A3PE3000-FG484 vs A3PE3000L-FGG484M 比較
詳細並排比較 A3PE3000-FG484 由 Microchip Technology 與 A3PE3000L-FGG484M 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE3000-FG484 - ProASIC3E 3M-Gate Flash FPGA 484-BGA | Microchip
A3PE3000-FG484 ✓ 啟用中Microchip Technology
A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip
A3PE3000L-FGG484M ✓ 啟用中規格比較
| 參數 | A3PE3000-FG484 | A3PE3000L-FGG484M |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | ProASIC3E Flash FPGA | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 | 3000000 |
| Logic Cells (DFEs) | 75264 | — |
| User I/O | 341 | — |
| Core Voltage | 1.5 V | 1.2 V to 1.5 V |
| System Frequency | 231 MHz | — |
| Process Technology | 130 nm flash CMOS | — |
| Configuration Memory | On-chip flash (non-volatile, single-chip) | — |
| 封裝 | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height | — |
| 安裝類型 | Surface Mount | — |
| Soft CPU Support | Optional soft ARM support | — |
| Differential I/O Standards | LVDS, LVPECL | — |
| Footprint Compatibility | FG256 and FG484 footprint-compatible | — |
| Packaging | Tray | Tray |
| RoHS 狀態 | G suffix = RoHS compliant (FG484 non-G variant per datasheet ordering info) | Compliant |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | [DATA_NEEDED: embedded block RAM capacity] | 516096 bits |
| Logic Elements / Cells | — | 75264 |
| Number of I/Os | — | 341 |
| 安裝方式 | — | SMD/SMT |
| 封裝 / 外殼 | — | FBGA-484 (FGG484) |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1.0 mm pitch |
| Minimum Operating Temperature | — | -55 C |
| Maximum Operating Temperature | — | +125 C |
| Temperature Grade | — | Military (M suffix) |
| Technology | — | Flash-based, non-volatile, Flash*Freeze |
| Terminal Form | — | Ball |
| Product Series | — | A3PE3000L |