EP4SGX530HH35C2 vs EP4SGX530HH35C4 比較

詳細並排比較 EP4SGX530HH35C2 由 Intel 與 EP4SGX530HH35C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP4SGX530HH35C2 EP4SGX530HH35C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Series Stratix IV GX Stratix IV GX
Family Stratix IV —
Logic Elements 531200 531,200
Configurable Logic Blocks (CLBs) 212480 —
Embedded Memory (bits) 28033024 28,033,024
Maximum User I/O 564 —
封裝 1152-BGA (FBGA-1152 / HBGA-1152) 1152-ball FCBGA / FBGA (42.5 x 42.5 mm)
安裝類型 Surface Mount Surface Mount (flip-chip BGA)
Process Technology 40 nm CMOS 40 nm
Operating Temperature Grade Commercial (C2 suffix) —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
MSL 等級 [DATA_NEEDED: MSL rating] MSL3 (per BGA package standard)
供應電壓 [DATA_NEEDED: core/IO voltage] —
Transceivers Up to 24 channels, up to 8.5 Gbps Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package]
Hard IP PCI Express Gen1/Gen2 —
Device Type — FPGA
Adaptive Logic Modules (ALMs) — 21,248 LABs / 212,480 equivalent LEs
Maximum User I/O Pins — 564
Core Supply Voltage — 0.9 V
Speed Grade — HH35
工作溫度 — 0 C to 85 C (Commercial, -C4 suffix)
DSP Blocks — [DATA_NEEDED: block count for this density]
PLLs — 8 fractional PLLs

資料表與資源

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