A3PE3000L-FGG484 vs A3PE3000L-FGG484M 比較

詳細並排比較 A3PE3000L-FGG484 由 Microchip Technology 與 A3PE3000L-FGG484M 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3PE3000L-FGG484 A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip

A3PE3000L-FGG484 ✓ 啟用中
Microchip Technology
A3PE3000L-FGG484M A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M - ProASIC3L 3M-Gate Flash FPGA | Microchip

A3PE3000L-FGG484M ✓ 啟用中

規格比較

參數 A3PE3000L-FGG484 A3PE3000L-FGG484M
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3L (Low Power Flash FPGA) ProASIC3L (ProASIC3 Low Power)
System Gates 3,000,000 3000000
Logic Cells 75,264 —
User I/O 341 —
Embedded RAM 516,096 bits —
Core Voltage 1.2 V to 1.5 V 1.2 V to 1.5 V
Process Technology 130 nm flash —
Configuration Technology Nonvolatile flash, Instant On —
Low Power Feature Flash*Freeze technology —
封裝 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch —
安裝類型 Surface Mount —
工作溫度 [DATA_NEEDED: operating temperature range] —
Supply Voltage - I/O [DATA_NEEDED: I/O bank voltage range] —
RoHS 狀態 Compliant (per Newark: RoHS Compliant: Yes) Compliant
Packaging Tray Tray
Security Single-chip, flash-based, secure nonvolatile configuration —
Logic Elements / Cells — 75264
Number of I/Os — 341
Embedded Memory — 516096 bits
安裝方式 — SMD/SMT
封裝 / 外殼 — FBGA-484 (FGG484)
Package Dimensions — 23 x 23 mm, 2.23 mm height, 1.0 mm pitch
Minimum Operating Temperature — -55 C
Maximum Operating Temperature — +125 C
Temperature Grade — Military (M suffix)
Technology — Flash-based, non-volatile, Flash*Freeze
Terminal Form — Ball
Product Series — A3PE3000L

資料表與資源

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