EP3C80F780C7N vs EP3C55F780C7N 比較

詳細並排比較 EP3C80F780C7N 由 Intel 與 EP3C55F780C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C80F780C7N EP3C55F780C7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Cyclone III —
Family Name Cyclone III —
Number of Logic Elements 81,264 —
Number of Logic Cells / CLBs 81,264 —
Total RAM Bits 2,810,880 —
Number of I/O 429 —
Number of Gates [DATA_NEEDED: gates count] —
Voltage - Supply 1.15 V to 3.3 V (core and I/O banks) —
工作溫度 0C to +85C (commercial) 0C to +85C (commercial, C7 speed grade)
安裝類型 Surface Mount —
封裝 / 外殼 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch —
Supplier Device Package 780-FBGA —
Process Technology 65 nm CMOS (TSMC low-k) 65 nm low-power CMOS
Number of PLLs 4 —
Number of Multipliers (18x18) 288 —
Maximum Frequency 472.5 MHz —
Lead Free / RoHS Lead Free (per LCSC listing) —
Configuration Method JTAG, Serial, Parallel (via Quartus Prime / Quartus II) —
Family — Cyclone III
Logic Elements — 55,856
Embedded Memory — 2,396,160 bits (approximately 2.4 Mbit)
Embedded Memory Blocks — 312 M9K blocks
Embedded Multipliers — 156 (18 x 18)
User I/O Count — 377
PLLs — 4
Global Clock Networks — 20
Configuration Memory — 8 Kbits (supports PS, FPP, JTAG)
Core Voltage (VCCINT) — 1.2 V
I/O Bank Voltage (VCCIO) — 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank)
封裝 — 780-ball FineLine BGA
Speed Grade — 7
RoHS 狀態 — Compliant

資料表與資源

瀏覽所有產品 建立 BOM 索取報價