EP2S130F1020I4 vs EP2S130F1020C3 比較
詳細並排比較 EP2S130F1020I4 由 Intel 與 EP2S130F1020C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S130F1020I4 | EP2S130F1020C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Equivalent LEs | ~180,000 | — |
| Adaptive Logic Modules (ALMs) | 53,016 | — |
| Embedded Memory (bits) | 6,747,840 | — |
| Embedded Memory (M512 blocks) | 530 | — |
| Embedded Memory (M4K blocks) | 768 | — |
| Embedded Memory (M-RAM blocks) | 4 | — |
| Embedded 18x18 Multipliers | 504 | — |
| DSP Blocks | 48 | — |
| User I/O Pins | 742 | — |
| User I/O Banks | 12 | — |
| 封裝 | 1020-ball FC-FBGA (33x33 mm) | — |
| Process Node | 90 nm CMOS, all-layer copper | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Speed Grade | I (industrial performance) | C3 (commercial, -3 speed) |
| Device Revision | 4 | — |
| 工作接面溫度 | -40C to +100C (industrial) | — |
| Configuration Scheme | Fast Passive Parallel x8, Passive Serial, JTAG | — |
| 安裝類型 | Surface Mount (FC-FBGA) | Surface Mount |
| RoHS 狀態 | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status] |
| Series | — | Stratix II |
| Logic Elements / Cells | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/Os | — | 742 |
| Embedded Memory (TriMatrix) | — | [DATA_NEEDED: total Mbits] |
| DSP / Multiplier Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | Logic-rich SKU (no transceiver; transceiver variants use different suffix) |
| Maximum Internal Frequency | — | 778.82 MHz (per family datasheet) |
| Process Technology | — | 90 nm |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| 封裝 / 外殼 | — | 1020-BBGA (FC-FBGA), 33x33 mm |
| Supplier Device Package | — | 1020-FBGA (33x33) |
| 工作溫度 | — | 0C to +85C (commercial, 'C' speed grade) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |