EP2SGX30DF780I5N vs EP2SGX30DF780I7N 比較

詳細並排比較 EP2SGX30DF780I5N 由 Intel 與 EP2SGX30DF780I7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX30DF780I5N EP2SGX30DF780I7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix II GX Stratix II GX (Enhanced Configuration / EPC)
Logic Cells 33,880 (33,380 logic elements) —
Logic Array Blocks (LABs) 33,880 —
Process Technology 90 nm CMOS 90 nm
Core Voltage 1.2 V 1.2 V (typical)
Internal Clock Frequency (max) 622.08 MHz —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Number of Pins / Balls 780 —
Package Type FC-FBGA-780 (Flip-Chip Fine-pitch BGA) —
Package Size 29 x 29 mm, 1.0 mm pitch —
工作溫度 -40C to +85C (Industrial) -40C to +100C (Industrial)
安裝類型 Surface Mount Surface Mount (BGA)
Lead-Free / RoHS Lead Free (per Kynix listing) —
Speed Grade I5 7 (fastest commercial speed grade)
Temperature Grade Suffix Industrial —
Series — Stratix II GX
Logic Elements — 33,880 LEs
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Memory (bits) — 1,369,728 bits
Total RAM Blocks — M512/M4K/M-RAM TriMatrix
Embedded Multipliers — [DATA_NEEDED: 18x18 multiplier count]
Maximum User I/O — 586 user I/O pins
Multi-Gigabit Transceivers (MGTs) — Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps
MGT Protocols Supported — PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE
封裝 — 780-ball FineLine BGA
Configuration Mode — Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel
RoHS 狀態 — [DATA_NEEDED: RoHS compliance]
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]

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