EP2S30F672C4 vs EP2S30F672C3 比較

詳細並排比較 EP2S30F672C4 由 Intel 與 EP2S30F672C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2S30F672C4 EP2S30F672C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete Obsolete
Manufacturer Intel (formerly Altera) —
Series Stratix II Stratix II
Logic Elements / Cells 33,880 —
Total RAM Bits 1,369,728 1,369,728
Number of I/O 500 —
封裝 672-BBGA, FCBGA (27x27 mm) —
安裝類型 Surface Mount Surface Mount
Core Voltage - Supply 1.15 V to 1.25 V —
Process Technology 90 nm 90 nm CMOS
Maximum Core Frequency (datasheet benchmark) 711 MHz —
工作溫度 0C to +85C (commercial, 'C' speed grade) 0C to +85C (Commercial)
Embedded DSP Blocks 16 (Stratix II S30 tier) —
Number of PLLs [DATA_NEEDED: PLL count for S30 tier] —
Number of Global Clock Networks [DATA_NEEDED: global clock network count] —
RoHS 狀態 Compliant Non-compliant (leaded BGA)
Lead-Free Yes —
Number of Logic Elements — 33,880
Number of Adaptive Logic Modules (ALMs) — 13,560
Total Embedded Memory Bits — 1,369,728
Embedded Memory (M512 / M4K / M-RAM blocks) — M512, M4K, M-RAM TriMatrix
Number of User I/O — 500
Number of Transceivers — [DATA_NEEDED: depends on variant - up to 12]
DSP Blocks — Dedicated 18x18 multipliers
DSP Performance — Up to 156 GMACs
Voltage - Supply — 1.2 V core, multi-rail I/O
Speed Grade — -3
封裝 / 外殼 — 672-BBGA, FCBGA (FineLine BGA)
MSL 等級 — [DATA_NEEDED: MSL rating]

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