ATSAMA5D24C-CU vs ATSAMA5D23B-CU 比較
詳細並排比較 ATSAMA5D24C-CU 由 Microchip Technology 與 ATSAMA5D23B-CU 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
ATSAMA5D24C-CU - Cortex-A5 MPU 500MHz 256-TFBGA | Microchip
ATSAMA5D24C-CU ✓ 啟用中Microchip Technology
ATSAMA5D23B-CU - Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D23B-CU ✓ 啟用中規格比較
| 參數 | ATSAMA5D24C-CU | ATSAMA5D23B-CU |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Core Architecture | ARM Cortex-A5 | ARM Cortex-A5 (ARMv7-A) |
| Number of Cores | 1 | — |
| 資料匯流排寬度 | 32-bit | — |
| Maximum CPU Clock | 500 MHz | — |
| Internal SRAM | 128 KB | 128 KB |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Memory Interface | DDR2, DDR3L, LPDDR2, LPDDR3 | — |
| External Memory Bus | 16-bit (DDR2/DDR3L/LPDDR2/LPDDR3) | — |
| Boot Memory | QSPI, e.MMC, NAND, SD | — |
| Graphics / Video | Hardware H.264/VP8 720p decoder, LCD controller up to XGA | — |
| 封裝 | 256-ball TFBGA, 8x8 mm | 196-TFBGA (11x11 mm) |
| Supply Voltage (Core) | 1.2 V typical | — |
| 工作溫度 | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Backup Mode Current | 5 uA typical | — |
| Ethernet | 2x GMAC (10/100/1000 Mbps) | Dual 10/100 EMAC |
| USB | 1x HS USB Host/Device with PHY, 1x HS USB Host | USB 2.0 High-Speed Host + Device |
| CAN | 2x CAN-FD controllers | Dual CAN-FD |
| Audio | I2S, Class D amplifier, embedded audio subsystem | — |
| Security | TrustZone, secure boot, hardware crypto accelerators | — |
| RoHS 狀態 | Compliant | Compliant |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| Maximum Core Frequency | — | 500 MHz |
| Core Count | — | 1 |
| External Memory Interface | — | 16-bit DDR2/LPDDR/LPDDR2 |
| Ball Pitch | — | 0.8 mm |
| 供應電壓 | — | 1.2 V core |
| Backup Current | — | 5 uA typical |
| Graphics | — | Integrated LCD controller with 2D accelerator |
| ADC | — | 12-bit, 16-channel |