EP2AGX65DF29C6G vs EP2AGX65DF29I5G 比較
詳細並排比較 EP2AGX65DF29C6G 由 Intel 與 EP2AGX65DF29I5G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX65DF29C6G | EP2AGX65DF29I5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria II GX | Arria II |
| Logic Elements | 60,214 | — |
| Embedded Memory Bits | 5,371,904 | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Number of I/O | 364 | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Supply Voltage Range | [DATA_NEEDED: full supply range] | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (max) | 6 Gbps (C6 speed grade) | — |
| Number of PLLs | 12 | — |
| Number of DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Number of 18x18 Multipliers | 12 | — |
| Process Technology | 40 nm | 40 nm TSMC |
| 封裝 | 780-pin FC-FBGA | 780-ball FCBGA (Flip-Chip BGA), 29 mm x 29 mm |
| 安裝類型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| 工作溫度範圍 | 0C to +85C (Commercial) | — |
| Speed Grade | C6 (Commercial, mid-tier) | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Arria II GX |
| Logic Elements (LE) | — | 60,214 |
| Embedded Memory | — | 5,371,904 bits |
| Logic Array Blocks (LABs) | — | 2,530 |
| User I/O Count | — | 364 |
| DSP Blocks | — | 17 (18x18 multipliers) |
| Multi-Gigabit Transceivers | — | 8 channels up to 6.3125 Gbps |
| Hard PCIe Controllers | — | 2 (Gen1/Gen2, endpoint + root port) |
| I/O Bank Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (LVDS, LVTTL, LVCMOS) |
| 工作溫度 | — | -40C to +100C (Industrial) |
| Configuration Modes | — | FPP, AS, JTAG, PS |
| Security | — | AES-256 bitstream encryption |