EPM570F256C3N vs EPM570F256I5 比較
詳細並排比較 EPM570F256C3N 由 Intel 與 EPM570F256I5 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM570F256C3N | EPM570F256I5 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum Operating Frequency | 304 MHz | — |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | — |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 封裝 | 256-ball FBGA (FineLine BGA) | — |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | — |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) / ISP |
| 安裝類型 | Surface Mount | Surface Mount |
| MSL 等級 | [DATA_NEEDED: MSL level not stated in provided data] | — |
| RoHS 狀態 | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per suffix 'N' convention) | — |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Logic Elements (LE) | — | 570 |
| Maximum User I/O Pins | — | 160 |
| Number of LABs/CLBs | — | [DATA_NEEDED: number of LABs] |
| Package Type | — | 256-ball FineLine BGA (FBGA-256) |
| 工作溫度 | — | -40C to +85C (industrial) |
| Supply Voltage - Core | — | 3.3 V (also operates at 3.3V per part description) |
| I/O Standards Supported | — | LVTTL, LVCMOS, SSTL, PCI |
| MultiVolt I/O | — | 1.5V / 1.8V / 2.5V / 3.3V |
| In-System Programmability | — | Yes |
| Non-volatile Configuration | — | Yes (on-chip flash) |
| Pin-to-Pin Logic Delay (typ) | — | 5 ns to 7 ns |
| Maximum Internal Frequency | — | [DATA_NEEDED: fMAX MHz per speed grade] |
| Number of PLLs | — | [DATA_NEEDED: number of PLLs] |
| Width | — | 17 mm (per Partstack) |
| Speed Grade | — | I5 |