EP3SL50F780I4N vs EP3SL200H780I4N 比較

詳細並排比較 EP3SL50F780I4N 由 Intel 與 EP3SL200H780I4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL200H780I4N EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N - Stratix III L FPGA 200K LE 780-HBGA | Intel

EP3SL200H780I4N ⚠ 最後購買機會

規格比較

參數 EP3SL50F780I4N EP3SL200H780I4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 最後購買
Family Stratix III L Stratix III (Logic-rich variant)
Logic Elements 47,500 200,000
Total RAM Bits 2,184,192 —
User I/O Count 488 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Process Technology 65 nm TSMC 65 nm CMOS
Core Voltage 0.9 V 1.1 V (0.86 V to 1.15 V range)
Auxiliary / I/O Voltage 1.2 V / 3.3 V —
工作溫度 -40C to +100C (Industrial) —
Package Type 780-ball FC-FBGA (Flip-Chip) —
安裝類型 Surface Mount Surface Mount (BGA)
濕度敏感等級 (MSL) 3 (168 hours) —
RoHS 狀態 Compliant Compliant
Configuration Mode SRAM-based, Active Serial / JTAG —
腳位數 780 —
Lead-Free / Pb-Free Yes —
Series — Stratix III L
Logic Array Blocks (LABs) — 8,000
Embedded Memory (bits) — 10,901,504
User I/Os — 488
Fabric Frequency (typical) — 450 MHz
Speed Grade — I4
工作溫度範圍 — -40C to +100C (industrial)
封裝 — 780-ball FCBGA (Flip-Chip BGA, FineLine)
Lead-Free — Yes (suffix N)

資料表與資源

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