EP3SE260F1517C2G vs EP3SE260F1517C4LN 比較
詳細並排比較 EP3SE260F1517C2G 由 Intel 與 EP3SE260F1517C4LN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517C2G | EP3SE260F1517C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Family | Stratix III E | Stratix III E (Enhanced) |
| Logic Elements | 254,400 | 255,000 |
| Adaptive Logic Modules (ALMs) | 81,760 | — |
| Total Memory Bits | 16,727,680 (16.67 Mbit) | 16,672,768 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | 864 | — |
| Embedded Multipliers (18x18) | 768 | — |
| User I/O Pins | 976 | — |
| Transceiver Channels | 12 | — |
| Transceiver Data Rate (max) | 3.75 Gbps (C2 grade) | — |
| PLLs (Fractional + Clock Multiplier) | 8 fractional + 4 CMU | — |
| Global Clock Networks | 20 | — |
| 封裝 | 1517-ball FCBGA, 40x40 mm | — |
| Speed Grade | C2 (commercial, ~6 ns) | C4 |
| 工作溫度 | 0C to 85C (commercial, "C" suffix) | 0C to +85C (commercial grade per 'C' suffix) |
| Process Node | 40 nm TSMC | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | Yes (LN suffix) |
| Series | — | Stratix III E |
| Number of LABs/CLBs | — | 10,200 |
| Number of I/O | — | 976 |
| Number of Gates | — | [DATA_NEEDED: gate count not published in web data] |
| Voltage - Supply | — | 0.9 V to 1.1 V core |
| Operating Frequency | — | 375 MHz to 450 MHz (per family) |
| Process Technology | — | 65 nm |
| 封裝 / 外殼 | — | 1517-BBGA, FCBGA (FC-FBGA) |
| 安裝類型 | — | Surface Mount (flip-chip) |
| 濕度敏感等級 (MSL) | — | 3 (168 Hours) |
| Packaging | — | Tray |