EP4SGX360KF43C2N vs EP4SGX360KF43C3N 比較

詳細並排比較 EP4SGX360KF43C2N 由 Intel 與 EP4SGX360KF43C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP4SGX360KF43C3N EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP

EP4SGX360KF43C3N - 353,600-Cell FPGA | Intel | DSP

EP4SGX360KF43C3N ✓ 啟用中

規格比較

參數 EP4SGX360KF43C2N EP4SGX360KF43C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Stratix IV GX Stratix IV GX
Series Stratix IV —
Logic Elements (LE) 353,600 —
Adaptive Logic Modules (ALMs) 14,144 —
Logic Cells 353,600 353600
Embedded Memory (bits) 23,105,536 —
User I/O Count 880 —
Core Voltage (Vcc) 0.9 V —
Process Node 40 nm —
Speed Grade C2 —
封裝 1760-ball FC-FBGA (KF43) 1760-ball FCBGA/BGA
Temperature Grade Industrial —
RoHS 狀態 Compliant —
安裝類型 Surface Mount (Flip-Chip BGA) —
MSL 等級 3 (per JEDEC J-STD-020, 168 hours) —
Product Type — Field Programmable Gate Array (FPGA)
Configurable Logic Blocks — 141440 CLBs
User I/O — 880 I/O
Embedded Memory — 23105536 bits
DSP Multiplier Configurations — 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit
Maximum DSP Multiplier Frequency — 600 MHz
Additional Distributor Frequency Figure — 717 MHz
Process Technology — CMOS
Terminal Form — Ball
Number of Terminals — 1760
Package Shape — Square
Package Code — BGA
Grading of Temperature — Other
Lead-Free — Lead free
RoHS Compliance — [DATA_NEEDED: RoHS compliance status]
工作溫度範圍 — [DATA_NEEDED: operating temperature range]

資料表與資源

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