A3P600-FG256 | A3P600L-FG256I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 (Flash FPGAs) | ProASIC3L |
| System Gates | 600000 | — |
| Logic Elements | 7K LEs (VersaTiles) | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| User I/O | 177 | 177 |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm flash |
| Maximum System Performance | Approx. 231 MHz | — |
| Configuration Technology | On-chip flash, reprogrammable, single-chip | — |
| Power-Up Behavior | Instant On Level 0 support | — |
| 封裝 | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) | 256-ball FBGA (LBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0 C to 85 C (TJ) | — |
| I/O Banks | 4 (independent VCCIBx supplies) | — |
| Packaging | Tray | — |
| RoHS 狀態 | RoHS non-compliant (per Microchip USA listing) | [DATA_NEEDED: RoHS status] |
| Manufacturer Lead Time | 8 weeks | — |
| Logic Gates | — | 600000 gates |
| Embedded RAM | — | 110592 bits |
| Core Voltage | — | 1.2 V |
| Configuration Memory | — | On-chip flash (nonvolatile, single-chip) |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Programming | — | In-system reprogrammable flash |
| Speed Grade | — | Standard (see ordering code) |
| MOQ / Packaging | — | [DATA_NEEDED: packaging quantity] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Supported I/O Standards | — | [DATA_NEEDED: I/O standard list] |