EP3SL50F484C2G vs EP3SL50F484C3 比較

詳細並排比較 EP3SL50F484C2G 由 Intel 與 EP3SL50F484C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL50F484C3 EP3SL50F484C3 - 47,500-Cell, 500MHz FPGA | Intel

EP3SL50F484C3 - 47,500-Cell, 500MHz FPGA | Intel

EP3SL50F484C3 ✓ 啟用中

規格比較

參數 EP3SL50F484C2G EP3SL50F484C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Stratix III L Stratix III L
Logic Elements 47,500 LE —
Adaptive Logic Modules (ALMs) 19,000 ALM —
Embedded Memory 2,184,192 bits (2.08 Mbit) —
Maximum User I/Os 296 I/O —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Operating Supply Voltage (Core) 1.1 V —
Maximum Operating Temperature +85 C —
Minimum Operating Temperature 0 C —
最大時脈頻率 600 MHz —
Process Technology 65 nm CMOS —
封裝 484-ball FCBGA (FBGA-484) 484-pin FC-FBGA
安裝方式 SMD/SMT —
Packaging Tray —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Total Transceivers [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Device Type — Field Programmable Gate Array (FPGA)
Logic Cells — 47,500 cells
Technology — 65 nm
Listed Frequency — 500 MHz
Internal Frequency — 800 MHz
供應電壓 — 1.1 V
Logic Array Blocks — 1,900 LABs
User I/O — 296 I/Os
腳位數 — 484 pins
Package Type — FBGA-484
工作溫度 — 0 °C to 85 °C
Device Category — Programmable logic IC
安裝類型 — Surface Mount
Manufacturer Technology Description — 65-nm low-power high-performance FPGA
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]
REACH Status — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Package Dimensions — [DATA_NEEDED: package dimensions]
Configuration Memory — [DATA_NEEDED: configuration memory size]
Embedded Transceivers — [DATA_NEEDED: embedded transceiver count]
Power Consumption — [DATA_NEEDED: power consumption]

資料表與資源

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