EP4CE6E22C7 vs EP4CE6E22C8L 比較
詳細並排比較 EP4CE6E22C7 由 Intel 與 EP4CE6E22C8L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CE6E22C7 | EP4CE6E22C8L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | Cyclone IV E | — |
| Family | Cyclone IV | Cyclone IV E |
| Core Architecture | Logic Elements (LE) | — |
| Number of Logic Elements (LEs) | 6,272 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Number of Configurable Logic Blocks (CLBs) | 392 | — |
| Total Embedded Memory Bits | 276,480 | — |
| Total RAM (Kbits) | 270 | — |
| Number of Embedded 18x18 Multipliers | 15 | — |
| Number of PLLs | 4 | — |
| User I/O Count | 91 | 91 |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI | — |
| Operating Supply Voltage (Core) | 1.0 V to 1.2 V (typ. 1.2 V) | — |
| Operating Supply Voltage (I/O) | 1.2 V to 3.3 V | — |
| Logic Speed Grade | C7 | — |
| Operating Temperature Range (Commercial) | 0°C to +85°C (junction) | — |
| 封裝 | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm (low-power) |
| RoHS 狀態 | Compliant | Compliant |
| Logic Elements (LE) | — | 6,272 |
| Embedded Memory (Bits) | — | 276,480 |
| Embedded Memory Blocks (M9K) | — | 30 |
| Embedded 18x18 Multipliers | — | 15 |
| General-purpose PLLs | — | 2 |
| User I/O Banks | — | 8 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 工作溫度範圍 | — | -40 C to +85 C (Industrial, 'L' suffix) |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Active Serial (EPCS) |
| Lead-free / Halogen-free | — | Yes / Yes |