EPF10K200SBC356-2 vs EPF10K200SBC356-3 比較
詳細並排比較 EPF10K200SBC356-2 由 Altera 與 EPF10K200SBC356-3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF10K200SBC356-2 | EPF10K200SBC356-3 |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX 10KS | — |
| Family | FLEX 10KS (Embedded Programmable Logic) | FLEX 10K |
| Logic Elements / Cells | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory Bits (EAB) | 98304 | — |
| System Gates | 200,000 | — |
| User I/Os | 274 | 470 (package exposes 274 bonded-out) |
| Number of I/O Banks | 8 | — |
| Supply Voltage (Core) | 2.5 V (2.375 V - 2.625 V) | — |
| I/O Voltage (PCI-compatible) | 3.3 V / 5.0 V tolerant | — |
| Propagation Delay | 0.4 ns (per datasheet) | 0.4 ns |
| Process Technology | 0.22 um CMOS | 0.22 um CMOS, 4 metal layers |
| 工作溫度 | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Speed Grade | -2 | — |
| 封裝 | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) | PBGA-356 (35 x 35 mm, 1.27 mm pitch) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration | SRAM-based (volatile, requires configuration device) | — |
| Boundary Scan | Yes (JTAG IEEE 1149.1) | — |
| PLL | Yes (on-chip) | — |
| RoHS 狀態 | Non-compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Typical Gates | — | 200,000 |
| Logic Elements (Cells) | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total EAB RAM | — | 98,304 bits |
| Flip-Flops | — | 4,992 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| Internal Performance (fmax) | — | 250 MHz |
| Configuration Mode | — | Passive Serial / Passive Parallel / JTAG |
| MultiVolt I/O | — | 2.5 V / 3.3 V / 5.0 V |
| Logic Family | — | CMOS |