EP3SE50F484C4 vs EP3SE50F484C2G 比較

詳細並排比較 EP3SE50F484C4 由 Intel 與 EP3SE50F484C2G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484C4 EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 - Stratix III E FPGA 47.5K LE | Intel

EP3SE50F484C4 ⚠ 最後購買機會
Intel
EP3SE50F484C2G EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel

EP3SE50F484C2G - Stratix III E FPGA 47.5K LE 484-FBGA | Intel

EP3SE50F484C2G ⚠ 最後購買機會

規格比較

參數 EP3SE50F484C4 EP3SE50F484C2G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 最後購買
Family Stratix III E —
Logic Elements 47,500 —
Embedded Memory 5,760 Kbits —
User I/Os 296 —
Logic Array Blocks (LABs) 1900 —
封裝 FBGA-484 (FCBGA) —
工作溫度 0C to 85 C (commercial) 0 °C to +85 °C (TJ)
Internal Frequency [DATA_NEEDED: internal max frequency] —
Transceivers [DATA_NEEDED: transceiver count and rate] Multi-gigabit transceivers (selected package pins)
DSP Blocks [DATA_NEEDED: 18x18 multiplier count] —
供應電壓 0.9 V —
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
MSL 等級 [DATA_NEEDED: MSL level] —
Series — Stratix III E
Number of Logic Elements / Cells — 47,500
Number of LABs / CLBs — 1,900
Total RAM Bits — 5,760,000 (5,760 Kbit)
Number of User I/O — 296
封裝 / 外殼 — 484-BBGA, FCBGA (FineLine BGA)
Core Voltage Supply — 0.86 V to 1.15 V
Process Technology — 40 nm TSMC low-power CMOS
Logic Element Architecture — Adaptive Logic Module (ALM) with 8-input fracturable LUT
Embedded DSP Blocks — Yes (variable-precision multipliers)
Memory Interface Support — DDR / DDR2 / DDR3 with hard PHY
Partial Reconfiguration — Supported
Configuration Interface — JTAG, Passive Serial, Fast Passive Parallel
Part Status — Active (Intel catalogue); long-term supply subject to Stratix III lifecycle policy

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