K3LK4K40CM-BGCP vs K3LKJKJ0CM-MFCP 比較
詳細並排比較 K3LK4K40CM-BGCP 由 Samsung Electronics 與 K3LKJKJ0CM-MFCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LK4K40CM-BGCP | K3LKJKJ0CM-MFCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Density | 96 Gb (12 GB) | 24 Gbit (3 GB) |
| 組織 | 1536M x 64 | [DATA_NEEDED: x-width organization] |
| 資料速率 | 6400 Mbps per pin | 6400 Mbps |
| Supply Voltage (VDD) | 1.05 V | — |
| 封裝 | 496-ball FBGA | 315-ball FBGA |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| 介面 | LPDDR5 (JEDEC) | — |
| 工作溫度 | [DATA_NEEDED: Operating Temperature] | — |
| Access Time / CAS Latency | [DATA_NEEDED: CAS Latency] | — |
| Refresh Scheme | Per-bank / all-bank refresh | — |
| Power-Down Modes | Deep sleep / power-down supported | — |
| Application Segment | Mobile, embedded, computing modules | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: rohs compliance statement] |
| Packaging | [DATA_NEEDED: standard packing quantity] | — |
| Manufacturer | — | Samsung Semiconductor, Inc. |
| Product Family | — | LPDDR5 (Low Power Double Data Rate 5) |
| Supply Voltage VDD2 | — | 1.8 V |
| Supply Voltage VDD1 | — | 1.05 V |
| Supply Voltage VDDQ | — | 0.9 V |
| Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| CAS 延遲 | — | [DATA_NEEDED: LPDDR5 RL/WL timings] |
| Refresh | — | [DATA_NEEDED: refresh scheme 8K/16K] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Operating Mode | — | Automotive-grade LPDDR5 (per Samsung automotive LPDDR5 listing) |