EP3SE50F780C4L vs EP3SE50F780C4LG 比較

詳細並排比較 EP3SE50F780C4L 由 Intel 與 EP3SE50F780C4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C4L EP3SE50F780C4LG
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Series Stratix III E —
Family Stratix III Stratix III E (Enhanced)
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits 5.49 Mbit
User I/Os 488 488 I/O
DSP Blocks (18x18 multipliers) 304 (19x16) [DATA_NEEDED: DSP block count]
封裝 780-ball FCBGA (Flip-Chip BGA) 780-BBGA, FCBGA (FBGA-780, 1.0 mm pitch)
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) -4 (fastest commercial)
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
工作溫度 [DATA_NEEDED: full industrial/commercial grade] —
RoHS 狀態 Compliant (lead-free) —
Transceivers [DATA_NEEDED: per Stratix III E variant] [DATA_NEEDED: transceiver count and rate]
PLLs [DATA_NEEDED: PLL count] —
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Process Technology — 40 nm TSMC low-power CMOS
Operating Temperature (Commercial) — 0 C to +85 C
Core Voltage (VCCINT) — 0.9 V / 1.0 V / 1.1 V (programmable)
工作電源電壓 — 1.1 V (logic core nominal)
安裝類型 — Surface Mount (SMT)
Lead-Free Status — Pb-free (LG suffix)
濕度敏感等級 (MSL) — MSL 3 (per JEDEC J-STD-020)
RoHS Compliance — Compliant

資料表與資源

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