EPM2210GF324I5 vs EPM2210GF324C5N 比較
詳細並排比較 EPM2210GF324I5 由 Altera 與 EPM2210GF324C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Altera
EPM2210GF324I5 - 2210 LE MAX II CPLD, 212 I/O, FBGA-324 | Altera / Intel
EPM2210GF324I5 ✓ 啟用中規格比較
| 參數 | EPM2210GF324I5 | EPM2210GF324C5N |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX II | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Propagation Delay (tPD1, max) | 7 ns (industrial speed grade I5) | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| 工作溫度 | -40 °C to +100 °C (industrial grade, suffix I) | 0 °C to +85 °C (commercial) |
| 封裝 | FBGA-324 (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| 安裝類型 | Surface Mount | Surface Mount |
| Process Technology | 0.18 µm 6-layer-metal flash CMOS | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| RoHS 狀態 | Compliant (Pb-free) | Compliant |
| Series | — | MAX II |
| Logic Elements | — | 2210 |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Programmability | — | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | — | Yes |
| MSL 等級 | — | 3 |