EP4CE75F29C8L vs EP4CE75F29C6N 比較
詳細並排比較 EP4CE75F29C8L 由 Intel 與 EP4CE75F29C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CE75F29C8L | EP4CE75F29C6N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | 2810880 bit |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | C6 |
| 工作溫度 | 0C to 85C (commercial) | — |
| 封裝 | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-FBGA |
| Ball Count | 780 | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Product Family | — | Cyclone IV E |
| Logic Elements | — | 75408 |
| User I/O Count | — | 426 |
| Number of CLBs | — | 4713 |
| Maximum Frequency | — | 472.5 MHz |
| Package Code | — | F29 |
| Device Family Member | — | EP4CE75 |
| Ordering Part Number | — | EP4CE75F29C6N |
| Temperature Grade | — | [DATA_NEEDED: temperature grade] |
| Configuration Technology | — | SRAM-based FPGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |