K3KL3L30CM-BGCT vs K3KL9L90CM-MGCT 比較
詳細並排比較 K3KL3L30CM-BGCT 由 Samsung Electronics 與 K3KL9L90CM-MGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
K3KL9L90CM-MGCT ✓ 啟用中規格比較
| 參數 | K3KL3L30CM-BGCT | K3KL9L90CM-MGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM (DRAM) |
| Density | 64 Gbit | — |
| 組織 | x64 | — |
| Speed Grade | LPDDR5X-7500 (7500 MT/s) | — |
| Technology | Stacked DRAM die, mobile BGA | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 封裝 | [DATA_NEEDED: exact package code and ball count] | FBGA-315 (BGA-315) |
| Core Voltage | [DATA_NEEDED: VDD core voltage] | — |
| I/O Voltage (VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Refresh | [DATA_NEEDED: refresh scheme] | — |
| Standards Compliance | JEDEC LPDDR5X specification | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant (per JLCPCB listing) |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Application Class | Mobile / embedded main memory | — |
| 記憶體容量 | — | 64 Gbit (8 GByte) |
| Memory Organization | — | x32 |
| Maximum Data Rate | — | 7500 Mbps |
| 介面 | — | LPDDR5X |
| Supply Voltages | — | 500 mV / 900 mV / 1.05 V / 1.8 V |
| VDDQ | — | 500 mV |
| Ball Pitch | — | 0.8 mm |
| Product Status | — | Active |
| Typical Applications | — | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
| Memory Standard | — | JEDEC LPDDR5X-class (JESD209-5B family) |
| CAS 延遲 | — | [DATA_NEEDED: CAS latency] |