K3KLALA0DM-JGCT vs K3KL9L90CM-MGCT 比較
詳細並排比較 K3KLALA0DM-JGCT 由 Samsung Electronics 與 K3KL9L90CM-MGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K3KLALA0DM-JGCT - LPDDR5X DRAM x32 | Samsung Semiconductor
K3KLALA0DM-JGCT ✓ 啟用中Samsung Electronics
K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
K3KL9L90CM-MGCT ✓ 啟用中規格比較
| 參數 | K3KLALA0DM-JGCT | K3KL9L90CM-MGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | Samsung Electronics | — |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM (DRAM) |
| 組織 | x32 | — |
| Product Status | Mass Production | Active |
| Family Max Data Rate | Up to 8.5 Gbps (LPDDR5X family) | — |
| Family Power Efficiency | Approx. 20% better than LPDDR5 | — |
| Family Max Density | Up to 64 GB (family) | — |
| Density | [DATA_NEEDED: density per die] | — |
| Data Rate (this speed grade) | [DATA_NEEDED: Mbps speed grade] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | — |
| Supply Voltage (VDDQ) | [DATA_NEEDED: VDDQ voltage] | — |
| Package Type | [DATA_NEEDED: FBGA ball count / package code] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| 安裝類型 | Surface Mount | Surface Mount |
| Standards Compliance | JEDEC LPDDR5X | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant (per JLCPCB listing) |
| 記憶體容量 | — | 64 Gbit (8 GByte) |
| Memory Organization | — | x32 |
| Maximum Data Rate | — | 7500 Mbps |
| 介面 | — | LPDDR5X |
| Supply Voltages | — | 500 mV / 900 mV / 1.05 V / 1.8 V |
| VDDQ | — | 500 mV |
| 封裝 | — | FBGA-315 (BGA-315) |
| Ball Pitch | — | 0.8 mm |
| Typical Applications | — | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
| Memory Standard | — | JEDEC LPDDR5X-class (JESD209-5B family) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |
| CAS 延遲 | — | [DATA_NEEDED: CAS latency] |