A3P600-FGG484 vs A3P600L-FGG484 比較
詳細並排比較 A3P600-FGG484 由 Microchip Technology 與 A3P600L-FGG484 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | A3P600-FGG484 | A3P600L-FGG484 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3 | ProASIC3L |
| System Gates | 600K | — |
| Maximum System Frequency | 231 MHz | 350 MHz |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| 封裝 | 484-Pin FBGA (FGG484) | FBGA-484 (PBGA484) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile, single chip) | On-chip flash (non-volatile, single chip) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| RoHS 狀態 | Lead Free | Green (RoHS compliant per Jotrin listing) |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Equivalent Gates | — | 600000 gates |
| Logic Cells / CLBs | — | 13824 |
| User I/O | — | 235 |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V supported) |
| Technology | — | 130 nm CMOS flash |
| Package Dimensions | — | 23 x 23 mm |
| Package Height | — | 2.23 mm |
| Ball Pitch | — | 1 mm |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| Soft Processor Support | — | ARM Cortex-M1 |
| Speed Grade Suffix | — | Standard (no dash number in this ordering code) |