EP4CGX22BF14I7N vs EP4CGX15CF23C7 比較
詳細並排比較 EP4CGX22BF14I7N 由 Intel 與 EP4CGX15CF23C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CGX22BF14I7N | EP4CGX15CF23C7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device | EP4CGX22 | — |
| Logic Elements (LE) | 21,280 | — |
| Logic Blocks | 47 (per digchip datasheet summary) | — |
| Embedded Memory Bits | 774,144 (594 Kbits) | — |
| Maximum User I/O Pins | 72 | — |
| Multipliers (18×18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLLs | 4 (general-purpose) | [DATA_NEEDED: PLL count] |
| Transceivers | 2 (up to 3.125 Gbps) | Up to 8 channels at 3.125 Gbps (package-dependent) |
| Core Voltage | 1.2 V | 1.2 V (VCCINT) |
| 工作溫度 | -40 °C to +100 °C (industrial, 'I7N' speed/temp grade) | 0C to +85C (Commercial, 'C' suffix) |
| 封裝 | 169-LBGA (FineLine BGA, F14, 14×14 mm, 1.0 mm pitch) | 484-pin FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Process Technology | 60 nm | 60 nm low-power CMOS with low-k dielectric |
| Configuration | SRAM, serial (AS) and parallel (AP) modes, JTAG | — |
| 安裝類型 | Surface Mount | Surface Mount, BGA |
| RoHS 狀態 | Compliant (per distributor listings) | Compliant |
| Logic Elements | — | 14,400 |
| Embedded Memory | — | 540 Kbits |
| Embedded 18x18 Multipliers | — | 0 (DSP blocks absent on this die, use fabric multipliers via IP) |
| Global Clock Networks | — | [DATA_NEEDED: clock network count] |
| Maximum User I/O | — | 72 |
| Speed Grade | — | 7 (medium-speed) |
| Configuration Modes | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG, Active Serial via EPCS |
| Memory Interfaces | — | DDR2, DDR3, LPDDR2, QDR II+ (via hard memory controllers) |
| PCIe Hard IP | — | 1 PCIe Gen1 x1/x2 endpoint (in transceiver-capable variants) |
| MSL 等級 | — | MSL3 (per JEDEC J-STD-020) |
| Programming Software | — | Intel Quartus II / Quartus Prime (subscription or free Lite edition) |