EP3SE50F780C3G vs EP3SE110F780C3 比較

詳細並排比較 EP3SE50F780C3G 由 Altera 與 EP3SE110F780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F780C3 EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel

EP3SE110F780C3 - Stratix III E FPGA 107.5K LE 780-FCBGA | Intel

EP3SE110F780C3 ⚠ 最後購買機會

規格比較

參數 EP3SE50F780C3G EP3SE110F780C3
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Series Stratix III E Stratix III E
Manufacturer Altera (now Intel) —
Family Stratix III E enhanced FPGA —
Number of Logic Elements (LE) 47,500 LE —
Number of Adaptive Logic Modules (ALM) 19,000 ALM —
Embedded Memory 5.49 Mbit (5,760,000 bit) —
Number of User I/O 488 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Core Supply Voltage 1.1 V —
工作溫度 0C to +85C (Commercial) [DATA_NEEDED: operating temperature range]
Speed Grade C3 C3
封裝 / 外殼 780-BBGA, FCBGA (Flip-Chip) —
安裝方式 SMD/SMT —
Packaging Tray —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
生命週期狀態 Not Recommended for New Designs (NRND) —
Configuration Memory External (EPCS / flash) —
Logic Elements — 107500
Logic Array Blocks (LABs) — 4300
Total Memory Bits — 8936448
User I/O Count — 488
封裝 — 780-BBGA, FCBGA
Number of Terminals — 780
Package Code — BGA
Package Shape — Square
Form of Terminal — Ball
Temperature Grade — Other (Commercial)
安裝類型 — Surface Mount

資料表與資源

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