EPF10K100EFC256-2 vs EPF10K30EFC256-2N 比較
詳細並排比較 EPF10K100EFC256-2 由 Intel 與 EPF10K30EFC256-2N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K100EFC256-2 - FLEX 10KE FPGA, 100K Gates, 256-BGA | Intel / Altera
EPF10K100EFC256-2 NrndIntel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N Obsolete規格比較
| 參數 | EPF10K100EFC256-2 | EPF10K30EFC256-2N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 4,992 (49,152 user logic elements) | — |
| Number of LABs | 624 | — |
| User I/Os | 191 | 246 |
| Total RAM Bits | [DATA_NEEDED: total EAB RAM bits] | — |
| Number of Gates | 100,000 equivalent | — |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V | — |
| Logic Family | CMOS (SRAM-based) | — |
| Propagation Delay (per LUT) | ~0.6 ns (speed grade -2) | — |
| 封裝 | 256-FBGA (FineLine BGA, 17 x 17 mm) | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 工作溫度 | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) |
| Configuration Method | PS, JTAG, in-system programmable | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS, SRAM-based |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance] | — |
| Embedded Array Blocks | Yes (EAB for RAM/ROM/DSP) | — |
| Family | — | FLEX 10KE Embedded Programmable Logic Family |
| Typical Gates | — | 30,000 |
| Logic Elements (LEs) | — | 1,728 |
| Embedded RAM Bits | — | 24,576 |
| Embedded Array Blocks (EABs) | — | 6 |
| Logic Cells | — | 1728 |
| Propagation Delay | — | 0.6 ns (per digchip listing; internal frequency 80 MHz) |
| Number of Logic Elements | — | 24576 |
| 供應電壓 | — | [DATA_NEEDED: core and I/O rail voltages] |
| Configuration | — | Passive Serial / Active Serial / JTAG |
| Lead Free / RoHS | — | Non-RoHS (legacy, SnPb finish per FBGA-256 family) |
| Speed Grade | — | -2N (mid-grade, 0.6 ns) |