EP2S30F672C5N vs EP2S30F672C3 比較

詳細並排比較 EP2S30F672C5N 由 Intel 與 EP2S30F672C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2S30F672C5N EP2S30F672C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND Obsolete
Series Stratix II Stratix II
Family Name Stratix II —
Logic Elements 33,880 —
Embedded Memory (bits) 1,369,728 —
Logic Array Blocks (LABs) 1694 —
User I/O Count 500 —
封裝 672-ball FBGA (FineLine BGA) —
Speed Grade C5 (-5 commercial) -3
Process Technology 90 nm CMOS 90 nm CMOS
Supply Voltage (Core) [DATA_NEEDED: core VCC value] —
工作溫度範圍 Commercial (0C to +85C) —
Number of PLLs 4 —
Global Clock Networks 16 —
Configuration Method Serial / Passive Parallel / Fast Passive Parallel —
Lead-Free / RoHS Yes (N suffix) —
Architecture Adaptive Logic Module (ALM) —
DSP Blocks [DATA_NEEDED: DSP block count] Dedicated 18x18 multipliers
Multipliers [DATA_NEEDED: 18x18 multiplier count] —
Number of Logic Elements — 33,880
Number of Adaptive Logic Modules (ALMs) — 13,560
Total Embedded Memory Bits — 1,369,728
Embedded Memory (M512 / M4K / M-RAM blocks) — M512, M4K, M-RAM TriMatrix
Total RAM Bits — 1,369,728
Number of User I/O — 500
Number of Transceivers — [DATA_NEEDED: depends on variant - up to 12]
DSP Performance — Up to 156 GMACs
Voltage - Supply — 1.2 V core, multi-rail I/O
工作溫度 — 0C to +85C (Commercial)
封裝 / 外殼 — 672-BBGA, FCBGA (FineLine BGA)
安裝類型 — Surface Mount
RoHS 狀態 — Non-compliant (leaded BGA)
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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