EP2AGZ300FF35C4N vs EP2AGZ300FH29C4N 比較

詳細並排比較 EP2AGZ300FF35C4N 由 Altera 與 EP2AGZ300FH29C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2AGZ300FF35C4N EP2AGZ300FH29C4N
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Series Arria II GZ —
Logic Elements 298,000 —
Logic Array Blocks (LABs) 11,920 11,920
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) 18,854,912
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm —
Core Voltage 0.9 V 0.9 V
Package Type 1152-BBGA, FCBGA (flip-chip) —
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated Up to 28 (up to 6.375 Gbps)
DSP Blocks [DATA_NEEDED: number of DSP blocks] [DATA_NEEDED: exact DSP block count for EP2AGZ300]
PLLs [DATA_NEEDED: PLL count] —
RoHS 狀態 Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
安裝類型 Surface Mount Surface Mount (BGA)
Maximum Operating Frequency 500 MHz —
Family — Arria II GZ
Logic Elements (LE) — 298,000
Adaptive Logic Modules (ALMs) — 119,200
User I/O Pins — 281
Process Node — 40 nm
封裝 — 780-ball FC-HFBGA (FH29)
Speed Grade — C4
Temperature Grade — Industrial (N suffix)

資料表與資源

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