EP2AGZ300FF35C4N vs EP2AGZ300FF35I3G 比較

詳細並排比較 EP2AGZ300FF35C4N 由 Altera 與 EP2AGZ300FF35I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGZ300FF35C4N EP2AGZ300FF35I3G
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Series Arria II GZ —
Logic Elements 298,000 —
Logic Array Blocks (LABs) 11,920 —
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) —
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm —
Core Voltage 0.9 V —
Package Type 1152-BBGA, FCBGA (flip-chip) —
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated —
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: number of DSP blocks]
PLLs [DATA_NEEDED: PLL count] [DATA_NEEDED: number of PLLs]
RoHS 狀態 Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
安裝類型 Surface Mount Surface Mount
Maximum Operating Frequency 500 MHz —
Family — Arria II GZ
Logic Elements (LE) — 300000
Number of User I/O — 554 (maximum)
Number of Transceivers — 8
Transceiver Data Rate — Up to 6.375 Gbps
Process Node — 40 nm
工作溫度 — -40C to +100 C (I3 industrial)
封裝 — 1152-ball FBGA (FF35)
供應電壓 — [DATA_NEEDED: core and I/O supply voltage values]
Embedded Memory (Mbits) — 16.4
Memory Interfaces — DDR3, QDRII+, RLDRAM II
Configuration Method — Serial, Parallel, JTAG
MSL 等級 — 3 (168 hours)
Lead-Free — Yes

資料表與資源

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