EP2A25F672I9 vs EP2A25F672C9N 比較
詳細並排比較 EP2A25F672I9 由 Intel 與 EP2A25F672C9N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A25F672I9 | EP2A25F672C9N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LEs) | 24,320 | — |
| System Gates (typical) | 900,000 | — |
| Maximum Operating Frequency | 236 MHz | — |
| Process Technology | 0.15 µm CMOS | 0.15 µm all-layer copper, up to 8 metal layers |
| Core Voltage (VCCINT) | 1.5 V | — |
| 封裝 | 672-pin FC-FBGA | 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch |
| 腳位數 | 672 | — |
| Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | 9 (fastest APEX II grade) | — |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM/ROM) | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pin count] | 492 |
| Maximum Memory Bits | 422,400 bits | — |
| PLLs | 4 | — |
| 安裝類型 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Peak Reflow Temperature | 220 °C (per distributor listing) | — |
| 濕度敏感等級 (MSL) | 3 | — |
| RoHS 狀態 | Unknown (legacy 2000s part; verify lot certificate) | Compliant (per distributor listings) |
| Logic Elements / Cells | — | 24320 |
| System Gates | — | Approx. 900000 |
| Operating Frequency | — | 236 MHz |
| Core Supply Voltage (VCCINT) | — | 1.425 V to 1.575 V (nominal 1.5 V) |
| Seated Height (max) | — | 2.100 mm |
| Propagation Delay | — | 2.23 ns |
| Logic Family | — | CMOS |
| 工作溫度 | — | 0 °C to +85 °C (commercial, C9 grade) |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport |
| LVDS Data Rate | — | Up to 1 Gbps (True-LVDS) |
| Configuration Interface | — | Serial / Parallel PROM, JTAG, passive parallel (enhanced) |
| Embedded Memory | — | Enhanced System Blocks (ESBs) for dual-port RAM |
| Design Software | — | Quartus II (v5.1 or later) |